- Published: November 2025
- Pages: 345
- Tables: 101
- Figures: 27
The polymeric materials market for advanced electronic packaging has emerged as a critical enabler of next-generation semiconductor technologies, reaching >$1.5 billion in revenue in 2024 projected to grow at a compound annual growth rate (CAGR) of >13% to 2036. This rapid expansion reflects the semiconductor industry's fundamental shift toward advanced packaging architectures driven by the physical limitations of traditional transistor scaling and the insatiable demand for higher performance, greater functionality, and improved energy efficiency. The market's growth is propelled by several transformative semiconductor megatrends, including high-performance computing (HPC), generative AI, automotive ADAS systems, 5G/6G communications, AR/VR applications, and edge AI deployment. These applications demand packaging solutions that can accommodate larger dies, support chiplet integration, enable heterogeneous integration of diverse semiconductor technologies, and deliver superior thermal management—all requirements that place unprecedented demands on polymeric materials.
As transistor scaling reaches its physical limits, the industry has pivoted to advanced packaging as the primary path for continued performance improvements. This transition has elevated polymeric materials from simple encapsulation functions to sophisticated engineered materials that must simultaneously address mechanical stress management, electrical signal integrity, thermal dissipation, dimensional stability, and long-term reliability challenges.
The market encompasses four primary material categories: dielectric materials, mold compounds, underfills, and temporary bonding/debonding (TBDB) materials. Dielectric materials, including polyimides (PI), polybenzoxazole (PBO), benzocyclobutene (BCB), and epoxy-acrylic composites, serve as critical insulation layers in redistribution layer (RDL) structures, enabling fine-pitch interconnects with low electrical loss. Mold compounds provide mechanical protection and thermal management, with increasing emphasis on high thermal conductivity formulations for AI and HPC applications. Underfill materials—available as capillary underfills (CUF), molded underfills (MUF), non-conductive films (NCF), and non-conductive pastes (NCP)—mitigate thermomechanical stress between chips and substrates. TBDB materials enable wafer thinning and backside processing essential for 3D integration and through-silicon via (TSV) formation.
Mobile and consumer electronics currently dominate market volumes and revenues, but telecom and infrastructure segments are experiencing the fastest growth, driven by hyperscale data center buildouts supporting AI workloads. Among packaging platforms, System-in-Package (SiP) remains the largest consumer of polymeric materials, while 2.5D and 3D packaging represent the fastest-growing segments with CAGRs exceeding 28-35%, reflecting the industry's embrace of chiplet architectures and heterogeneous integration for advanced processors. The polymeric materials supply chain exhibits significant concentration. Geographic concentration is even more pronounced.
The industry faces critical technical challenges, particularly coefficient of thermal expansion (CTE) mismatch between polymers and silicon, which drives warpage and reliability concerns in large, thin packages. Since polymers expand significantly more than silicon under thermal cycling, material developers are pursuing application-specific formulations that balance competing requirements: low CTE, high thermal conductivity, low dielectric constant, superior adhesion, fine-pitch patterning capability, and increasingly, PFAS-free compositions to meet evolving environmental regulations. The convergence of AI-driven computing demands, regulatory pressures for sustainable materials, and the technical complexity of 3D heterogeneous integration positions polymeric materials as indispensable enablers of semiconductor innovation through 2036 and beyond.
The Global Market for Polymeric Materials for Advanced Electronic Packaging 2026-2036 delivers in-depth analysis of the polymeric materials ecosystem, encompassing dielectric materials, molding compounds, underfill materials, and temporary bonding/debonding (TBDB) solutions that enable next-generation semiconductor packaging technologies.
As Moore's Law approaches physical limitations, the semiconductor industry has pivoted toward advanced packaging architectures including System-in-Package (SiP), Fan-Out Wafer Level Packaging (FOWLP), 2.5D packaging, 3D packaging, and chiplet integration. These sophisticated packaging platforms demand increasingly specialized polymeric materials capable of meeting stringent requirements for thermal management, electrical performance, mechanical reliability, and dimensional stability. This report provides essential intelligence for materials suppliers, packaging manufacturers, semiconductor fabs, OSAT providers, equipment manufacturers, and strategic investors seeking to capitalize on this high-growth market opportunity.
The report delivers comprehensive market forecasts segmented by material category (dielectric, mold compound, underfill, TBDB), packaging platform (SiP, FOWLP, 2.5D, 3D, embedded die), end-market application (mobile & consumer electronics, HPC & AI, automotive & ADAS, telecom & infrastructure, IoT & edge computing, AR/VR), and geographic region spanning the decade from 2026 through 2036. Detailed revenue and volume projections enable stakeholders to identify the fastest-growing market segments, with particular emphasis on the explosive growth anticipated in 2.5D/3D packaging driven by artificial intelligence, high-performance computing, and generative AI applications.
Technology analysis examines the evolution of material chemistries including polyimides (PI), polybenzoxazole (PBO), benzocyclobutene (BCB), epoxy-based systems, and acrylic resin composites, evaluating critical performance parameters such as coefficient of thermal expansion (CTE), dielectric constant (Dk), dissipation factor (Df), glass transition temperature (Tg), thermal conductivity, and moisture absorption. The report explores emerging innovations in panel-level packaging, co-packaged optics (CPO), sustainable bio-based polymers, and AI-driven material design optimization.
Supply chain intelligence reveals the competitive landscape dominated by Japanese suppliers commanding approximately 80% market share, with detailed profiles of over 90 companies including material suppliers, packaging service providers, semiconductor manufacturers, and equipment vendors. Market share analysis identifies the top players across each material category, highlighting strategic positioning, technological capabilities, geographic presence, and competitive advantages. The report examines critical industry trends including PFAS-free material development, carbon emission reduction initiatives, recycled material integration, and regulatory compliance requirements.
Technical challenges and solutions address the industry's most pressing concerns: CTE mismatch and warpage control in large packages, moisture sensitivity and long-term reliability, high-temperature performance for automotive applications, fine-pitch interconnect capability for advanced nodes, process integration complexity, and cost optimization strategies. Technology roadmaps project material evolution through 2036, identifying innovation opportunities and potential disruptive technologies.
Report Contents include:
- Market Analysis & Forecasts
- Executive summary with context, market overview, and key drivers (2026-2036)
- Global market size and growth projections with 13% CAGR analysis
- Market forecasts by material category: dielectrics, mold compounds, underfills, TBDB materials
- Market segmentation by end-market: Mobile/Consumer, HPC/AI, Automotive/ADAS, Telecom, IoT, AR/VR
- Market analysis by packaging platform: SiP, FOWLP, 2.5D, 3D, Embedded Die
- 2.5D/3D packaging growth trajectory showing 28-35% CAGR
- Regional market distribution across Asia, Americas, and Europe
- Price trend analysis and volume forecasts through 2036
- Material Technology Deep Dives
- Dielectric materials: PI, PBO, BCB, epoxy-based, acrylic composites with suppliers and specifications
- Molding compounds: EMC, MUF, liquid molding with thermal conductivity roadmaps
- Underfill materials: CUF, MUF, NCF, NCP with fine-pitch and hybrid bonding capabilities
- Temporary bonding/debonding: thermal slide, laser, chemical, mechanical, UV-release technologies
- Material property comparisons: CTE, Dk, Df, Tg, thermal conductivity, moisture absorption
- Deposition processes: spin-on, spray coating, lamination, compression molding, transfer molding
- Advanced lithography capabilities and fine-pitch patterning (sub-2μm resolution)
- Supply Chain & Competitive Intelligence
- Polymeric materials ecosystem map with 50+ suppliers by category
- Top 20 supplier rankings with market share analysis (2024-2036)
- Geographic concentration analysis
- Vertical integration analysis and manufacturing capacity assessments
- Emerging Technologies & Applications
- Panel-level packaging material requirements and cost benefits (510mm-600mm panels)
- Co-packaged optics (CPO) with low-loss polymers for optical waveguides
- Chiplet integration and heterogeneous integration material challenges
- Advanced thermal management materials for AI/HPC applications
- Sustainable and bio-based polymeric materials development
- AI-driven material design and optimization methodologies
- Next-generation material innovations and technology readiness levels
- Regulatory & Technical Challenges
- PFAS-free material requirements and compliance timeline
- CO₂ emission standards and sustainability initiatives
- Recycled material integration strategies
- Safety Data Sheet (SDS) compliance requirements
- CTE mismatch and warpage control solutions for large packages
- Moisture sensitivity and reliability standards (MSL ratings)
- High-temperature performance requirements (>260°C) for automotive
- Fine-pitch interconnect technology roadmap (bump pitch evolution)
- Material characterization and industry standardization initiatives
- Process integration challenges and cost optimization strategies
- Company Profiles (91 Companies)
- Detailed profiles of material suppliers, OSAT providers, semiconductor manufacturers
- Product portfolios, technological capabilities, and market positioning
- Geographic presence and manufacturing facilities
- Strategic initiatives, R&D investments, and recent developments
- Contact information and corporate structure
This comprehensive report includes detailed profiles of 91 leading companies active in the polymeric materials ecosystem for advanced electronic packaging: 3M, AEMC, AI Technology, Ajinomoto, AMD, Amkor Technology, AOI Electronics, Applied Materials, Asahi Kasei, ASE, Brewer Science, Caplinq, Chang Chun Group, Chang Wah Electromaterials, CXMT, Darbond, Deca Technologies, DELO, Dupont, Empower Materials, Epoxy Technology, Eternal Materials, Everlight Chemical, Fujifilm, GlobalFoundries, HD Microsystems, Henkel, Huahai Chengke, Hysol, IBM, Imec, Innolux, Intel, JCET, JSR, Kayaku Advanced Materials, KCC, Kyocera, MacDermid Alpha, Manz, MASTERBOND, Merck, Micro Materials, Micron, Mingkun Technologies, Minseoa, Mitsubishi Gas Chemical, Mitsui Chemicals, Murata, Nagase ChemteX, Namics and more. These profiles encompass the complete value chain from raw material suppliers and specialty chemical manufacturers to advanced packaging service providers, leading semiconductor fabs, and equipment manufacturers driving innovation in polymeric materials for next-generation electronic packaging applications.
1 EXECUTIVE SUMMARY 18
- 1.1 Context and Market Overview 18
- 1.2 Advanced Packaging Market Trends 19
- 1.3 Key Market Drivers 20
- 1.4 Market Forecast Summary 21
- 1.5 Competitive Landscape Overview 22
2 INTRODUCTION 26
- 2.1 Report Objectives 26
- 2.2 Scope of the Report 27
- 2.3 Methodologies and Definitions 28
3 POLYMERIC MATERIALS IN ADVANCED PACKAGING 32
- 3.1 Definition of Polymeric Materials 32
- 3.2 Polymeric Materials Categories in Advanced Packaging 33
- 3.3 Role of Polymers in Next-Generation Packaging 34
- 3.4 Overview of Materials Technology Trends 35
- 3.5 Material Requirements Evolution 37
- 3.6 Challenges of Soft Materials in Advanced Packaging 39
4 GLOBAL MARKET FORECAST 42
- 4.1 Global Market Size and Growth Projections (2026-2036) 43
- 4.2 Polymeric Materials Revenue by Material Category 44
- 4.3 2024 Market Share by Material and Package Types 45
- 4.4 Polymeric Materials Revenue and Volume Forecast 46
- 4.5 Market Forecast by End-Market 47
- 4.5.1 Mobile & Consumer Electronics 47
- 4.5.2 High-Performance Computing (HPC) and AI 48
- 4.5.3 Automotive and ADAS 49
- 4.5.4 Telecom and Infrastructure 50
- 4.5.5 IoT and Edge Computing 51
- 4.5.6 AR/VR Applications 52
- 4.6 Market Forecast by Packaging Platform 52
- 4.6.1 System-in-Package (SiP) 52
- 4.6.2 Fan-Out Wafer Level Packaging (FOWLP) 53
- 4.6.3 2.5D Packaging 54
- 4.6.4 3D Packaging and Chiplet Integration 55
- 4.6.5 Embedded Die Packaging 56
- 4.7 2.5D/3D Packaging Growth 57
- 4.8 Regional Market Analysis 59
- 4.9 Market Trends and Opportunities 60
5 POLYMERIC MATERIALS SUPPLY CHAIN FOR ADVANCED PACKAGING 73
- 5.1 Advanced Packaging Supply Chain Overview 73
- 5.2 Overview of Material Suppliers by Material Category 74
- 5.3 Supply Chain Analysis and Dynamics 76
- 5.4 Regulations for Polymeric Materials 77
- 5.4.1 PFAS-Free Requirements 78
- 5.4.2 CO₂ Emission Standards 78
- 5.4.3 Recycled Material Integration 79
- 5.4.4 Safety Data Sheet Compliance 80
- 5.4.5 AI Implementation in Material Development 81
6 DIRECT MATERIALS-DIELECTRIC MATERIALS 83
- 6.1 Definition and Overview of Dielectric Materials 83
- 6.2 Application of Dielectric Materials in Advanced Packaging 84
- 6.3 Polymeric Dielectric Material Market Trends 85
- 6.4 Material Segmentation and Deposition Processes 86
- 6.4.1 Polyimides (PI) 86
- 6.4.2 Polybenzoxazole (PBO) 87
- 6.4.3 Benzocyclobutene (BCB) 88
- 6.4.4 Epoxy-Based Dielectrics 89
- 6.4.5 Acrylic Resin Composites 90
- 6.5 Dielectric Material Requirements for Advanced Packaging 91
- 6.5.1 Electrical Properties (Low Dk, Low Df) 92
- 6.5.2 Thermal Stability 92
- 6.5.3 Mechanical Properties 93
- 6.5.4 CTE Control and Warpage Management 94
- 6.5.5 Adhesion and Patternability 95
- 6.6 Comparison Between Different Material Types 96
- 6.7 Panel Level Packaging Material Trends 97
- 6.8 Advanced Lithography and Fine Pitch Capabilities 98
- 6.9 Dielectric Material Suppliers by Material Type 99
- 6.10 Technology Roadmap for Dielectric Materials 100
- 6.11 Dielectric Material Market Forecast (2026-2036) 101
7 DIRECT MATERIALS– MOLDING COMPOUNDS 118
- 7.1 Definition and Overview of Mold Compound Materials 119
- 7.2 Application of Mold Compounds in Advanced Packaging 119
- 7.3 Epoxy Mold Compound (EMC) Technology 120
- 7.4 Molded Underfill (MUF) vs. Traditional EMC 121
- 7.5 Material Segmentation and Deposition Processes 122
- 7.5.1 Compression Molding 122
- 7.5.2 Transfer Molding 123
- 7.5.3 Liquid Molding 124
- 7.6 Mold Compound Requirements for Advanced Packaging 125
- 7.6.1 Low Warpage and CTE Control 126
- 7.6.2 High Thermal Conductivity 126
- 7.6.3 Low Moisture Absorption 127
- 7.6.4 Filler Size and Content Optimization 129
- 7.6.5 High Reliability and Mechanical Strength 129
- 7.7 Mold Compound Processing Challenges 130
- 7.7.1 Large Package Size Handling 130
- 7.7.2 Thin Profile Requirements 131
- 7.7.3 High-Temperature Applications 132
- 7.8 Innovations in Thermoplastic Polymers 133
- 7.9 Mold Compound Suppliers by Material Type 135
- 7.10 Technology Roadmap for Mold Compounds 136
- 7.11 Mold Compound Market Forecast (2026-2036) 137
8 DIRECT MATERIALS – UNDERFILL MATERIALS 154
- 8.1 Definition and Overview of Underfill Materials 154
- 8.2 Application of Underfill in Advanced Packaging 155
- 8.3 Material Segmentation and Processing 157
- 8.3.1 Capillary Underfill (CUF) 158
- 8.3.2 Molded Underfill (MUF) 158
- 8.3.3 Non-Conductive Film (NCF) 159
- 8.3.4 Non-Conductive Paste (NCP) 160
- 8.4 Underfill Requirements for Advanced Packaging 161
- 8.4.1 Flow Characteristics and Void Control 162
- 8.4.2 CTE Matching and Stress Management 162
- 8.4.3 Fast Cure and High Throughput 163
- 8.4.4 Thermal and Electrical Performance 164
- 8.4.5 Reworkability Considerations 165
- 8.5 Fine Pitch and Micro-Bump Applications 166
- 8.6 Hybrid Bonding Compatible Underfills 167
- 8.7 Underfill Suppliers by Material Type 168
- 8.8 Technology Roadmap for Underfill Materials 169
- 8.9 Underfill Material Market Forecast (2026-2036) 170
9 INDIRECT MATERIALS – TEMPORARY BONDING/DEBONDING 182
- 9.1 Definition and Overview of TBDB Materials 182
- 9.2 Application of TBDB in Advanced Packaging 183
- 9.3 Material Segmentation and Application Formats 184
- 9.3.1 Adhesive-Based TBDB 184
- 9.3.2 Polymer-Based TBDB 185
- 9.3.3 Film-Based TBDB 186
- 9.4 Debonding Technologies and Process Flow 187
- 9.4.1 Thermal Slide Debonding 187
- 9.4.2 Laser Debonding 188
- 9.4.3 Chemical Debonding 189
- 9.4.4 Mechanical Debonding 190
- 9.4.5 UV-Release Technology 191
- 9.5 TBDB Material Requirements and Technology Trends 192
- 9.5.1 Bond Strength and Thermal Stability 192
- 9.5.2 Clean Debonding with Minimal Residue 193
- 9.5.3 Carrier Wafer Compatibility 193
- 9.5.4 Through-Silicon Via (TSV) Processing 194
- 9.6 Wafer Thinning and Ultra-Thin Wafer Handling 195
- 9.7 Panel Level Packaging TBDB Solutions 196
- 9.8 TBDB Material Suppliers by Technology 197
- 9.9 Technology Roadmap for TBDB Materials 198
- 9.10 TBDB Material Market Forecast (2026-2036) 199
10 EMERGING MATERIALS AND APPLICATIONS 214
- 10.1 Polymeric Materials in Panel-Level Packaging 214
- 10.1.1 Panel Size Scaling Challenges 214
- 10.1.2 Material Requirements for Large Panels 215
- 10.1.3 Cost Benefits and Manufacturing Efficiency 216
- 10.2 Polymeric Materials in Co-Packaged Optics (CPO) 217
- 10.2.1 Optical Material Requirements 217
- 10.2.2 Low-Loss Polymers for Waveguides 218
- 10.2.3 Integration with Silicon Photonics 219
- 10.3 Polymers for Chiplet Integration and Heterogeneous Integration 220
- 10.4 Advanced Thermal Management Materials 221
- 10.5 Sustainable and Bio-Based Polymeric Materials 222
- 10.6 Next-Generation Material Innovations 223
- 10.7 AI-Driven Material Design and Optimization 224
11 TECHNOLOGY CHALLENES AND FUTURE OUTLOOK 236
- 11.1 Key Technical Challenges 236
- 11.1.1 CTE Mismatch and Warpage Control 236
- 11.1.2 Moisture Sensitivity and Reliability 237
- 11.1.3 High-Temperature Performance 238
- 11.1.4 Fine Pitch and High-Density Interconnects 239
- 11.2 Material Characterization and Standardization 240
- 11.3 Process Integration Challenges 241
- 11.4 Cost and Supply Chain Considerations 243
- 11.5 Environmental and Regulatory Compliance 244
- 11.6 Future Trends and Opportunities 244
- 11.6.1 AI and HPC Driving Demand 244
- 11.6.2 5G/6G Communications Impact 245
- 11.6.3 Automotive Electronics Growth 246
- 11.7 Technology Roadmap 2026-2036 248
12 COMPANY PROFILES 256 (91 company profiles)
13 REFERENCES 343
List of Tables
- Table 1. Advanced Packaging Market Trends. 19
- Table 2. Market Size Overview - Polymeric Materials for Advanced Packaging (2024, 2030, 2036) 22
- Table 3. CAGR by Material Category (2024-2036) 23
- Table 4. Report Scope - Included vs. Excluded Applications 29
- Table 5. Glossary of Key Terms and Abbreviations 30
- Table 6. Material Categories and Subcategories Covered 31
- Table 7. Polymeric Materials Categories in Advanced Packaging. 33
- Table 8. Polymeric Materials Classification by Function 39
- Table 9. Key Material Properties Comparison (CTE, Dk, Df, Tg, Thermal Conductivity) 39
- Table 10. Material Requirements by Packaging Platform 39
- Table 11. Evolution of Material Performance Requirements (2020 vs 2024 vs 2030) 39
- Table 12. Polymeric Materials Requirements in Advanced Packaging 40
- Table 13. Global Polymeric Materials Market Size by Material Type (2024-2036) - Revenue ($M) 61
- Table 14. Global Polymeric Materials Market Size by Material Type (2024-2036) - Volume (Metric Tons) 61
- Table 15. Market Share by Material Category (2024, 2030, 2036) - % 62
- Table 16. Market Forecast by End-Market (2024-2036) - Revenue ($M) 62
- Table 17. Market Forecast by End-Market (2024-2036) - Volume (Metric Tons) 63
- Table 18. Market Share by End-Market (2024, 2030, 2036) - % 63
- Table 19. Market Forecast by Packaging Platform (2024-2036) - Revenue ($M) 63
- Table 20. Market Forecast by Packaging Platform (2024-2036) - Volume (Metric Tons) 64
- Table 21. CAGR Analysis by Packaging Platform (2024-2030, 2030-2036) 64
- Table 22. 2.5D/3D Packaging Growth Metrics and Drivers 65
- Table 23. Regional Market Distribution (2024) - Asia, Americas, Europe 67
- Table 24. Price Trends by Material Category (2024-2036) - $/kg 68
- Table 25. PFAS Regulations Impact Timeline and Compliance Status 78
- Table 26. Polymeric Dielectric Material Market Trends. 86
- Table 27. Dielectric Material Types and Chemical Families 102
- Table 28. Dielectric Constant (Dk) and Dissipation Factor (Df) by Material Type 102
- Table 29. Dielectric Materials Performance Comparison Matrix 103
- Table 30. Application Requirements by Packaging Type 104
- Table 31. Deposition Methods Comparison (Spin-on, Spray, Lamination) 105
- Table 32. Polyimide (PI) Types and Suppliers 106
- Table 33. PBO Materials and Suppliers 107
- Table 34. BCB Materials and Suppliers 108
- Table 35. Photosensitive vs. Non-photosensitive Dielectrics Comparison 109
- Table 36. Panel Level Packaging Dielectric Requirements 110
- Table 37. Lithography Capability by Material Type (Resolution, Line/Space) 111
- Table 38. Dielectric Market Forecast by Material Type (2024-2036) - Revenue ($M) 112
- Table 39. Dielectric Market Forecast by Application (2024-2036) 113
- Table 40. Price Analysis by Dielectric Type ($/kg) 114
- Table 41. Dielectric Constant vs Frequency by Material Type 115
- Table 42. Panel Level Packaging Dielectric Challenges 118
- Table 43. Mold Compound Classification (EMC, MUF, Liquid MC) 137
- Table 44. EMC vs MUF Performance Comparison 138
- Table 45. Filler Types and Properties (SiO2, Al2O3, AlN, BN) 138
- Table 46. Filler Size and Content by Application 139
- Table 47. Thermal Conductivity Requirements by Package Type 141
- Table 48. CTE Values by Mold Compound Type 142
- Table 49. Molding Process Comparison (Compression, Transfer, Liquid) 143
- Table 50. Mold Compound Requirements for HPC/AI Packages 144
- Table 51. Warpage Control Strategies and Material Solutions 144
- Table 52. Thermoplastic vs. Thermoset Molding Compounds 146
- Table 53. Mold Compound Market Forecast by Type (2024-2036) - Revenue ($M) 147
- Table 54. Mold Compound Market Forecast by Application (2024-2036) 147
- Table 55. Price Trends by Mold Compound Type ($/kg) 150
- Table 56. High Thermal Conductivity Mold Compounds Roadmap 151
- Table 57. Underfill Types Classification and Applications 171
- Table 58. CUF vs MUF vs NCF vs NCP Comparison Matrix 172
- Table 59. Viscosity and Flow Characteristics by Underfill Type 173
- Table 60. Cure Time and Temperature Requirements 174
- Table 61. CTE Matching Analysis by Package Type 174
- Table 62. Fine Pitch Capability by Underfill Type (Minimum Pitch) 175
- Table 63. Hybrid Bonding Compatible Underfill Materials 176
- Table 64. Reworkability Comparison 176
- Table 65. Underfill Market Forecast by Type (2024-2036) - Revenue ($M) 177
- Table 66. Underfill Market Forecast by Application (2024-2036) 178
- Table 67. Underfill Supplier Market Share (2024, 2027, 2030, 2036) 178
- Table 68. Price Analysis by Underfill Type ($/kg or $/unit) 179
- Table 69. No-Flow Underfill (NFU) Technology Evolution 180
- Table 70. Underfill Application Methods Comparison 180
- Table 71. TBDB Technology Classification 199
- Table 72. Debonding Method Comparison (Thermal, Laser, Chemical, Mechanical, UV) 200
- Table 73. Carrier Wafer Compatibility Matrix 204
- Table 74. Bond Strength Requirements by Application 205
- Table 75. Thermal Budget Comparison by TBDB Technology 205
- Table 76. Residue and Contamination Levels Post-Debonding 206
- Table 77. TSV Processing Compatibility 206
- Table 78. Wafer Thickness Capability (Minimum Thickness Supported) 207
- Table 79. Panel Level TBDB Solutions Comparison 208
- Table 80. TBDB Market Forecast by Technology Type (2024-2036) - Revenue ($M) 209
- Table 81. TBDB Market Forecast by Application (2024-2036) 210
- Table 82. TBDB Supplier Market Share (2024, 2027, 2030, 2036) 211
- Table 83. Cost per Wafer/Panel Analysis by TBDB Method 212
- Table 84. Throughput Comparison by Debonding Technology 213
- Table 85. Panel Level Packaging Material Requirements vs. Wafer Level 224
- Table 86. Panel Size Roadmap and Material Implications 225
- Table 87. CPO Material Requirements for Optical Applications 226
- Table 88. Low-Loss Polymer Properties for Waveguides 227
- Table 89. Chiplet Integration Material Challenges 228
- Table 90. Thermal Interface Materials Comparison 228
- Table 91. Bio-based and Sustainable Polymer Alternatives 229
- Table 92. Emerging Material Technologies Readiness Level 230
- Table 93. Key Technical Challenges Summary 248
- Table 94. CTE Mismatch by Material-Substrate Combination 249
- Table 95. Moisture Sensitivity Levels (MSL) Requirements 250
- Table 96. High-Temperature Performance Requirements (>260°C) 250
- Table 97. Fine Pitch Technology Roadmap (Bump Pitch Evolution) 251
- Table 98. Industry Standardization Initiatives 252
- Table 99. Cost Structure Analysis by Material Type 253
- Table 100. Environmental Regulations Impact Assessment 254
- Table 101. Polymeric Materials Ecosystem for Advanced Packaging - Companies by Category 256
List of Figures
- Figure 1. Polymer-based materials used in advanced packaging. (a) Overmolded flip chip package. (b) Lidded flip chip package. 18
- Figure 2. Polymeric Materials Market (2024-2036) 23
- Figure 3. Market Share by Material Category (2024). 24
- Figure 4. CAGR by End-Market Segment. 25
- Figure 5. Polymeric Materials Ecosystem for Advanced Packaging 39
- Figure 6. Cross-section of Advanced Package Showing Material Locations 40
- Figure 7. Semiconductor Packaging Evolution Timeline 41
- Figure 8. 2024-2030 Polymeric Materials Revenue for Advanced Packaging 68
- Figure 9. Market Forecast by Material Type (2024-2036) 69
- Figure 10. Market Forecast by End-Market (2024-2036) 69
- Figure 11. Market Forecast by Packaging Platform (2024-2036) 70
- Figure 12. 2.5D/3D Packaging Growth Trajectory 71
- Figure 13. Figure 4.6: HPC/AI Impact on Material Demand 72
- Figure 14. Regional Market Share Evolution (2024 vs 2036) 73
- Figure 15. Advanced Packaging Value Chain Overview 82
- Figure 16. Dielectric Material Application in RDL Structures 114
- Figure 17. Spin-on Dielectric Process Flow 116
- Figure 18. Lithography Resolution Roadmap for Dielectrics 117
- Figure 19. Molding Compound Application in Package Cross-section 152
- Figure 20. Compression Molding Process Schematic 153
- Figure 21. Hybrid Bonding with Underfill 181
- Figure 22. Laser Debonding System Schematic 213
- Figure 23. Panel Level Packaging Process Flow 231
- Figure 24. Panel Size Roadmap (300mm wafer → 510mm → 600mm panels) 232
- Figure 25. Co-Packaged Optics (CPO) Architecture 233
- Figure 26. Chiplet Integration Material Challenges Map 234
- Figure 27. Bio-based Polymer Development Timeline 235
Purchasers will receive the following:
- PDF report download/by email.
- Comprehensive Excel spreadsheet of all data.
- Mid-year Update
