The Global Advanced Semiconductor Packaging Market 2025-2035

1             EXECUTIVE SUMMARY            19

• 1.1        Semiconductor Packaging Technology Overview   19
  • 1.1.1    Key challenges              20
  • 1.1.2    Evolution of semiconductor packaging        21
    • 1.1.2.1 From 1D to 3D               22
  • 1.1.3    Conventional packaging approaches            24
  • 1.1.4    Advanced packaging approaches    24
• 1.2        Semiconductor Supply Chain            26
• 1.3        Advanced Packaging Supply Chain 26
• 1.4        Key Technology Trends in Advanced Packaging      27
• 1.5        Market Growth Drivers             28
• 1.6        Competitive Landscape         28
• 1.7        Market Challenges     29
• 1.8        Future outlook              30
  • 1.8.1    Heterogeneous Integration   30
  • 1.8.2    Chiplets and Die Disaggregation      31
  • 1.8.3    Advanced Interconnects        32
  • 1.8.4    Scaling and Miniaturization  32
  • 1.8.5    Thermal Management             33
  • 1.8.6    Materials Innovation 33
  • 1.8.7    Supply Chain Developments               34
  • 1.8.8    Role of Simulation and Data Analytics          34

2             SEMICONDUCTOR PACKAGING TECHNOLOGIES 35

• 2.1        Transistor Device Scaling       35
  • 2.1.1    Overview           35
  • 2.1.2    Heterogeneous Architecture Transition       36
  • 2.1.3    Co-Design Focus Areas          36
• 2.2        Wafer Level Packaging            38
• 2.3        Fan-Out Wafer Level Packaging        40
• 2.4        Chiplets             41
  • 2.4.1    AMD EPYC and Ryzen processor families   43
  • 2.4.2    Disaggregation Needs              44
• 2.5        Interconnection in Semiconductor Packaging        44
  • 2.5.1    Overview           45
  • 2.5.2    Wire Bonding 46
  • 2.5.3    Flip-chip bonding        46
  • 2.5.4    Interposer         47
    • 2.5.4.1 Glass interposer          48
  • 2.5.5    Through-silicon via (TSV) bonding    48
  • 2.5.6    Hybrid bonding with chiplets               48
• 2.6        2.5D and 3D Packaging           49
  • 2.6.1    2.5D packaging            49
    • 2.6.1.1 Overview           49
      • 2.6.1.1.1           Silicon Interposer 2.5D           50
        • 2.6.1.1.1.1      Through Si Via (TSV)   51
        • 2.6.1.1.1.2      (SiO2) based redistribution layers (RDLs)   52
      • 2.6.1.1.2           2.5D Organic-based packaging         53
        • 2.6.1.1.2.1      Chip-first and chip-last fan-out packaging 54
        • 2.6.1.1.2.2      Organic substrates     55
        • 2.6.1.1.2.3      Organic RDL   56
      • 2.6.1.1.3           2.5D glass-based packaging               57
        • 2.6.1.1.3.1      Benefits             58
        • 2.6.1.1.3.2      Glass Si interposers in advanced packaging            59
        • 2.6.1.1.3.3      Glass material properties      59
        • 2.6.1.1.3.4      2/2 μm line/space metal pitch on glass substrates              60
        • 2.6.1.1.3.5      3D Glass Panel Embedding (GPE) packaging           61
        • 2.6.1.1.3.6      Thermal management             63
        • 2.6.1.1.3.7      Polymer dielectric films          63
        • 2.6.1.1.3.8      Challenges      63
        • 2.6.1.1.3.9      Comparison with other substrates  64
      • 2.6.1.1.4           2.5D vs. 3D Packaging             65
        • 2.6.1.2 Benefits             66
        • 2.6.1.3 Challenges      66
        • 2.6.1.4 Trends 66
        • 2.6.1.5 Market players               67
  • 2.6.2    3D packaging 67
    • 2.6.2.1 Overview           69
      • 2.6.2.1.1           Conventional 3D packaging 69
      • 2.6.2.1.2           Advanced 3D Packaging with through-silicon vias (TSVs) 70
      • 2.6.2.1.3           Three-dimensional (3D) hybrid bonding       71
        • 2.6.2.1.3.1      Devices using hybrid bonding             71
    • 2.6.2.2 3D Microbump technology    72
      • 2.6.2.2.1           Technologies  73
      • 2.6.2.2.2           Challenges      74
      • 2.6.2.2.3           Bumpless copper-to-copper (Cu-Cu) hybrid bonding        74
    • 2.6.2.3 Trends 75
      • 2.6.2.3.1           3D interconnect trends           77
    • 2.6.2.4 Hybrid Bond and Fusion Bond            78

3             WAFER-LEVEL PACKAGING  78

• 3.1        Introduction    79
  • 3.1.1    WLP to PLP      79
• 3.2        Benefits             79
• 3.3        Types of Wafer Level Packaging        80
  • 3.3.1    Wafer Level Chip Scale Packaging  81
    • 3.3.1.1 Overview           81
    • 3.3.1.2 Advantages     81
    • 3.3.1.3 Applications   82
  • 3.3.2    Wafer Level Fan-Out Packaging        82
    • 3.3.2.1 Overview           82
    • 3.3.2.2 Advantages     83
    • 3.3.2.3 Applications   84
  • 3.3.3    Wafer Level Fan-In Packaging             85
    • 3.3.3.1 Overview           85
    • 3.3.3.2 Advantages     85
    • 3.3.3.3 Applications   86
  • 3.3.4    Other Types of WLP    86
    • 3.3.4.1 Cu-Pillar Flip Chip      86
    • 3.3.4.2 Advantages     86
      • 3.3.4.2.1           Applications   87
    • 3.3.4.3 Embedded Wafer Level BGA (eWLB)              87
    • 3.3.4.4 Advantages     88
      • 3.3.4.4.1           Applications   89
    • 3.3.4.5 Chip-last FO-WLP       89
      • 3.3.4.5.1           Advantages     89
      • 3.3.4.5.2           Applications   90
    • 3.3.4.6 Wafer-on-Wafer (WoW)          91
      • 3.3.4.6.1           Applications   91
• 3.4        WLP Manufacturing Processes          92
  • 3.4.1    Wafer Preparation       92
  • 3.4.2    RDL Buildup   93
  • 3.4.3    Bumping           93
  • 3.4.4    Encapsulation               93
  • 3.4.5    Integration       94
  • 3.4.6    Test and Singulation  94
• 3.5        Wafer Level Packaging Trends            95
• 3.6        Applications of Wafer Level Packaging         96
  • 3.6.1    Mobile and Consumer Electronics  96
  • 3.6.2    Automotive Electronics           96
  • 3.6.3    IoT and Industrial         96
  • 3.6.4    High Performance Computing            97
  • 3.6.5    Aerospace and Defense         97
• 3.7        Wafer Level Packaging Outlook         97

4             SYSTEM-IN-PACKAGE AND HETEROGENEOUS INTEGRATION     98

• 4.1        Introduction    99
• 4.2        Approaches for heterogenous integration  100
  • 4.2.1    Technology Building Blocks  100
• 4.3        SiP Manufacturing Approaches         101
  • 4.3.1    2.5D Integrated Interposers  102
  • 4.3.2    Multi-Chip Modules   102
  • 4.3.3    3D Stacked packages              103
  • 4.3.4    Fan-Out Wafer Level Packaging        103
  • 4.3.5    Flip Chip Package-on-Package          103
• 4.4        SiP Component Integration  104
• 4.5        Heterogeneous Integration Drivers  104
• 4.6        Trends Driving SiP Adoption 105
• 4.7        SiP Applications           107
• 4.8        SiP Industry Landscape          107
• 4.9        Future Outlook on Heterogeneous Integration        108
• 4.10     CPO (Co-Packaged Optics)  110
  • 4.10.1 Co-packaging approaches   110
  • 4.10.2 Heterogeneous integration of EIC and PIC 111
  • 4.10.3 Advantages and limitations  112
• 4.11     IC Substrates 113

5             MONOLITHIC 3D IC   113

• 5.1        Overview           114
  • 5.1.1    Transitioning from 2D Systems           114
  • 5.1.2    Motivation for developing monolithic 3D manufacturing 114
  • 5.1.3    Improved M3D Interconnect Density              114
  • 5.1.4    Heterogenous 3D vs Monolithic 3D 116
  • 5.1.5    2D Materials   116
• 5.2        Benefits             117
• 5.3        Challenges      118
• 5.4        Future outlook              118

6             MARKETS AND APPLICATIONS           120

• 6.1        Market value chain     120
  • 6.1.1    SiP OEM/Designers    121
  • 6.1.2    Chiplet OEM/Designer and Chiplet Foundry             121
  • 6.1.3    Chiplet Integrator        122
    • 6.1.3.1 Integrated Device Manufacturers (IDMs)     122
    • 6.1.3.2 Outsourced Semiconductor Assembly and Test (OSAT) Providers             122
  • 6.1.4    Material Suppliers       122
  • 6.1.5    Equipment Suppliers                122
  • 6.1.6    Substrate and PCB suppliers               122
  • 6.1.7    EDA Tools Suppliers   123
  • 6.1.8    Interposer Foundry    123
• 6.2        Packaging trends by market 123
  • 6.2.1    Mobile Devices             124
  • 6.2.2    High-Performance Computing (HPC)             125
  • 6.2.3    Automotive      125
  • 6.2.4    Internet of Things (IoT)             125
  • 6.2.5    Consumer Electronics             126
  • 6.2.6    Aerospace and Defense         126
  • 6.2.7    Medical Devices           126
• 6.3        Design requirements 127
• 6.4        Artificial Intelligence (AI)        128
  • 6.4.1    Challenges in AI           128
  • 6.4.2    Advanced Packaging Solutions         128
    • 6.4.2.1 2.5D and 3D Integration          128
    • 6.4.2.2 Chiplet-based Packaging      129
    • 6.4.2.3 Wafer-Level Packaging (WLP)             129
  • 6.4.3    Addressing AI Challenges through Advanced Packaging  129
    • 6.4.3.1 Processing Power        129
    • 6.4.3.2 Memory Bandwidth   129
    • 6.4.3.3 Energy Efficiency         129
    • 6.4.3.4 Scalability        130
  • 6.4.4    Applications   130
    • 6.4.4.1 Data Center and Cloud Computing 130
    • 6.4.4.2 Edge Devices and IoT                130
    • 6.4.4.3 Healthcare and Medical Devices      130
    • 6.4.4.4 Autonomous Vehicles              130
• 6.5        Mobile Devices             131
  • 6.5.1    Challenges      131
  • 6.5.2    Advanced Packaging Solutions         132
    • 6.5.2.1 System-in-Package (SiP)        132
    • 6.5.2.2 Fan-Out Wafer-Level Packaging (FOWLP)   132
    • 6.5.2.3 3D IC Packaging          132
    • 6.5.2.4 Wafer-Level Chip-Scale Packaging (WLCSP)            132
  • 6.5.3    Addressing Challenges through Advanced Packaging        132
    • 6.5.3.1 Power Consumption and Thermal Management    133
    • 6.5.3.2 Size Constraints          133
    • 6.5.3.3 Cost     133
  • 6.5.4    Applications   133
    • 6.5.4.1 Smartphones 133
    • 6.5.4.2 Tablets                133
    • 6.5.4.3 Wearables       134
    • 6.5.4.4 AR/VR Devices              134
  • 6.5.5    Future trends 134
• 6.6        High Performance Computing (HPC)             135
  • 6.6.1    Challenges      135
  • 6.6.2    Advanced Packaging Solutions for HPC       136
    • 6.6.2.1 2.5D and 3D Integration          136
    • 6.6.2.2 Hybrid bonding             136
    • 6.6.2.3 Multi-Chip Modules (MCMs)               137
    • 6.6.2.4 Chiplet-based Architectures                137
    • 6.6.2.5 Advanced Interconnect Technologies           138
  • 6.6.3    Addressing HPC Challenges through Advanced Packaging            138
    • 6.6.3.1 Performance Scaling 138
    • 6.6.3.2 Power Consumption 138
    • 6.6.3.3 Interconnect Bandwidth        139
    • 6.6.3.4 Reliability         139
  • 6.6.4    Applications   139
    • 6.6.4.1 Supercomputers          140
    • 6.6.4.2 Data Center and Cloud Computing 140
    • 6.6.4.3 Artificial Intelligence and Machine Learning             140
    • 6.6.4.4 Scientific Computing and Simulation            140
    • 6.6.4.5 Co-Packaged Optics 140
      • 6.6.4.5.1           Network Switch            140
      • 6.6.4.5.2           Optical communication in data centers       141
      • 6.6.4.5.3           Thermal Management             141
      • 6.6.4.5.4           Challenges in CPO     141
      • 6.6.4.5.5           Package Structure       141
      • 6.6.4.5.6           Fan-Out Embedded Bridge (FOEB) structure            142
      • 6.6.4.5.7           Advancing Switching and AI Networks          142
  • 6.6.5    Future Trends 143
• 6.7        Automotive Electronics           144
  • 6.7.1    Challenges      144
  • 6.7.2    Advanced Packaging Solutions for Automotive Electronics            145
    • 6.7.2.1 System-in-Package (SiP)        145
    • 6.7.2.2 Flip-Chip and Wafer-Level Packaging (WLP)             145
    • 6.7.2.3 3D Integration and Through-Silicon Vias (TSVs)      145
  • 6.7.3    Addressing Automotive Electronics Challenges through Advanced Packaging 146
    • 6.7.3.1 ADAS/Autonomous driving systems               146
    • 6.7.3.2 Harsh Environment Reliability            146
    • 6.7.3.3 Safety and Reliability 146
    • 6.7.3.4 Miniaturization and Integration          147
    • 6.7.3.5 High-Speed Communication              147
    • 6.7.3.6 Thermal Management             147
  • 6.7.4    Applications   147
    • 6.7.4.1 Advanced Driver Assistance Systems (ADAS) and Autonomous Driving 147
      • 6.7.4.1.1           Radar packaging         148
    • 6.7.4.2 Electric Vehicle (EV) Power Electronics        149
    • 6.7.4.3 Infotainment and Telematics               149
    • 6.7.4.4 Sensors and Actuators            149
  • 6.7.5    Future Trends 150
• 6.8        Internet of Things (IoT) Devices           151
  • 6.8.1    Challenges      151
  • 6.8.2    Advanced Packaging Solutions for IoT Devices        152
    • 6.8.2.1 Wafer-Level Packaging (WLP)             152
    • 6.8.2.2 System-in-Package (SiP)        152
    • 6.8.2.3 Fan-Out Wafer-Level Packaging (FOWLP)   152
    • 6.8.2.4 3D Packaging and Through-Silicon Vias (TSVs)        152
  • 6.8.3    Addressing IoT Device Challenges through Advanced Packaging               153
    • 6.8.3.1 Size Constraints          153
    • 6.8.3.2 Power Consumption 153
    • 6.8.3.3 Cost Pressures             153
    • 6.8.3.4 Integration and Functionality              153
    • 6.8.3.5 Reliability and Robustness   153
  • 6.8.4    Applications   154
    • 6.8.4.1 Wearable Devices       154
    • 6.8.4.2 Smart Home Devices                154
    • 6.8.4.3 Industrial IoT Devices                154
    • 6.8.4.4 Medical IoT Devices   154
  • 6.8.5    Future Trends 155
• 6.9        5G & 6G Communications Infrastructure    156
  • 6.9.1    Challenges      156
  • 6.9.2    Trends in 5G and 6G packaging         156
  • 6.9.3    Advanced Packaging Solutions for 5G and 6G Communications Infrastructure                157
    • 6.9.3.1 Antenna-in-Package (AiP)      157
    • 6.9.3.2 System-in-Package (SiP)        158
    • 6.9.3.3 3D Packaging and Through-Silicon Vias (TSVs)        158
    • 6.9.3.4 Fan-Out Wafer-Level Packaging (FOWLP)   158
  • 6.9.4    Addressing 5G and 6G Infrastructure Challenges through Advanced Packaging              159
    • 6.9.4.1 High-Frequency Operation   159
    • 6.9.4.2 Massive MIMO and Beamforming    160
    • 6.9.4.3 Energy Efficiency         160
    • 6.9.4.4 Cost and Scalability  160
    • 6.9.4.5 Thermal Management             161
  • 6.9.5    Applications   161
    • 6.9.5.1 Base Stations and Small Cells            161
    • 6.9.5.2 Backhaul and Fronthaul Networks  161
    • 6.9.5.3 Edge Computing and Network Slicing           161
    • 6.9.5.4 Satellite and Non-Terrestrial Networks          161
  • 6.9.6    Future Trends 162
• 6.10     Aerospace and Defense Electronics               163
  • 6.10.1 Challenges      163
  • 6.10.2 Advanced Packaging Solutions for Aerospace and Defense Electronics                164
    • 6.10.2.1            3D Packaging and Through-Silicon Vias (TSVs)        164
    • 6.10.2.2            Chip-Scale Packaging (CSP) and Wafer-Level Packaging (WLP)  164
    • 6.10.2.3            Flip-Chip and Ball Grid Array (BGA) Packaging        164
    • 6.10.2.4            Hermetic Packaging and Sealing      164
  • 6.10.3 Addressing Aerospace and Defense Electronics Challenges through Advanced Packaging     164
    • 6.10.3.1            Size, Weight, and Power (SWaP) Optimization         164
    • 6.10.3.2            Harsh Environment Reliability            165
    • 6.10.3.3            High Performance and Speed             165
    • 6.10.3.4            Long-Term Reliability and Maintainability   165
    • 6.10.3.5            Security and Anti-Tamper Features  165
  • 6.10.4 Applications   166
    • 6.10.4.1            Avionics and Flight Control Systems              166
    • 6.10.4.2            Radar and Electronic Warfare Systems        166
    • 6.10.4.3            Satellite Communications and Payload Electronics            166
    • 6.10.4.4            Missile Guidance and Control Electronics 166
  • 6.10.5 Future Trends 166
• 6.11     Medical Electronics   168
  • 6.11.1 Challenges      168
  • 6.11.2 Advanced Packaging Solutions for Medical Electronics    168
    • 6.11.2.1            3D Packaging and Through-Silicon Vias (TSVs)        169
    • 6.11.2.2            Wafer-Level Packaging (WLP) and Chip-Scale Packaging (CSP)  169
    • 6.11.2.3            Flexible and Stretchable Packaging 169
    • 6.11.2.4            Microfluidic Packaging            169
  • 6.11.3 Addressing Medical Electronics Challenges through Advanced Packaging         169
    • 6.11.3.1            Miniaturization              169
    • 6.11.3.2            Biocompatibility          170
    • 6.11.3.3            Reliability         170
    • 6.11.3.4            Power Efficiency          170
    • 6.11.3.5            High Performance       170
  • 6.11.4 Applications   171
    • 6.11.4.1            Implantable Devices 171
    • 6.11.4.2            Wearable Health Monitors    171
    • 6.11.4.3            Diagnostic Imaging Equipment          171
    • 6.11.4.4            Surgical Robotics and Instruments 171
  • 6.11.5 Future Trends 172
• 6.12     Consumer Electronics             173
  • 6.12.1 Challenges      173
  • 6.12.2 Advanced Packaging Solutions for Consumer Electronics              173
    • 6.12.2.1            System-in-Package (SiP)        173
    • 6.12.2.2            Fan-Out Wafer-Level Packaging (FOWLP)   174
    • 6.12.2.3            3D Packaging and Through-Silicon Vias (TSVs)        174
    • 6.12.2.4            Embedded Die Packaging     174
  • 6.12.3 Addressing Consumer Electronics Challenges through Advanced Packaging   174
    • 6.12.3.1            Miniaturization              174
    • 6.12.3.2            Power Efficiency          175
    • 6.12.3.3            High Performance       175
    • 6.12.3.4            Cost Reduction            175
    • 6.12.3.5            Time-to-Market             175
  • 6.12.4 Applications   175
    • 6.12.4.1            Smartphones and Tablets      175
    • 6.12.4.2            Wearables and IoT Devices   176
    • 6.12.4.3            Gaming Consoles and VR/AR Devices           176
    • 6.12.4.4            Smart Home Devices                176
  • 6.12.5 Future Trends 176
• 6.13     Additive manufacturing for advanced packaging  177
• 6.14     Silicon photonics        179

7             GLOBAL MARKET FORECASTS            181

• 7.1        By type                181
• 7.2        By Units & Wafers       184
• 7.3        By market         184
• 7.4        By region           188
• 7.5        3D SoC               191
• 7.6        3D Stacked memory 191
• 7.7        UHD FO / RDL Interposer       192
• 7.8        2.5D Interposers          193
• 7.9        Embedded Si bridge  193

8             MARKET TRENDS        194

• 8.1        Data center      194
• 8.2        AI and Graphics            195
• 8.3        CPU      196
• 8.4        Autonomous vehicles               198
• 8.5        Roadmap         199
  • 8.5.1    Interconnect technology trend           199
  • 8.5.2    By interconnect density and technology node         199
  • 8.5.3    By reticle size 200
  • 8.5.4    By front-end vs back-end       200
  • 8.5.5    By 2.5D and 3D Technology Trends  201
  • 8.5.6    By I/O density, I/O pitch and package size  202
• 8.6        Commercialized Products    203
  • 8.6.1    3D Memory     203
  • 8.6.2    GPU      204
    • 8.6.2.1 Nvidia Hopper and Blackwell              204
    • 8.6.2.2 AMD Instinct MI300 series    205
    • 8.6.2.3 Intel Jaguar Shores     206
  • 8.6.3    AI ASICs             206
    • 8.6.3.1 Intel Gaudi 2 & 3          206
    • 8.6.3.2 Google TPU     207
    • 8.6.3.3 Amazon Trainium & Inferentia             208
    • 8.6.3.4 Microsoft Azure Maia 100      209
    • 8.6.3.5 Huawei Ascend Series             209
  • 8.6.4    CPU      210
    • 8.6.4.1 AMD Ryzen AI Max Pro 300   210
    • 8.6.4.2 AMD Ryzen & EPYC    211
    • 8.6.4.3 AWS Graviton 212
    • 8.6.4.4 Intel Emerald Rapids 213
    • 8.6.4.5 Intel Meteor Lake         214
    • 8.6.4.6 Intel Arrow Lake & Lunar Lake             215

9             MARKET PLAYERS       216

• 9.1        Integrated Device Manufacturers     217
• 9.2        Outsourced Semiconductor Assembly and Test (OSAT) Companies        218
• 9.3        Foundries         220
• 9.4        Electronics OEMs       223
• 9.5        Packaging Equipment and Materials Companies  225

10          MARKET CHALLENGES            226

11          COMPANY PROFILES                227 (128 company profiles)

12          RESEARCH METHODOLOGY              322

13          REFERENCES 322

List of Tables

• Table 1. Evolution of semiconductor packaging.   21
• Table 2. Summary of key advanced semiconductor packaging approaches.      25
• Table 3. Key Technology Trends in Advanced Semiconductor Packaging.             27
• Table 4. Market Growth Drivers for advanced semiconductor packaging.            28
• Table 5. Challenges Facing Advanced Packaging Adoption.           29
• Table 6. Challenges in transistor scaling.    38
• Table 7. Use cases and benefits of using chiplets in semiconductor design.      42
• Table 8.  Specifications of interconnection methods.         45
• Table 9. Interconnection technique in semiconductor packaging              45
• Table 10. Passive vs active interposer.          47
• Table 11. TSMC Interposer comparison.      47
• Table 12. Comparative benchmark overview table of key semiconductor interconnection technologies                49
• Table 13. Fan-out packaging process overview.      53
• Table 14. Comparison between mainstream silicon dioxide (SiO2) and leading organic dielectrics for electronic interconnect substrates.               56
• Table 15. Benefits of glass in 2.5D glass-based packaging.            58
• Table 16. Comparison between key properties of glass and polymer molding compounds commonly used in semiconductor packaging applications.   62
• Table 17. Challenges of glass semiconductor packaging.               64
• Table 18. Comparison between silicon, organic laminates and glass as packaging substrates.            64
• Table 19. 2.5D vs. 3D packaging.      65
• Table 20. 2.5D packaging challenges.           66
• Table 21. Market players in 2.5D packaging.             67
• Table 22. Advantages and disadvantages of 3D packaging.           69
• Table 23. Comparison between 2.5D, 3D micro bump, and 3D hybrid bonding.               72
• Table 24. Challenges in 3D Hybrid Bonding.             72
• Table 25. Challenges in scaling bumps.       74
• Table 26. Key methods for enabling copper-to-copper (Cu-Cu) hybrid bonding in advanced semiconductor packaging:  75
• Table 27. Micro bumps vs Cu-Cu bumpless hybrid bonding.         75
• Table 28. W2W vs D2W vs collective D2W – process and comparison.  78
• Table 29. Comparison of WLP and PLP for large package size.     79
• Table 30. Benefits of Wafer-Level Packaging.           79
• Table 31. Types of wafer level packaging.   80
• Table 32. Key trends shaping wafer level packaging.           95
• Table 33. Packaging approaches utilized for assembling System-in-Package modules.              101
• Table 34. Considerations for integrating key component categories into system-in-package (SiP) modules/          104
• Table 35. Key factors driving adoption of heterogeneous integration through SiPs and multi-die packages.        105
• Table 36. Key trends influencing adoption of System-in-Package modules.        105
• Table 37.  System-in-package (SiP) module applications.               107
• Table 38. Comparison between heterogeneous 3D integration and monolithic 3D integration.              116
• Table 39.  Key 2D materials in monolithic 3D integrated circuits. 116
• Table 40. Benefits of monolithic 3D ICs.      118
• Table 41. Challenges of monolithic 3D ICs.               118
• Table 42. Advanced semiconductor packaging trends by market.              123
• Table 43. Design requirements in advanced packaging, by market.          127
• Table 44. Global market for Advanced semiconductor packaging, 2020-2035, by packaging type, (billions USD).               181
• Table 45. Global market for Advanced semiconductor packaging, 2020-2035, by Units & Wafers, (billions USD).               184
• Table 46. Global market for Advanced semiconductor packaging, 2020-2035, by end use market (billions USD).               185
• Table 47. Recent expansion activities by companies in Malaysia.              188
• Table 48. Global market for Advanced semiconductor packaging, 2020-2035, by region (billions USD).                189
• Table 49. Main Global Wafer Foundry Companies 2023.  221
• Table 50. Market challenges for advanced semiconductor packaging.   226
• Table 51. AMD AI chip range.               231
• Table 52.  Intel's products that adopt 3D FOVEROS.            274

List of Figures

• Figure 1. Timeline of different packaging technologies.     22
• Figure 2. Evolution roadmap for semiconductor packaging.          24
• Figure 3. Semiconductor Supply Chain.      26
• Figure 4. Advanced packaging supply chain.            27
• Figure 5. Scaling technology roadmap.        38
• Figure 6. Wafer-level chip scale packaging (WLCSP)           39
• Figure 7. Embedded wafer-level ball grid array (eWLB).     40
• Figure 8. Fan-out wafer-level packaging (FOWLP).               41
• Figure 9. Chiplet design.         42
• Figure 10. Chiplet SoC.           44
• Figure 11. 2D chip packaging.            50
• Figure 12. Typical structure of 2.5D IC package utilizing interposer.          51
• Figure 13. Fan-out chip-first process flow and Fan-out chip-last process flow. 55
• Figure 14. Manufacturing process for glass interposers.   60
• Figure 15. 3D Glass Panel Embedding (GPE) package.      62
• Figure 16. Typical FOWLP structure.               83
• Figure 17. System-in-Package (SiP) for HI.  99
• Figure 18. 2.5D chiplet integration. 102
• Figure 19. Advanced packaging supply chain.         121
• Figure 20. Packaging of sensors used in advanced driver assistance systems (ADAS) and autonomous driving.               150
• Figure 21. Global market for Advanced semiconductor packaging, 2020-2035, by packaging type, (billions USD).               183
• Figure 22. Global market for Advanced semiconductor packaging, 2020-2035, by Units & Wafers, (billions USD).               184
• Figure 23. Global market for Advanced semiconductor packaging, 2020-2035, by end use market (billions USD).               187
• Figure 24. Global market for Advanced semiconductor packaging, 2020-2035, by region (billions USD).                190
• Figure 25. Absolic glass substrate.  229
• Figure 26. AMD Radeon Instinct.       231
• Figure 27. AMD Ryzen 7040. 231
• Figure 28. Alveo V70. 231
• Figure 29. Versal Adaptive SOC.        232
• Figure 30. AMD’s MI300 chip.              232
• Figure 31. 12-layer HBM3.     305

The Global Advanced Semiconductor Packaging Market 2025-2035

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The Global Advanced Semiconductor Packaging Market 2025-2035

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