cover
- Published: September 2025
- Pages: 275
- Tables: 42
- Figures: 17
The glass substrate for semiconductors market represents one of the most significant material shifts in the packaging industry in decades, driven by the escalating demands of AI, high-performance computing (HPC), and advanced networking applications. This emerging market is transitioning glass from a background consumable to the core substrate material enabling next-generation chip architectures. The market is experiencing unexpected acceleration, with commercialization timelines moving ahead of initial projections. Recent industry events have highlighted the competitive intensity, particularly following speculation about potential partnerships between major players. SKC's stock price surged 44.4% in early 2025 after comments suggesting advanced negotiations with leading AI chip manufacturers, signaling investor confidence in near-term commercialization prospects. The momentum reflects growing recognition that glass substrates can deliver up to 40% speed improvements while reducing power consumption by half compared to conventional organic substrates.
The surge in AI accelerators and HPC devices has created unprecedented demands for bandwidth density and power delivery that traditional organic substrates simply cannot support. Modern training accelerators require thousands of high-speed I/O bumps and power-delivery networks handling hundreds of amps with minimal noise. Glass substrates address these challenges through superior dimensional stability, ultra-low warpage, and the ability to support sub-2-micron interconnects with exceptional signal integrity. Glass substrates excel in heat and warpage resistance while enabling higher chip stacking densities on single substrates. The smoother surface allows ultra-fine circuit patterns, making them ideal for applications spanning carrier glass, IC substrates, interposers for multi-die packages, RF-MEMS applications, and photonic integration. Major semiconductor companies including Intel, AMD, and Broadcom have announced adoption plans for their next-generation chips.
Glass substrates offer compelling advantages over existing materials. Their coefficient of thermal expansion (CTE) matches silicon (3-7 ppm/°C), dramatically reducing thermomechanical stress in advanced packages. The dielectric constant is significantly lower than silicon (2.8 vs. 12), enabling superior high-frequency performance with orders of magnitude lower transmission losses. Manufacturing infrastructure is rapidly developing. Through-glass via (TGV) formation represents the core enabling technology, with multiple approaches including laser-induced deep etching (LIDE), direct laser drilling, and photosensitive glass processing. Leading equipment suppliers like LPKF, Canon, and Yield Engineering Systems are developing production-ready tools.
The glass substrate market emergence coincides with the industry's shift toward advanced packaging methodologies including chiplets, 2.5D/3D-IC integration, and heterogeneous system architectures. While organic substrates will continue serving mainstream applications, the accelerating timeline for glass commercialization suggests the high-performance segment transition may occur faster than initially anticipated. Success depends on continued yield improvements, cost reduction through scale, and ecosystem maturation. With AI/HPC growth driving performance requirements beyond organic substrate capabilities, glass substrates represent the critical enabler for continued semiconductor advancement, with commercial deployment potentially beginning as early as 2025-2026.
The Global Glass Substrate for Semiconductors Market 2026-2036 provides critical insights for semiconductor manufacturers, substrate suppliers, equipment providers, and technology investors navigating this revolutionary transition. The report delivers comprehensive coverage across seven critical application segments: carrier and support glass, blank drilled core panels, finished IC substrates for single-die usage, finished interposers for multi-die packages, glass integrated passive devices (IPD), RF-MEMS applications, and photonic integration tiles. Each segment analysis includes detailed market forecasts, technology requirements, competitive positioning, and growth drivers specific to AI accelerators, data center infrastructure, 5G/6G communications, automotive electronics, and consumer devices.
Report contents include:
- Glass materials overview and semiconductor applications analysis
- Market opportunities and value chain transformation from organic to glass substrates
- Global market forecasts with unit shipment and revenue projections 2025-2036
- Key advantages, adoption challenges, and future market trends
- Advanced processing technologies and sustainable manufacturing initiatives
- Investment priority areas and representative player activity assessment
- Technology Fundamentals & Manufacturing
- Glass materials properties: borosilicate, quartz, and specialty compositions
- Manufacturing processes: glass melting, forming, and panel-level processing
- Through Glass Via (TGV) formation technologies and metallization processes
- Design considerations: thermal management, stress analysis, electrical optimization
- Build-up layer fabrication and advanced manufacturing process development
- Advanced Packaging & IC Substrates Analysis
- Evolution from 1D to 4D advanced packaging architectures
- Intel's roadmap, heterogeneous integration, and system-level packaging solutions
- Glass IC substrate evolution and organic-to-glass core transition analysis
- Comprehensive TGV technology coverage: formation, processing, metallization
- Material property comparisons and performance benchmarking
- Traditional substrate limitations and glass core substrate technologies
- Industry implementation case studies and innovation analysis
- Photonic Integration Applications
- Photonic integrated circuits and co-packaged optics architecture
- Glass waveguide technologies and ion exchange formation processes
- EIC/PIC integration and optical coupling solutions
- Manufacturing processes and laser separation technology
- 3D integration capabilities and fabrication process optimization
- Corning's high-density platform and advancement analysis
- High-Frequency Applications Market
- Low-loss material requirements for 5G/6G semiconductor packaging
- Material benchmarking: LTCC vs glass performance characteristics
- RF applications enabled by glass substrate technology
- Commercial product analysis and supplier ecosystem
- Filter substrates, IPD implementations, and antenna-in-package solutions
- 6G technology enablement and glass interposer applications
- Technology Benchmarking & Competitive Analysis
- Glass vs organic substrates: performance, cost, manufacturing comparison
- Glass vs silicon interposers: technical metrics and economic analysis
- Hybrid substrate solutions and multi-material integration strategies
- Future technology roadmaps and performance projection modeling
- Innovation trends and process technology evolution analysis
- End-User Market Analysis
- AI and high-performance computing market requirements and growth drivers
- Data center infrastructure scaling and performance efficiency demands
- Telecommunications 5G/6G evolution and RF component specifications
- Automotive electronics: ADAS, EV, autonomous driving applications
- Consumer electronics: mobile, wearable, gaming system integration
- Market Challenges & Strategic Opportunities
- Technical challenges: manufacturing maturity, yield optimization, standardization
- Economic barriers: cost competitiveness, investment requirements, adoption timelines
- Strategic opportunities: performance differentiation and new application development
- Technology convergence benefits and market expansion potential
- Future Outlook & Market Scenarios
- Technology evolution projections and material development roadmaps
- Advanced manufacturing process development and integration advances
- Performance enhancement projections and capability scaling
- Market development scenarios: optimistic, conservative, disruptive impact analysis
- Comprehensive Company Profiles. Profiles of 35 companies including Absolics, BOE, Corning, Intel, JNTC Co., Ltd., KCC, LG Innotek, LPKF, Nippon Electric Glass (NEG), Plan Optik AG, Samsung Electro-Mechanics (Semco), Toppan and more......
The report includes these components:
- PDF report download/by email. Print edition also available.
- Comprehensive Excel spreadsheet of all data.
- Mid-year Update
Payment methods: Visa, Mastercard, American Express, Paypal, Bank Transfer. To order by Bank Transfer (Invoice) select this option from the payment methods menu after adding to cart, or contact info@futuremarketsinc.com
1 EXECUTIVE SUMMARY 205
- 1.1 Glass Materials Overview 205
- 1.2 Applications of Glass in Semiconductors 207
- 1.3 Glass for Advanced Packaging 208
- 1.4 Glass Used in Various Semiconductor Applications 209
- 1.5 Opportunities with Glass Packaging 210
- 1.6 Advantages of Glass Substrates 211
- 1.7 Challenges in Adopting Glass Substrates 212
- 1.8 Future Market Trends 213
- 1.8.1 Advanced Processing Technologies 213
- 1.8.2 Integrated Packaging Solutions & Sustainable Manufacturing Initiatives 214
- 1.9 Value Chain of Glass Substrate 215
- 1.9.1 Organic to Glass Core Substrate 216
- 1.10 Future Outlook 217
- 1.11 Material Innovations 218
- 1.12 Global Market Forecasts 2025-2036 219
- 1.12.1 Unit Shipment Forecast 2025-2036 219
- 1.12.2 Market Value Forecast 2025-2036 220
2 GLASS SUBSTRATES TECHNOLOGY FUNDAMENTALS 224
- 2.1 Glass Materials Properties 224
- 2.1.1 Borosilicate Glass Characteristics 224
- 2.1.2 Quartz Glass Properties 225
- 2.1.3 Specialty Glass Compositions 226
- 2.2 Manufacturing Processes 227
- 2.2.1 Glass Melting and Forming 227
- 2.2.2 Through Glass Via (TGV) Formation 228
- 2.2.3 Metallization and Build-up Processes 229
- 2.2.4 Panel-Level Processing Technologies 230
- 2.3 Design and Process Considerations 231
- 2.3.1 Thermal Management 231
- 2.3.2 Mechanical Stress Analysis 232
- 2.3.3 Electrical Performance Optimization 233
3 GLASS IN ADVANCED PACKAGING AND IC SUBSTRATES 242
- 3.1 Advanced Packaging Evolution 242
- 3.1.1 Dimensionality of Advanced Packaging 243
- 3.1.2 From 1D Semiconductor Packaging 243
- 3.1.3 Advanced Packaging 2D & 2D+ 244
- 3.1.4 Advanced Packaging 2.5D & 3D 245
- 3.1.5 Advanced Packaging 3.5D & 4D 246
- 3.1.6 Technology Development Trend for 2.5D and 3D Packaging 247
- 3.2 Packaging Architecture and Integration 247
- 3.2.1 Intel's Advanced Packaging Roadmap 248
- 3.2.2 Heterogeneous Integration Solutions 249
- 3.2.3 Overview of System on Chip (SOC) 250
- 3.2.4 Overview of Multi-Chip Module (MCM) 251
- 3.2.5 System in Package (SiP) 252
- 3.2.6 Analysis of System in Package (SiP) 253
- 3.3 Glass IC Substrates Evolution 254
- 3.3.1 Glass IC Substrates 255
- 3.3.2 From Organic to Glass Core Substrate 256
- 3.3.3 Evolution of Packaging Substrates in Semiconductors 257
- 3.3.4 From Organic to Glass Core 258
- 3.3.5 Organic Core Substrate vs. Glass Core Substrate 259
- 3.4 Through Glass Via Technology 260
- 3.4.1 TSV vs. TGV 260
- 3.4.2 Through Glass Via Formation 261
- 3.4.3 Through Glass Via Formation Process 262
- 3.4.4 Comparison of Through Glass Via Formation Processes 263
- 3.4.5 TGV Process and Via Formation Methods 263
- 3.4.6 Mechanical and High-Power Laser Drilling 264
- 3.4.7 Laser-Induced Deep Etching 265
- 3.4.8 LMCE from BSP 266
- 3.4.9 Philoptics' TGV Technology 267
- 3.4.10 Laser-Induced Modification and Advanced Wet Etching 268
- 3.4.11 Comparison Among the TGV Processes 269
- 3.4.12 Photosensitive Glass and Wet Etching 270
- 3.4.13 Samtec's TGV Technology 271
- 3.4.14 TGV of High Aspect Ratio 272
- 3.5 TGV Metallization and Processing 273
- 3.5.1 TGV Metallization 273
- 3.5.2 TGV Metallization Processes 274
- 3.5.3 Two-Step Process 275
- 3.5.4 Seed Layer Deposition in TGV Metallization 276
- 3.5.5 Factors for Alternative TGV Metallization Process 277
- 3.5.6 Comparison of TGV Metallization Processes 278
- 3.6 Material Properties and Performance 279
- 3.6.1 Material Property Comparison for Advanced Packaging 279
- 3.6.2 Key Mechanical and Reliability Benefits of Glass 280
- 3.6.3 I/O Density 281
- 3.6.4 Key Factors Enabling Fine Circuit Patterns on Glass Substrates 283
- 3.6.5 Fine Circuit Patterning Reduces DoF 284
- 3.6.6 FC-BGA Substrates Lead to Larger Distortions 285
- 3.7 Traditional Substrate Limitations 286
- 3.7.1 Limitations of Via Formation 286
- 3.7.2 SAP Method Limitations 287
- 3.7.3 PCB Stack-ups 288
- 3.7.4 Traditional Multilayer vs. Build-up PCBs 289
- 3.7.5 Build-up Material: ABF 290
- 3.7.6 ABF Substrate Manufacturing Process 291
- 3.7.7 Flip Chip Ball Grid Array (FC-BGA) Substrate 292
- 3.8 Glass Core Substrate Technologies 293
- 3.8.1 Glass Core Substrate 293
- 3.8.2 Glass Core Substrate Technologies 294
- 3.8.3 Glass Interposer vs. Silicon Interposer 296
- 3.9 Glass Substrate Manufacturing 297
- 3.9.1 Glass Substrate Manufacturing 297
- 3.9.2 Organic Core Substrate vs. Glass Core Substrate 298
- 3.9.3 Core Layer Fabrication 299
- 3.9.4 Build-up Layer Fabrication 300
- 3.9.5 Manufacturing Process of Glass Substrate (CHIMES) 301
- 3.9.6 Achieving 2/2 μm L/S on Glass Substrate 302
- 3.10 Advanced Manufacturing Processes 303
- 3.10.1 Glass Fabrication Process 304
- 3.10.2 Glass Core 3D Integration 304
- 3.10.3 Chip-First Non-TSV 3D Glass Panel Embedding 305
- 3.10.4 Intel's Glass Line 306
- 3.11 Industry Implementation and Innovation 307
- 3.11.1 Features of Glass-based Advanced Packaging and IC Substrates 308
- 3.11.2 Advanced Thermal Management for Glass Packages 309
- 3.11.3 Glass Innovation 309
4 GLASS IN PHOTONICS 317
- 4.1 Photonic Integration 317
- 4.1.1 Overview 317
- 4.1.2 Optical Coupling - I/O 318
- 4.1.3 EIC/PIC Integration 318
- 4.2 Co-Packaged Optics 319
- 4.2.1 Co-Packaged Optics 320
- 4.2.2 Co-Packaged Optics Architecture 320
- 4.2.3 Key Trend of Optical Transceiver 321
- 4.2.4 Glass-Based CPO Integration 322
- 4.2.5 Glass Interposer-Based CPO Architecture 323
- 4.3 Glass Waveguide Technologies 324
- 4.3.1 Ion Exchange Waveguide Formation Technology 325
- 4.3.2 Dual-Mode Glass Waveguide Performance Characteristics 326
- 4.3.3 Adiabatic Glass-to-Silicon Waveguide Coupling for CPO Integration 327
- 4.3.4 Glass-Based Fiber Connector Assembly for CPO Applications 328
- 4.3.5 Glass Interposer Optical Signal Path Architecture 329
- 4.4 Manufacturing and Integration Processes 330
- 4.4.1 Glass Interposer Manufacturing Process and Laser Separation Technology 331
- 4.4.2 Corning's High-Density 102.4 Tb/s Glass Integration Platform 331
- 4.4.3 3D Integration of EIC/PIC with a Glass Interposer 332
- 4.4.4 3D Integration of EIC, PIC, ASIC on a Co-Packaged Glass Substrate 333
- 4.4.5 Fabrication Process of the 3D Integration of ASIC, EIC, PIC on a Co-Packaged Substrate 334
- 4.4.6 Advancements in Glass Integration for Photonics 335
5 GLASS IN HIGH-FREQUENCY APPLICATIONS 340
- 5.1 High-Frequency Material Requirements 340
- 5.1.1 Applications of Low-Loss Materials in Semiconductor and Electronics Packaging 340
- 5.1.2 Transmission Loss in High-Frequency PCB Design 341
- 5.1.3 Glass as a Low-Loss Material 342
- 5.1.4 Categories of RF Applications Enabled by Glass in Semiconductor Technology 343
- 5.2 Material Benchmarking and Performance 344
- 5.2.1 Benchmark of LTCC and Glass Materials 345
- 5.2.2 Dielectric Constant: Stability vs Frequency for Different Inorganic Substrates (LTCC, Glass) 346
- 5.2.3 Benchmarking of Commercial Low-Loss Materials for 5G PCBs/Components 347
- 5.3 Glass Suppliers and Products 348
- 5.4 RF Applications and Implementations 349
- 5.4.1 Glass as a Filter Substrate 349
- 5.4.2 Glass Integrated Passive Devices (IPD) Filter for 5G by Advanced Semiconductor Engineering 350
- 5.4.3 Glass Substrate AiP for 5G: Georgia Tech 351
- 5.4.4 Glass for 6G: Georgia Tech 352
- 5.4.5 Glass Interposers for 6G 353
6 TECHNOLOGY BENCHMARKING AND COMPARISON 358
- 6.1 Glass vs Organic Substrates 358
- 6.1.1 Performance Comparison 359
- 6.1.2 Cost Analysis 360
- 6.1.3 Manufacturing Considerations 361
- 6.1.4 Application Suitability 362
- 6.2 Glass vs Silicon Interposers 363
- 6.2.1 Technical Performance Metrics 363
- 6.2.2 Economic Comparison 364
- 6.2.3 Scalability Assessment 365
- 6.3 Hybrid Substrates 366
- 6.3.1 Glass-Organic Hybrid Designs 366
- 6.3.2 Multi-Material Integration 367
- 6.3.3 Performance Optimization 368
- 6.3.4 Cost-Performance Trade-offs 369
- 6.4 Future Technology Roadmaps 370
- 6.4.1 6.4.1 Material Innovation Trends 370
- 6.4.2 Process Technology Evolution 372
- 6.4.3 Integration Complexity Growth 372
- 6.4.4 Performance Projection Models 373
7 END-USER MARKET ANALYSIS 382
- 7.1 AI and High-Performance Computing 382
- 7.1.1 Market Size and Growth Drivers 382
- 7.1.2 Technology Requirements 383
- 7.1.3 Key Players and Products 384
- 7.1.4 Future Development Trends 385
- 7.2 Data Centers and Cloud Computing 386
- 7.2.1 Infrastructure Scaling Demands 386
- 7.2.2 Performance and Efficiency Requirements 387
- 7.2.3 Technology Adoption Patterns 388
- 7.2.4 Market Opportunity Assessment 389
- 7.3 Telecommunications and 5G/6G 390
- 7.3.1 Network Infrastructure Evolution 390
- 7.3.2 RF Component Requirements 391
- 7.3.3 Technology Integration Challenges 392
- 7.4 Automotive Electronics 393
- 7.4.1 Advanced Driver Assistance Systems 393
- 7.4.2 Electric Vehicle Electronics 394
- 7.4.3 Autonomous Driving Platforms 395
- 7.4.4 Reliability and Safety Requirements 396
- 7.5 Consumer Electronics 397
- 7.5.1 Mobile Device Applications 397
- 7.5.2 Wearable Technology Integration 399
- 7.5.3 Gaming and Entertainment Systems 400
8 CHALLENGES AND OPPORTUNITIES 405
- 8.1 Technical Challenges 405
- 8.1.1 Manufacturing Process Maturity 405
- 8.1.2 Yield and Reliability Issues 406
- 8.1.3 Design and Integration Complexity 407
- 8.1.4 Standardization Requirements 408
- 8.2 Economic and Market Challenges 409
- 8.2.1 Cost Competitiveness 409
- 8.2.2 Investment Requirements 410
- 8.2.3 Customer Adoption Barriers 411
- 8.3 Strategic Opportunities 412
- 8.3.1 Performance Differentiation 412
- 8.3.2 New Application Development 413
- 8.3.3 Technology Convergence Benefits 414
9 FUTURE OUTLOOK 417
- 9.1 Technology Evolution Projections 417
- 9.1.1 Next-Generation Material Developments 418
- 9.1.2 Advanced Manufacturing Processes 419
- 9.1.3 Integration Technology Advances 420
- 9.1.4 Performance Enhancement Roadmap 421
- 9.2 Market Development Scenarios 423
- 9.2.1 Optimistic Growth Scenario 423
- 9.2.2 Conservative Growth Scenario 424
- 9.2.3 Disruptive Technology Impact 425
10 COMPANY PROFILES 426 (35 company profiles)
11 APPENDICES 459
- 11.1 Technical Glossary and Definitions 459
- 11.2 Technology Evolution Timeline 460
- 11.3 Market Research Methodology Details 463
12 REFERENCES 464
List of Tables
- Table 1. Applications of Glass in Semiconductors. 207
- Table 2. Key Advantages of Glass Substrates. 211
- Table 3. Challenges in Adopting Glass Substrates. 212
- Table 4. Unit Shipment Forecast 2025-2036. 220
- Table 5. Market Value Forecast 2025-2036. 221
- Table 6. Market Forecast by Application Segment. 222
- Table 7. Material Property Comparison Matrix. 226
- Table 8. Glass Material Properties Comparison. 234
- Table 9. Coefficient of Thermal Expansion vs Temperature. 234
- Table 10. Dielectric Properties by Glass Type. 235
- Table 11. TGV Process Comparison Matrix. 237
- Table 12. Metallization Process Options. 238
- Table 13. Build-up Layer Material Options. 239
- Table 14. Panel-Level vs Wafer-Level Processing Comparison. 240
- Table 15. Advanced Packaging Technology Comparison. 309
- Table 16. Glass vs Silicon Interposer Cost Analysis. 311
- Table 17. Material Property Comparison Matrix. 312
- Table 18. TGV Process Comparison Matrix. 313
- Table 19. Panel-Level vs Wafer-Level Processing Comparison. 314
- Table 20. Build-up Layer Material Options. 315
- Table 21. Photonic Integration Market Growth Drivers. 336
- Table 22. CPO vs Traditional Optical Module Comparison. 337
- Table 23. Glass Waveguide Performance Characteristics. 338
- Table 24. Glass Suppliers and Products. 348
- Table 25. RF Application Frequency Requirements. 354
- Table 26. High-Frequency Material Property Requirements. 355
- Table 27. Dielectric Constant vs Frequency Performance. 356
- Table 28. Commercial Low-Loss Materials Comparison. 357
- Table 29. Comprehensive Material Property Comparison. 374
- Table 30. Manufacturing Process Comparison. 376
- Table 31. Application Suitability Matrix 377
- Table 32. Silicon Interposer vs Glass Interposer Analysis 378
- Table 33. Hybrid Substrate Configuration Options 379
- Table 34. End-User Market Size Distribution. 401
- Table 35. AI/HPC Market Requirements Matrix 401
- Table 36. 5G/6G Component Specifications 402
- Table 37. Automotive Electronics Growth Drivers 403
- Table 38. Consumer Electronics Application Analysis 404
- Table 39. Technical Challenge Assessment Matrix. 414
- Table 40. Technology Maturity vs Market Readiness 415
- Table 41. Economic Challenge Analysis 416
- Table 42. Technical Glossary and Definitions. 459
List of Figures
- Figure 1. Global Glass Substrates Market Size 2026-2036 (Revenue & Volume) 205
- Figure 2. Market Share by Application Segment 2026 vs 2036. 206
- Figure 3. Technology Readiness Level Assessment by Application. 209
- Figure 4. Value Chain of Glass Substrate. 215
- Figure 5. Unit Shipment Forecast 2025-2036. 220
- Figure 6. Market Value Forecast 2025-2036. 221
- Figure 7. Market Forecast by Application Segment. 223
- Figure 8.TGV Formation Process Flow. 236
- Figure 9. Stacked glass architecture uses uncured ABF dielectric as adhesive, laser via drilling, and copper electroless seed/electroplated fill. 289
- Figure 10. TGV Formation Process Flow. 313
- Figure 11. Photonic Integration Technology Roadmap. 339
- Figure 12. Performance vs Cost Positioning Map 375
- Figure 13. Technology Roadmap Timeline 380
- Figure 14. Performance Enhancement Roadmap. 422
- Figure 15. Absolics' glass substrate. 426
- Figure 16. JNTC Next-Generation Glass Substrate for Semiconductors. 439
- Figure 17. Technology Evolution Timeline. 461
The report includes these components:
- PDF report download/by email. Print edition also available.
- Comprehensive Excel spreadsheet of all data.
- Mid-year Update
Payment methods: Visa, Mastercard, American Express, Paypal, Bank Transfer. To order by Bank Transfer (Invoice) select this option from the payment methods menu after adding to cart, or contact info@futuremarketsinc.com
