The Global Thermal Interface Materials Market 2026-2036

1             INTRODUCTION          21

• 1.1        Thermal Management-active and passive  21
• 1.2        What are Thermal Interface Materials (TIMs)?         21
  • 1.2.1    Types of TIMs 23
  • 1.2.2    Thermal conductivity                24
• 1.3        Comparative properties of TIMs        25
• 1.4        Thermal Pads and Thermal Grease  29
• 1.5        Advantages and Disadvantages of TIMs, by type    30
• 1.6        Performance  32
• 1.7        Prices  35
• 1.8        Emerging Technologies in TIMs          35
• 1.9        Supply Chain for TIMs              36
• 1.10     Raw Material Analysis and Pricing   37
• 1.11     Environmental Regulations and Sustainability        37
• 1.12     System Level Performance   38
• 1.13     Thermal Conductivity vs Thermal Resistance          39
• 1.14     TIM Chemistry               40

2             MATERIALS      42

• 2.1        Advanced and Multi-Functional TIMs            43
  • 2.1.1    Carbon-based TIMs   44
    • 2.1.1.1 Overview           44
  • 2.1.2    Thermal Conductivity By Filler Type 45
  • 2.1.3    Thermal Conductivity By Matrix         46
• 2.2        TIM fillers          47
  • 2.2.1    Trends 48
  • 2.2.2    Pros and Cons              49
  • 2.2.3    Thermal Conductivity               50
  • 2.2.4    Spherical Alumina      51
  • 2.2.5    Alumina Fillers              51
  • 2.2.6    Boron nitride (BN)       52
    • 2.2.6.1 Overview           52
    • 2.2.6.2 Suppliers          53
    • 2.2.6.3 Nano Boron Nitride    55
  • 2.2.7    Filler and polymer TIMs           57
  • 2.2.8    Diamond          58
  • 2.2.9    Filler Sizes        60
• 2.3        Thermal Greases and Pastes              61
  • 2.3.1    Overview and properties        61
  • 2.3.2    SWOT analysis              65
• 2.4        Thermal Gap Pads      66
  • 2.4.1    Overview and properties        66
  • 2.4.2    Application in EV Batteries    67
  • 2.4.3    Transitioning to Gap fillers from Pads            67
  • 2.4.4    SWOT analysis              68
• 2.5        Thermal Gap Fillers    70
  • 2.5.1    Overview and properties        70
  • 2.5.2    Products           70
  • 2.5.3    SWOT analysis              71
• 2.6        Potting Compounds/Encapsulants 73
  • 2.6.1    Overview and properties        73
  • 2.6.2    SWOT analysis              75
• 2.7        Adhesive Tapes             77
  • 2.7.1    Overview and properties        77
  • 2.7.2    Application in EV Batteries    78
  • 2.7.3    TCA Requirements     79
  • 2.7.4    SWOT analysis              79
• 2.8        Phase Change Materials         81
  • 2.8.1    Overview           81
  • 2.8.2    Products           81
  • 2.8.3    Properties         82
  • 2.8.4    Types   83
    • 2.8.4.1 Organic/biobased phase change materials               84
      • 2.8.4.1.1           Advantages and disadvantages        85
      • 2.8.4.1.2           Paraffin wax    85
      • 2.8.4.1.3           Non-Paraffins/Bio-based      86
    • 2.8.4.2 Inorganic phase change materials   86
      • 2.8.4.2.1           Salt hydrates  86
        • 2.8.4.2.1.1      Advantages and disadvantages        87
      • 2.8.4.2.2           Metal and metal alloy PCMs (High-temperature)   87
    • 2.8.4.3 Eutectic mixtures        88
    • 2.8.4.4 Encapsulation of PCMs           88
      • 2.8.4.4.1           Macroencapsulation 89
      • 2.8.4.4.2           Micro/nanoencapsulation    89
    • 2.8.4.5 Nanomaterial phase change materials         89
  • 2.8.5    Thermal energy storage (TES)              89
    • 2.8.5.1 Sensible heat storage              90
    • 2.8.5.2 Latent heat storage    90
  • 2.8.6    Application in TIMs    91
    • 2.8.6.1 Thermal pads 92
    • 2.8.6.2 Low Melting Alloys (LMAs)    93
    • 2.8.6.3 Thermal storage units              93
    • 2.8.6.4 Thermal energy storage panels          93
    • 2.8.6.5 Space systems             94
  • 2.8.7    SWOT analysis              96
• 2.9        Metal-based TIMs       97
  • 2.9.1    Overview           97
    • 2.9.1.1 Metal-Based TIM1 and TIM2 97
    • 2.9.1.2 Metal Filled Polymer TIMs      98
  • 2.9.2    Solders and low melting temperature alloy TIMs   98
    • 2.9.2.1 Solder TIM1     100
    • 2.9.2.2 Sintering            101
  • 2.9.3    Liquid metals 103
    • 2.9.3.1 Liquid metal for high-performance GPU      104
    • 2.9.3.2 Challenges      105
  • 2.9.4    Solid liquid hybrid (SLH) metals        105
    • 2.9.4.1 Hybrid liquid metal pastes    105
    • 2.9.4.2 SLH created during chip assembly (m2TIMs)           107
    • 2.9.4.3 Die-attach materials 107
      • 2.9.4.3.1           Solder Alloys and Conductive Adhesives    109
      • 2.9.4.3.2           Silver-Sintered Paste 111
      • 2.9.4.3.3           Copper (Cu) sintered TIMs    112
        • 2.9.4.3.3.1      TIM1 - Sintered Copper            112
        • 2.9.4.3.3.2      Cu Sinter Materials    113
        • 2.9.4.3.3.3      Copper Sintering Challenges              115
        • 2.9.4.3.3.4      Commercial Use         116
      • 2.9.4.3.4           Sintered Copper Die-Bonding Paste               116
        • 2.9.4.3.4.1      Commercial activity  117
      • 2.9.4.3.5           Graphene Enhanced Sintered Copper TIMs              117
    • 2.9.4.4 Laminar Metal Form With High Softness     117
  • 2.9.5    SWOT analysis              118
• 2.10     Carbon-based TIMs   120
  • 2.10.1 Carbon nanotube (CNT) TIM Fabrication     120
  • 2.10.2 Challenges      121
  • 2.10.3 Market players               122
  • 2.10.4 Multi-walled nanotubes (MWCNT)  122
    • 2.10.4.1            Properties         123
    • 2.10.4.2            Application as thermal interface materials                124
  • 2.10.5 Single-walled carbon nanotubes (SWCNTs)             125
    • 2.10.5.1            Properties         125
    • 2.10.5.2            Application as thermal interface materials                127
  • 2.10.6 Vertically aligned CNTs (VACNTs)     128
    • 2.10.6.1            Properties         128
    • 2.10.6.2            Applications   128
    • 2.10.6.3            Application as thermal interface materials                129
  • 2.10.7 BN nanotubes (BNNT) and nanosheets (BNNS)      129
    • 2.10.7.1            Properties         129
    • 2.10.7.2            Application as thermal interface materials                130
  • 2.10.8 Graphene         130
    • 2.10.8.1            Properties         132
    • 2.10.8.2            Application as thermal interface materials                133
      • 2.10.8.2.1        Graphene fillers            134
      • 2.10.8.2.2        Graphene foam            134
      • 2.10.8.2.3        Graphene aerogel       134
      • 2.10.8.2.4        Graphene Heat Spreaders     135
      • 2.10.8.2.5        Graphene in Thermal Interface Pads              136
    • 2.10.8.3            Advantages of Graphene        137
    • 2.10.8.4            Through-Plane Alignment      138
  • 2.10.9 Nanodiamonds            138
    • 2.10.9.1            Properties         138
    • 2.10.9.2            Application as thermal interface materials                140
  • 2.10.10              Graphite            140
    • 2.10.10.1         Properties         140
    • 2.10.10.2         Natural graphite           141
      • 2.10.10.2.1     Classification 142
      • 2.10.10.2.2     Processing       143
      • 2.10.10.2.3     Flake    143
        • 2.10.10.2.3.1 Grades               143
        • 2.10.10.2.3.2 Applications   144
    • 2.10.10.3         Synthetic graphite      146
      • 2.10.10.3.1     Classification 146
        • 2.10.10.3.1.1 Primary synthetic graphite    146
        • 2.10.10.3.1.2 Secondary synthetic graphite             147
        • 2.10.10.3.1.3 Processing       147
    • 2.10.10.4         Applications as thermal interface materials             147
      • 2.10.10.4.1     Graphite Sheets           148
      • 2.10.10.4.2     Vertical graphite          149
      • 2.10.10.4.3     Graphite pastes           150
    • 2.10.10.5         Challenges      150
      • 2.10.10.5.1     Through-plane thermal conductivity limitations    150
      • 2.10.10.5.2     Interfacing with Heat Source and Disrupting Alignment    151
  • 2.10.11              Hexagonal Boron Nitride        151
    • 2.10.11.1         Properties         152
    • 2.10.11.2         Application as thermal interface materials                153
  • 2.10.12              SWOT analysis              154
• 2.11     Metamaterials               155
  • 2.11.1 Types and properties 155
    • 2.11.1.1            Electromagnetic metamaterials       156
      • 2.11.1.1.1        Double negative (DNG) metamaterials         156
      • 2.11.1.1.2        Single negative metamaterials           157
      • 2.11.1.1.3        Electromagnetic bandgap metamaterials (EBG)    157
      • 2.11.1.1.4        Bi-isotropic and bianisotropic metamaterials          157
      • 2.11.1.1.5        Chiral metamaterials                157
      • 2.11.1.1.6        Electromagnetic “Invisibility” cloak 158
    • 2.11.1.2            Terahertz metamaterials        158
    • 2.11.1.3            Photonic metamaterials         158
    • 2.11.1.4            Tunable metamaterials           159
    • 2.11.1.5            Frequency selective surface (FSS) based metamaterials 159
    • 2.11.1.6            Nonlinear metamaterials       159
    • 2.11.1.7            Acoustic metamaterials         160
  • 2.11.2 Application as thermal interface materials                160
• 2.12     Self-healing thermal interface materials     160
  • 2.12.1 Extrinsic self-healing 162
  • 2.12.2 Capsule-based             162
  • 2.12.3 Vascular self-healing 162
  • 2.12.4 Intrinsic self-healing 162
  • 2.12.5 Healing volume            163
  • 2.12.6 Types of self-healing materials, polymers and coatings    164
  • 2.12.7 Applications in thermal interface materials              165
• 2.13     TIM Dispensing             165
  • 2.13.1 Low-volume Dispensing Methods    165
  • 2.13.2 High-volume Dispensing Methods  166
  • 2.13.3 Meter, Mix, Dispense (MMD) Systems           166
  • 2.13.4 TIM Dispensing Equipment Suppliers            167

3             MARKETS FOR THERMAL INTERFACE MATERIALS (TIMs)  169

• 3.1        Consumer Electronics             169
  • 3.1.1    Market overview           169
    • 3.1.1.1 Market drivers                169
    • 3.1.1.2 Applications   170
      • 3.1.1.2.1           Smartphones and tablets      171
        • 3.1.1.2.1.1      Graphitic Heat Spreaders      174
        • 3.1.1.2.1.2      Liquid metals 175
      • 3.1.1.2.2           Wearable electronics                176
  • 3.1.2    Global market 2022-2036, by TIM type          177
• 3.2        Electric Vehicles (EV)               179
  • 3.2.1    Market overview           179
    • 3.2.1.1 Market drivers                179
    • 3.2.1.2 Applications   179
      • 3.2.1.2.1           EV Battery Packs         180
        • 3.2.1.2.1.1      TIM Pack and Module               180
        • 3.2.1.2.1.2      TIM Application by Cell Format          180
        • 3.2.1.2.1.3      Thermal Interface Material Fillers for EV Batteries 182
        • 3.2.1.2.1.4      TIM Pricing       184
        • 3.2.1.2.1.5      Companies     184
      • 3.2.1.2.2           Lithium-ion batteries 185
        • 3.2.1.2.2.1      Cell-to-pack designs 186
        • 3.2.1.2.2.2      Cell-to-chassis/body                187
      • 3.2.1.2.3           Power electronics       189
        • 3.2.1.2.3.1      Types   190
        • 3.2.1.2.3.2      Trends 190
        • 3.2.1.2.3.3      Properties for TIM2 Properties  in EV power electronics     191
        • 3.2.1.2.3.4      TIM1s  194
        • 3.2.1.2.3.5      TIM2 in SiC MOSFET  196
    • 3.2.1.2.4           Charging stations        197
  • 3.2.2    Global market 2022-2036, by TIM type          197
• 3.3        Data Centers  199
  • 3.3.1    Market overview           199
    • 3.3.1.1 Market drivers                199
    • 3.3.1.2 Applications   200
      • 3.3.1.2.1           Router, switches and line cards         201
        • 3.3.1.2.1.1      Transceivers   202
        • 3.3.1.2.1.2      Server Boards                202
        • 3.3.1.2.1.3      Switches and Routers              204
      • 3.3.1.2.2           AI Servers         205
        • 3.3.1.2.2.1      Overview           205
        • 3.3.1.2.2.2      Trends 205
        • 3.3.1.2.2.3      TRL       208
      • 3.3.1.2.3           Power supply converters        215
        • 3.3.1.2.3.1      Overview           215
        • 3.3.1.2.3.2      Laminar metal form TIMs       215
        • 3.3.1.2.3.3      TIM Consumption in Data Center Power Supplies 216
        • 3.3.1.2.3.4      Immersion cooling     217
  • 3.3.2    Global market 2022-2036, by TIM type          218
• 3.4        Advanced Semiconductor Packaging           220
  • 3.4.1    Market Overview          220
  • 3.4.2    TIM1     221
    • 3.4.2.1 Indium foil TIM1           221
    • 3.4.2.2 Products           221
      • 3.4.2.2.1           Thermal Gel    222
      • 3.4.2.2.2           Thermal grease             222
      • 3.4.2.2.3           Graphene         223
      • 3.4.2.2.4           Liquid metal   224
      • 3.4.2.2.5           Diamond thermal interface materials in TIM0 applications            225
      • 3.4.2.2.6           Integrated silicon micro-cooler systems     225
      • 3.4.2.2.7           Copper nanowire (CuNWs)  226
  • 3.4.3    Global market 2022-2036, by TIM type          227
• 3.5        ADAS Sensors               229
  • 3.5.1    Market overview           229
    • 3.5.1.1 Market drivers                229
      • 3.5.1.1.1           Sensor Suite for Autonomous Cars 229
      • 3.5.1.1.2           Thermal Management in ADAS Sensors       230
    • 3.5.1.2 Applications   231
      • 3.5.1.2.1           ADAS Cameras             232
        • 3.5.1.2.1.1      Commercial examples            232
      • 3.5.1.2.2           ADAS Radar    233
        • 3.5.1.2.2.1      Radar technology        233
        • 3.5.1.2.2.2      Radar boards 234
        • 3.5.1.2.2.3      Commercial examples            235
      • 3.5.1.2.3           ADAS LiDAR    236
        • 3.5.1.2.3.1      Role of TIMs    236
        • 3.5.1.2.3.2      Commercial examples            236
      • 3.5.1.2.4           Electronic control units (ECUs) and computers      237
        • 3.5.1.2.4.1      Overview           237
        • 3.5.1.2.4.2      Commercial examples            238
      • 3.5.1.2.5           Die attach materials  239
        • 3.5.1.2.5.1      Overview           239
        • 3.5.1.2.5.2      Commercial examples            240
    • 3.5.1.3 Companies     242
  • 3.5.2    Global market 2022-2036, by TIM type          243
• 3.6        EMI shielding 244
  • 3.6.1    Market overview           244
  • 3.6.1.1 Market drivers                244
  • 3.6.1.2 Applications   244
    • 3.6.1.2.1           Dielectric Constant   245
    • 3.6.1.2.2           ADAS   246
      • 3.6.1.2.2.1      Radar  247
      • 3.6.1.2.2.2      5G         247
    • 3.6.1.2.3           Commercial examples            248
• 3.7        5G         249
  • 3.7.1    Market overview           249
    • 3.7.1.1 Market drivers                249
    • 3.7.1.2 Applications   249
      • 3.7.1.2.1           EMI shielding and EMI gaskets           250
      • 3.7.1.2.2           Antenna            250
      • 3.7.1.2.3           Base Band Unit (BBU)              253
      • 3.7.1.2.4           Liquid TIMs      256
      • 3.7.1.2.5           Power supplies             256
        • 3.7.1.2.5.1      Increased power consumption in 5G             257
  • 3.7.2    Market players               258
  • 3.7.3    Global market 2022-2036, by TIM type          258
• 3.8        Aerospace & Defense               260
  • 3.8.1    Market overview           260
    • 3.8.1.1 Market drivers                260
    • 3.8.1.2 Applications   260
      • 3.8.1.2.1           Satellite thermal management          260
        • 3.8.1.2.1.1      Temperature range     261
        • 3.8.1.2.1.2      Heat Spreaders            262
        • 3.8.1.2.1.3      Carbon fiber reinforced TIM 262
        • 3.8.1.2.1.4      Thermal pads 263
        • 3.8.1.2.1.5      Thermal straps             264
        • 3.8.1.2.1.6      Graphene         264
        • 3.8.1.2.1.7      Challenges      265
      • 3.8.1.2.2           Avionics cooling           267
      • 3.8.1.2.3           Military electronics     267
  • 3.8.1.3 Global market 2022-2036, by TIM type          267
• 3.9        Industrial Electronics               268
  • 3.9.1    Market overview           268
    • 3.9.1.1 Market drivers                268
    • 3.9.1.2 Applications   268
      • 3.9.1.2.1           Industrial automation              269
      • 3.9.1.2.2           Power supplies             269
      • 3.9.1.2.3           Motor drives    269
      • 3.9.1.2.4           LED lighting     269
  • 3.9.2    Global market 2022-2036, by TIM type          270
• 3.10     Renewable Energy      270
  • 3.10.1 Market overview           270
    • 3.10.1.1            Market drivers                270
    • 3.10.1.2            Applications   270
      • 3.10.1.2.1        Solar inverters               271
      • 3.10.1.2.2        Wind power electronics          271
      • 3.10.1.2.3        Energy storage systems          271
  • 3.10.2 Global market 2022-2036, by TIM type          271
• 3.11     Medical Electronics   272
  • 3.11.1 Market overview           272
    • 3.11.1.1            Market drivers                272
    • 3.11.1.2            Applications   272
      • 3.11.1.2.1        Diagnostic equipment             273
      • 3.11.1.2.2        Medical imaging systems      273
      • 3.11.1.2.3        Patient monitoring devices   273
  • 3.11.2 Global market 2022-2036, by TIM type          273

4             COMPANY PROFILES                274 (116 company profiles)

5             RESEARCH METHODOLOGY              357

6             REFERENCES 358

List of tables

• Table 1. Thermal conductivities (κ) of common metallic, carbon, and ceramic fillers employed in TIMs.                25
• Table 2. Commercial TIMs and their properties.     27
• Table 3. Advantages and disadvantages of TIMs, by type. 31
• Table 4. Key Factors in System Level Performance for TIMs.          33
• Table 5. TIM Materials by Thermal, Mechanical, and Application Properties        34
• Table 6. Thermal interface materials prices.             36
• Table 7. Comparisons of Price and Thermal Conductivity for TIMs.           36
• Table 8. Price Comparison of TIM Fillers.     36
• Table 9. Raw Material Analysis and Pricing.               38
• Table 10. System Level Performance Comparison.              39
• Table 11. Thermal Conductivity vs Thermal Resistance Comparison.     40
• Table 12. TIM Chemistry Comparison           41
• Table 13. Characteristics of some typical TIMs.     43
• Table 14. Carbon-Based TIM Performance.               45
• Table 15. Thermal Conductivity By Filler Type           47
• Table 16. Thermal Conductivity By Matrix.  48
• Table 17. Trends on TIM Fillers.          50
• Table 18. Pros and Cons of TIM Fillers.          50
• Table 19. Thermal Conductivity Comparison ATH and Al2O3.       53
• Table 20. BNNT Companies and Prices.       56
• Table 21.BNNT Property Variation.  57
• Table 22. Diamond fillers with varied sizes for thermal interface materials.        60
• Table 23. Commercial thermal paste products.     64
• Table 24.Commercial thermal gap pads (thermal interface materials).  67
• Table 25. Commercial thermal gap fillers products.            71
• Table 26. Types of Potting Compounds/Encapsulants.     75
• Table 27. TIM adhesives tapes.          78
• Table 28. Commercial phase change materials (PCM) thermal interface materials (TIMs) products. 82
• Table 29. Properties of PCMs.             83
• Table 30.  PCM Types and properties.            85
• Table 31. Advantages and disadvantages of organic PCMs.           86
• Table 32. Advantages and disadvantages of organic PCM Fatty Acids.    87
• Table 33. Advantages and disadvantages of salt hydrates               88
• Table 34. Advantages and disadvantages of low melting point metals.   89
• Table 35. Advantages and disadvantages of eutectics.      89
• Table 36. Benefits and drawbacks of PCMs in TIMs.            92
• Table 37. PCM Selection Criteria and Considerations for Space Systems.           95
• Table 38. PCM selection criteria and considerations for space systems.              96
• Table 39. Liquid Metal Challenges. 106
• Table 40. Copper Sintering Technical Challenges. 116
• Table 41. Technology Readiness Level (TRL) for Carbon Materials in Thermal Management     121
• Table 42. Challenges with CNT-TIMs.             122
• Table 43. Market players in CNT-TIMs.          123
• Table 44. Properties of CNTs and comparable materials. 124
• Table 45. Typical properties of SWCNT and MWCNT.          126
• Table 46. Comparison of carbon-based additives in terms of the main parameters influencing their value proposition as a conductive additive.              127
• Table 47. Thermal conductivity of CNT-based polymer composites.        130
• Table 48. Comparative properties of BNNTs and CNTs.     131
• Table 49. Properties of graphene, properties of competing materials, applications thereof.     133
• Table 50. Graphene Heat Spreaders Performance.              136
• Table 51. Comparison of Conventional and Graphene-Enhanced Thermal Pads.            138
• Table 52. Advantages of Graphene in Thermal Interface Materials             138
• Table 53. Properties of nanodiamonds.       140
• Table 54. Comparison between Natural and Synthetic Graphite.               141
• Table 55. Thermal Conductivity Comparison of Graphite TIMs.   142
• Table 56. Classification of natural graphite with its characteristics.         143
• Table 57. Characteristics of synthetic graphite.      147
• Table 58. Thermal Conductivity Comparison of Graphite TIMs.   151
• Table 59. Properties of hexagonal boron nitride (h-BN).    154
• Table 60. Comparison of self-healing systems.      164
• Table 61. Types of self-healing coatings and materials.     165
• Table 62. Comparative properties of self-healing materials.          166
• Table 63. Challenges for Dispensing TIM.   166
• Table 64. Thermal Management Application Areas in Consumer Electronics.    170
• Table 65. Thermal Management Differences: 4G vs 5G Smartphones.    171
• Table 66. Trends in Smartphone Thermal Materials.            172
• Table 67. Thermal Management approaches in commercial Smartphones.        174
• Table 68. Global market in consumer electronics 2022-2036, by TIM type (millions USD).        178
• Table 69. Material Options and Market Comparison.          182
• Table 70. TIM Filler Comparison and Adoption.       184
• Table 71. Thermal Conductivity Comparison of Suppliers for EV Batteries.          184
• Table 72. TIM Pricing by Supplier.      185
• Table 73. Thermal Conductivity Comparison of TIM1s.     195
• Table 74. Global market in electric vehicles 2022-2036, by TIM type (millions USD).     199
• Table 75. Types of TIMs in Data Centers.      201
• Table 76. Area of TIM per Switch.      204
• Table 77. Leaf and Spine Switch TIM Areas.               205
• Table 78. Novel TIM Technologies in Data Centers.               205
• Table 79. Emerging Trends in TIM Materials for AI Servers.               207
• Table 80. Applications of TIM Materials in AI Servers with Technology Readiness Levels (TRL).              210
• Table 81. Companies Utilizing and Providing TIM Materials for AI Servers              213
• Table 82. TIM Trends in Data Centers.            218
• Table 83. TIM Area Forecast in Server Boards: 2022-2036 (m2).  219
• Table 84. Global market in data centers 2022-2036, by TIM type (millions USD).             220
• Table 85. Global market in advanced semiconductor packaging 2022-2036, by TIM type (millions USD).                229
• Table 86. Autonomous Vehicle Sensor Suite TIM Requirements. 232
• Table 87. TIM Players in ADAS.            233
• Table 88. TIM Players in ADAS.            234
• Table 89. Die Attach for ADAS Sensors.        242
• Table 90. Die Attach Area Forecast for Key Components Within ADAS Sensors: 2022-2036 (m2).       243
• Table 91. TIM Players in ADAS              244
• Table 92. Global market in ADAS sensors 2022-2036, by TIM type (millions USD).          245
• Table 93. Applications of TIMs in EMI Shielding for ADAS Radars.              249
• Table 94. TIM Area Forecast for 5G Antennas by Station Size: 2022-2036 (m2). 255
• Table 95. TIM Area Forecast for 5G Antennas by Station Frequency: 2022-2036 (m2). 255
• Table 96. TIMS in BBU.             256
• Table 97. 5G BBY models.      258
• Table 98. TIM Area Forecast for 5G BBU: 2022-2036 (m2).              258
• Table 99. Power Consumption Forecast for 5G: 2022-2036 (GW).             260
• Table 100. TIM Area Forecast for Power Supplies: 2022-2036 (m2).          260
• Table 101. TIM market players in 5G.              261
• Table 102. Global market in 5G 2022-2036, by TIM type (millions USD). 262
• Table 103. Market Drivers for TIMS in aerospace and defense.     263
• Table 104. Applications for TIMS in aerospace and defense.          263
• Table 105. Temperature range of space subsystems and passive cooling approaches.               264
• Table 106. TIMs for space satellites - challenges and considerations.     268
• Table 107. Global Market for TIMs in aerospace and defense 2022-2036, by TIM Type (Millions USD).                271
• Table 108. Market Drivers for TIMs in industrial electronics.           272
• Table 109. Applications for TIMs in industrial electronics.               272
• Table 110. Global Market 2022-2036, by TIM Type in Industrial Electronics (Millions USD).      274
• Table 111. Market Drivers for TIMs in renewable energy.   275
• Table 112. Applications for TIMs in renewable energy.        275
• Table 113. Global Market for TIMs in Renewable Energy 2022-2036 (Millions USD).      276
• Table 114. Market Drivers for TIMs in medical electronics.              278
• Table 115. Applications for TIMs in medical electronics.  278
• Table 116. Global Market 2022-2036 for TIMs in Medical Electronics (Millions USD).   279

List of Figures

• Figure 1. (L-R) Surface of a commercial heatsink surface at progressively higher magnifications, showing tool marks that create a rough surface and a need for a thermal interface material. 22
• Figure 2. Schematic of thermal interface materials used in a flip chip package.              23
• Figure 3. Thermal grease.      24
• Figure 4. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module.             24
• Figure 5. Supply Chain for TIMs.        37
• Figure 6. Commercial thermal paste products.      62
• Figure 7. Application of thermal silicone grease.   63
• Figure 8. A range of thermal grease products.          63
• Figure 9. SWOT analysis for thermal greases and pastes. 66
• Figure 10. Thermal Pad.          67
• Figure 11. SWOT analysis for thermal gap pads.    70
• Figure 12. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module.             71
• Figure 13. SWOT analysis for thermal gap fillers.   73
• Figure 14. SWOT analysis for Potting compounds/encapsulants.              77
• Figure 15. Thermal adhesive products.         78
• Figure 16. SWOT analysis for TIM adhesives tapes.              81
• Figure 17. Phase-change TIM products.       82
• Figure 18. PCM mode of operation. 84
• Figure 19. Classification of PCMs.   84
• Figure 20. Phase-change materials in their original states.             85
• Figure 21. Thermal energy storage materials.           91
• Figure 22. Phase Change Material transient behaviour.     91
• Figure 23. PCM TIMs. 93
• Figure 24. Phase Change Material - die cut pads ready for assembly.      93
• Figure 25. SWOT analysis for phase change materials.      97
• Figure 26. Typical IC package construction identifying TIM1 and TIM2    100
• Figure 27. Liquid metal TIM product.              105
• Figure 28. Pre-mixed SLH.     107
• Figure 29. HLM paste and Liquid Metal Before and After Thermal Cycling.           107
• Figure 30.  SLH with Solid Solder Preform. 108
• Figure 31. Automated process for SLH with solid solder preforms and liquid metal.     108
• Figure 32. SWOT analysis for metal-based TIMs.   120
• Figure 33. Schematic of single-walled carbon nanotube. 126
• Figure 34. Types of single-walled carbon nanotubes.         127
• Figure 35. Schematic of a vertically aligned carbon nanotube (VACNT) membrane used for water treatment.        129
• Figure 36. Schematic of Boron Nitride nanotubes (BNNTs). Alternating B and N atoms are shown in blue and red.             131
• Figure 37. Graphene layer structure schematic.     131
• Figure 38. Illustrative procedure of the Scotch-tape based micromechanical cleavage of HOPG.       132
• Figure 39. Graphene and its descendants: top right: graphene; top left: graphite = stacked graphene; bottom right: nanotube=rolled graphene; bottom left: fullerene=wrapped graphene. 134
• Figure 40. Graphene Thermal Management Applications Roadmap.       135
• Figure 41. Flake graphite.       144
• Figure 42. Applications of flake graphite.    146
• Figure 43. Graphite-based TIM products.    149
• Figure 44. Structure of hexagonal boron nitride.     153
• Figure 45. SWOT analysis for carbon-based TIMs. 155
• Figure 46. Classification of metamaterials based on functionalities.      156
• Figure 47. Electromagnetic metamaterial. 157
• Figure 48. Schematic of Electromagnetic Band Gap (EBG) structure.      158
• Figure 49. Schematic of chiral metamaterials.        159
• Figure 50. Nonlinear metamaterials- 400-nm thick nonlinear mirror that reflects frequency-doubled output using input light intensity as small as that of a laser pointer.         161
• Figure 51. Schematic of self-healing polymers. Capsule based (a), vascular (b), and intrinsic (c) schemes for self-healing materials.  Red and blue colours indicate chemical species which react (purple) to heal damage.       162
• Figure 52. Stages of self-healing mechanism.         162
• Figure 53. Self-healing mechanism in vascular self-healing systems.     163
• Figure 54. Schematic of TIM operation in electronic devices.        171
• Figure 55. Schematic of Thermal Management Materials in smartphone.            174
• Figure 56. Wearable technology inventions.             177
• Figure 57. Global market in consumer electronics 2022-2036, by TIM type (millions USD).      179
• Figure 58. Application of thermal interface materials in automobiles.    180
• Figure 59. EV battery components including TIMs.               187
• Figure 60. Battery pack with a cell-to-pack design and prismatic cells.  188
• Figure 61. Cell-to-chassis battery pack.      190
• Figure 62. TIMS in EV charging station.         198
• Figure 63. Global market in electric vehicles 2022-2036, by TIM type (millions USD).   200
• Figure 64. Image of data center layout.         202
• Figure 65. Application of TIMs in line card. 203
• Figure 66. Global market in data centers 2022-2036, by TIM type (millions USD).           221
• Figure 67. Global market in advanced semiconductor packaging 2022-2036, by TIM type (millions USD).                230
• Figure 68. ADAS radar unit incorporating TIMs.       236
• Figure 69. Global market in ADAS sensors 2022-2036, by TIM type (millions USD).        246
• Figure 70. Coolzorb 5G.          248
• Figure 71. TIMs in Base Band Unit (BBU).    257
• Figure 72. Global market in 5G 2022-2036, by TIM type (millions USD). 262
• Figure 73. Global Market for TIMs in aerospace and defense 2022-2036, by TIM Type (Millions USD).                271
• Figure 74. Global Market 2022-2036, by TIM Type in Industrial Electronics (Millions USD).       274
• Figure 75. Global Market for TIMs in Renewable Energy 2022-2036 (Millions USD).       277
• Figure 76. Global Market 2022-2036 for TIMs in Medical Electronics (Millions USD).    280
• Figure 77. Boron Nitride Nanotubes products.        291
• Figure 78. Transtherm® PCMs.            292
• Figure 79. Carbice carbon nanotubes.         295
• Figure 80.  Internal structure of carbon nanotube adhesive sheet.            311
• Figure 81. Carbon nanotube adhesive sheet.           311
• Figure 82. HI-FLOW Phase Change Materials.         318
• Figure 83. Thermoelectric foil, consists of a sequence of semiconductor elements connected with conductive metal. At the top (in red) is the thermal interface.       330
• Figure 84. Parker Chomerics THERM-A-GAP GEL. 341
• Figure 85. Metamaterial structure used to control thermal emission.     342
• Figure 86. Shinko Carbon Nanotube TIM product. 351
• Figure 87. The Sixth Element graphene products.  355
• Figure 88. Thermal conductive graphene film.         356
• Figure 89. VB Series of TIMS from Zeon.       362

The Global Thermal Interface Materials Market 2026-2036

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The Global Thermal Interface Materials Market 2026-2036

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