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The Global Market for Advanced Semiconductor Packaging 2027-2037

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  • Published: June 2026
  • Pages: 339
  • Tables: 79
  • Figures: 28

 

Advanced semiconductor packaging has become one of the most strategically important domains in the entire electronics industry. As the performance, power, and economic returns from transistor scaling diminish at the leading edge, the package itself has emerged as the primary lever for improving system performance. Where computing capability once came chiefly from shrinking devices, it now comes increasingly from how dies are interconnected, how closely memory is placed to compute, and how many heterogeneous components can be integrated into a single package. This shift has elevated packaging from a back-end, cost-driven step to a value-defining stage of semiconductor design and manufacture.

The principal driver of this transformation is artificial intelligence. AI training and inference demand enormous memory bandwidth, dense die-to-die connectivity, and efficient power delivery, pushing 2.5D and 3D architectures, high-bandwidth memory, and ever-larger package formats into the mainstream. These requirements have made advanced packaging both a key enabler of, and a critical bottleneck for, the most demanding computing systems. The technology landscape is defined by several converging vectors: copper-to-copper hybrid bonding, which enables extraordinarily fine-pitch vertical interconnects; chiplet-based, heterogeneous integration that combines logic, memory, analog, and increasingly photonics from different process nodes; glass substrates and interposers as a new high-end platform; panel-level processing for larger and more cost-effective packages; and co-packaged optics, which brings the optical interface directly into the package.

Underpinning these trends is a deep and increasingly contested ecosystem spanning integrated device manufacturers, foundries, outsourced assembly and test providers, memory makers, equipment and materials suppliers, and a fast-growing optical-interconnect sector. The industry is also experiencing significant structural change, including the partial reshoring of leading-edge packaging capacity, the rise of hyperscaler custom silicon, and growing collaboration across the value chain as the complexity of integration intensifies. Materials innovation, thermal management, and design-stage co-optimisation have become essential disciplines rather than peripheral concerns.

At the same time, the field faces substantial challenges: yield and cost at large package formats, manufacturing maturity for glass and panel processing, thermal density in tightly integrated stacks, optical alignment and test for co-packaged optics, standardisation of die-to-die interfaces, and a concentrated, capital-intensive supply chain. Despite these hurdles, advanced packaging is firmly established as a foundational technology for next-generation computing, communications, automotive, and consumer systems, and its strategic significance is expected to deepen throughout the coming decade.

The Global Market for Advanced Semiconductor Packaging 2027–2037 provides a comprehensive analysis of the advanced semiconductor packaging industry, examining the technologies, materials, applications, market trends, competitive landscape, and outlook that will shape the sector through 2037. As gains from transistor scaling diminish at the leading edge, advanced packaging has become the primary lever for system performance, and this report maps the technologies and players driving that shift across AI, high-performance computing, automotive, mobile, and consumer markets. It combines technical depth with market analysis, supported by detailed forecasts and an extensive directory of company profiles.

The report covers:

  • Executive summary — technology overview, evolution of packaging, supply chains, key technology trends, growth drivers, competitive landscape, market challenges, and future outlook.
  • Semiconductor packaging technologies — transistor device scaling and the sub-2nm paradox; wafer-level and fan-out packaging; chiplets and disaggregation; interconnection methods; interposer technologies including silicon, organic, silicon bridge, and glass; 2.5D and 3D packaging; copper-to-copper hybrid bonding, including low- and room-temperature processes; and die-to-die I/O.
  • Wafer-level packaging — WLCSP, fan-out, fan-in, panel-level packaging, manufacturing processes, trends, and applications.
  • System-in-package and heterogeneous integration — integration approaches, manufacturing methods, drivers, applications, IC substrates, and co-packaged optics.
  • Monolithic 3D ICs — architectures, 2D materials, benefits, and challenges.
  • Markets and applications — mobile, HPC, AI, automotive (including ADAS and EV power electronics), IoT, medical, consumer, aerospace and defense, additive manufacturing, and silicon photonics.
  • Glass substrates and interposers — benefits, material properties, TGV formation and metallisation, panel processing, supplier roadmaps, and technical challenges.
  • Co-packaged optics — co-packaging approaches, EIC/PIC integration, couplers, advantages and limitations, time to market, and company technologies.
  • Thermal interface materials — candidates, roadmaps, and applications.
  • Global market forecasts — by packaging type, units and wafers, end-use market, region, and by 3D SoC, 3D stacked memory, UHD FO/RDL interposer, 2.5D interposers, and embedded silicon bridge.
  • Market trends and roadmaps — data center, AI and graphics, CPU, autonomous vehicles, interconnect and node roadmaps, and commercialized products across GPUs, AI ASICs, CPUs, and CPO switches.
  • Market players, challenges, and company profiles — covering IDMs, foundries, OSATs, OEMs, equipment, materials, and substrate suppliers. Companies profiled include AaltoSemi, Absolics, ACCRETECH, Adeia, Advanced Micro Devices (AMD), Ajinomoto, Alphawave Semi, Amkor Technology, Analog Devices, AMQ Intelligent, Apple, Applied Materials, Ardentec, ARM, ASE, ASMPT, Astera Labs, Ayar Labs, Besi, Biren Technology, Blue Ocean Smart System, Brewer Science, Broadcom, BroadPak, Cadence, Cambricon, Capcon, CAS Microelectronics, CD Micro-Technology, CEA-Leti, Celestial AI, Cerebras, China Wafer Level CSP, Chipbond, Chipletz, ChipMOS, Coherent, Corning, Dai Nippon Printing (DNP), Dewo Advanced Automation, Disco, DuPont, Ebara, Eliyan, EMC Semiconductor, EPS Technology, Entegris, EV Group, GlobalFoundries, Global Unichip, Gloway, Goldenscope, Gona, Graphcore, Greatek, Hangke, Hanmi Semiconductor, HD Microsystems, HiSilicon, HLMC, Huatian, Huawei, Ibiden, IBM, ICLeague, imec, Indium Corporation, Infineon, Integra, Inari Amertron, Intel, JCET, Jiangsu ICAT, Jingdu, Keyang, King Yuan, Kioxia, KyLitho, Kyocera, Lam Research, Lapis, LB Semicon, Leading Interconnect, LG Innotek, Lidrotec, Lightmatter, Lumentum, Lux Semiconductors, Malaysian Pacific Industries, Marvell, Micron, MediaTek, Meta, Micross, Mitsubishi, NCAP China, NEC, Nippon Electric Glass (NEG), Nepes, Nvidia, Onsemi, Orient Semiconductor, Panasonic, Plan Optik, Powertech, Pragmatic, Qorvo, Renesas, RMT, Rohm, Rong, Samsung Electronics, Samtec, Schott, Sharp, Shinko, Showa Denko/Resonac, Sigurd, Silicon Box, SPIL, SJ Semiconductor, SK Hynix, Skywater, SMIC, Sony, Starmask, STMicroelectronics, Suss Microtec, Synopsys, SZLQ, Taiwan Semiconductor Manufacturing Company (TSMC), Techsense, Tezzaron, Tokyo Electron (TEL), Tongfu, Texas Instruments, Tokyo Seimitsu, Tong Hsing, Toppan, Toray, Toshiba, Tower Semiconductor, UMC, Unimicron, Unisem, UTAC, Walton, Winstek, Xinhe, Yibu, and Yuehai.

 

Purchasers will receive the following:

  • PDF report download/by email. 
  • Comprehensive Excel spreadsheet of all data.
  • Mid-year Update

 

The Global Market for Advanced Semiconductor Packaging 2027-2037
The Global Market for Advanced Semiconductor Packaging 2027-2037
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The Global Market for Advanced Semiconductor Packaging 2027-2037
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1             EXECUTIVE SUMMARY            20

  • 1.1        Semiconductor Packaging Technology Overview   20
    • 1.1.1    Key challenges              21
    • 1.1.2    Evolution of semiconductor packaging        22
      • 1.1.2.1 From 1D to 3D               23
    • 1.1.3    Conventional packaging approaches            24
    • 1.1.4    Advanced packaging approaches    25
  • 1.2        Semiconductor Supply Chain            26
  • 1.3        Advanced Packaging Supply Chain 27
  • 1.4        Key Technology Trends in Advanced Packaging      28
  • 1.5        Market Growth Drivers             29
  • 1.6        Competitive Landscape         29
  • 1.7        Market Challenges     30
  • 1.8        Future outlook              31
    • 1.8.1    Heterogeneous Integration   31
    • 1.8.2    Chiplets and Die Disaggregation      32
    • 1.8.3    Advanced Interconnects        32
    • 1.8.4    Scaling and Miniaturization  33
    • 1.8.5    Thermal Management             33
    • 1.8.6    Materials Innovation 34
    • 1.8.7    Supply Chain Developments               34
    • 1.8.8    Role of Simulation and Data Analytics          35

 

2             SEMICONDUCTOR PACKAGING TECHNOLOGIES 36

  • 2.1        Transistor Device Scaling       36
    • 2.1.1    Overview           36
    • 2.1.2    Heterogeneous Architecture Transition       37
    • 2.1.3    Co-Design Focus Areas          37
  • 2.2        Wafer Level Packaging            39
  • 2.3        Fan-Out Wafer Level Packaging        41
  • 2.4        Chiplets             42
    • 2.4.1    AMD EPYC and Ryzen processor families   44
    • 2.4.2    Disaggregation Needs              45
  • 2.5        Interconnection in Semiconductor Packaging        46
    • 2.5.1    Overview           47
    • 2.5.2    Wire Bonding 47
    • 2.5.3    Flip-chip bonding        48
    • 2.5.4    Interposer         48
      • 2.5.4.1 Interposer technology comparison 49
      • 2.5.4.2 Glass interposer          49
        • 2.5.4.2.1           Technical challenge of glass interposer        50
        • 2.5.4.2.2           Different Interposer material comparison  50
    • 2.5.5    Through-silicon via (TSV) bonding    51
    • 2.5.6    Hybrid bonding with chiplets               51
    • 2.5.7    Re-architecting die-to-die I/O             52
  • 2.6        2.5D and 3D Packaging           52
    • 2.6.1    2.5D packaging            52
      • 2.6.1.1 Overview           52
        • 2.6.1.1.1           Silicon Interposer 2.5D           54
          • 2.6.1.1.1.1      Through Si Via (TSV)   54
          • 2.6.1.1.1.2      (SiO2) based redistribution layers (RDLs)   55
        • 2.6.1.1.2           2.5D Organic-based packaging         56
          • 2.6.1.1.2.1      Chip-first and chip-last fan-out packaging 57
          • 2.6.1.1.2.2      Organic substrates     58
          • 2.6.1.1.2.3      Organic RDL   59
        • 2.6.1.1.3           2.5D glass-based packaging               60
          • 2.6.1.1.3.1      Benefits             61
          • 2.6.1.1.3.2      Glass Si interposers in advanced packaging            62
          • 2.6.1.1.3.3      Glass material properties      63
          • 2.6.1.1.3.4      2/2 μm line/space metal pitch on glass substrates              64
          • 2.6.1.1.3.5      3D Glass Panel Embedding (GPE) packaging           65
          • 2.6.1.1.3.6      Thermal management             66
          • 2.6.1.1.3.7      Polymer dielectric films          67
          • 2.6.1.1.3.8      Challenges      67
          • 2.6.1.1.3.9      Comparison with other substrates  68
          • 2.6.1.1.3.10   TGV formation and metallisation      68
        • 2.6.1.1.4           2.5D vs. 3D Packaging             69
      • 2.6.1.2 Benefits             70
      • 2.6.1.3 Challenges      70
      • 2.6.1.4 Trends 70
      • 2.6.1.5 Market players               71
    • 2.6.2    3D packaging 72
      • 2.6.2.1 Conventional 3D packaging 73
      • 2.6.2.2 Advanced 3D Packaging with through-silicon vias (TSVs) 74
      • 2.6.2.3 W2W vs D2W vs Collective D2W       75
      • 2.6.2.4 Direct Molecular Bonding     76
      • 2.6.2.5 3D Interconnect Trends           77
      • 2.6.2.6 Hybrid Bonding            78
        • 2.6.2.6.1           Devices using hybrid bonding             78
        • 2.6.2.6.2           Fusion Bond   80
        • 2.6.2.6.3           Low- and room-temperature Cu-Cu bonding           81
        • 2.6.2.6.4           Devices using hybrid bonding             81
      • 2.6.2.7 3D stacking supply chain       82
      • 2.6.2.8 3D Microbump technology    83
        • 2.6.2.8.1           Technologies  83
        • 2.6.2.8.2           Challenges      84
        • 2.6.2.8.3           Bumpless copper-to-copper (Cu-Cu) hybrid bonding        84
      • 2.6.2.9 Trends 86
        • 2.6.2.9.1           Memory drives the next wave              87
        • 2.6.2.9.2           Low- and room-temperature Cu-Cu bonding           87

 

3             WAFER-LEVEL PACKAGING  88

  • 3.1        Introduction    88
    • 3.1.1    WLP to PLP      88
  • 3.2        Benefits             88
  • 3.3        Types of Wafer Level Packaging        89
    • 3.3.1    Wafer Level Chip Scale Packaging  90
      • 3.3.1.1 Overview           90
      • 3.3.1.2 Advantages     90
      • 3.3.1.3 Applications   91
    • 3.3.2    Wafer Level Fan-Out Packaging        91
      • 3.3.2.1 Overview           91
      • 3.3.2.2 Advantages     92
      • 3.3.2.3 Applications   93
    • 3.3.3    Wafer Level Fan-In Packaging             94
      • 3.3.3.1 Overview           94
      • 3.3.3.2 Advantages     94
      • 3.3.3.3 Applications   95
    • 3.3.4    Other Types of WLP    95
      • 3.3.4.1 Cu-Pillar Flip Chip      95
      • 3.3.4.2 Advantages     95
        • 3.3.4.2.1           Applications   96
      • 3.3.4.3 Embedded Wafer Level BGA (eWLB)              97
      • 3.3.4.4 Advantages     97
        • 3.3.4.4.1           Applications   98
      • 3.3.4.5 Chip-last FO-WLP       98
        • 3.3.4.5.1           Advantages     98
        • 3.3.4.5.2           Applications   99
      • 3.3.4.6 Wafer-on-Wafer (WoW)          100
        • 3.3.4.6.1           Applications   100
  • 3.4        WLP Manufacturing Processes          101
    • 3.4.1    Wafer Preparation       101
    • 3.4.2    RDL Buildup   102
    • 3.4.3    Bumping           102
    • 3.4.4    Encapsulation               102
    • 3.4.5    Integration       103
    • 3.4.6    Test and Singulation  103
  • 3.5        Wafer Level Packaging Trends            103
  • 3.6        Applications of Wafer Level Packaging         105
    • 3.6.1    Mobile and Consumer Electronics  105
    • 3.6.2    Automotive Electronics           105
    • 3.6.3    IoT and Industrial         105
    • 3.6.4    High Performance Computing            105
    • 3.6.5    Aerospace and Defense         105
  • 3.7        Wafer Level Packaging Outlook         106

 

4             SYSTEM-IN-PACKAGE AND HETEROGENEOUS INTEGRATION     107

  • 4.1        Introduction    107
  • 4.2        Approaches for heterogenous integration  108
    • 4.2.1    Technology Building Blocks  108
  • 4.3        SiP Manufacturing Approaches         110
    • 4.3.1    2.5D Integrated Interposers  110
    • 4.3.2    Multi-Chip Modules   110
    • 4.3.3    3D Stacked packages              111
    • 4.3.4    Fan-Out Wafer Level Packaging        111
    • 4.3.5    Flip Chip Package-on-Package          111
  • 4.4        SiP Component Integration  112
  • 4.5        Heterogeneous Integration Drivers  112
  • 4.6        Trends Driving SiP Adoption 113
  • 4.7        SiP Applications           114
  • 4.8        SiP Industry Landscape          115
  • 4.9        Future Outlook on Heterogeneous Integration        116
  • 4.10     CPO (Co-Packaged Optics)  117
    • 4.10.1 Co-packaging approaches   118
    • 4.10.2 Heterogeneous integration of EIC and PIC 118
    • 4.10.3 Interconnect Technology (in CPO)   119
    • 4.10.4 Type of couplers           119
    • 4.10.5 Advantages and limitations  120
    • 4.10.6 CPO technologies, by company        120
  • 4.11     IC Substrates 121

 

5             MONOLITHIC 3D IC   122

  • 5.1        Overview           122
    • 5.1.1    Transitioning from 2D Systems           122
    • 5.1.2    Motivation for developing monolithic 3D manufacturing 122
    • 5.1.3    Improved M3D Interconnect Density              122
    • 5.1.4    Heterogenous 3D vs Monolithic 3D 124
    • 5.1.5    2D Materials   124
  • 5.2        Benefits             125
  • 5.3        Challenges      126
  • 5.4        Future outlook              126

 

6             MARKETS AND APPLICATIONS           128

  • 6.1        Market value chain     128
    • 6.1.1    SiP OEM/Designers    129
    • 6.1.2    Chiplet OEM/Designer and Chiplet Foundry             129
    • 6.1.3    Chiplet Integrator        129
      • 6.1.3.1 Integrated Device Manufacturers (IDMs)     130
      • 6.1.3.2 Outsourced Semiconductor Assembly and Test (OSAT) Providers             130
    • 6.1.4    Material Suppliers       130
    • 6.1.5    Equipment Suppliers                130
    • 6.1.6    Substrate and PCB suppliers               130
    • 6.1.7    EDA Tools Suppliers   130
    • 6.1.8    Interposer Foundry    131
  • 6.2        Packaging trends by market 131
    • 6.2.1    Mobile Devices             132
    • 6.2.2    High-Performance Computing (HPC)             132
    • 6.2.3    Automotive      133
    • 6.2.4    Internet of Things (IoT)             133
    • 6.2.5    Consumer Electronics             133
    • 6.2.6    Aerospace and Defense         134
    • 6.2.7    Medical Devices           134
  • 6.3        Design requirements 135
  • 6.4        Artificial Intelligence (AI)        136
    • 6.4.1    Challenges in AI           136
    • 6.4.2    Advanced Packaging Solutions         136
      • 6.4.2.1 2.5D and 3D Integration          136
      • 6.4.2.2 Chiplet-based Packaging      136
      • 6.4.2.3 Wafer-Level Packaging (WLP)             137
    • 6.4.3    Addressing AI Challenges through Advanced Packaging  137
      • 6.4.3.1 Processing Power        137
      • 6.4.3.2 Memory Bandwidth   137
      • 6.4.3.3 Energy Efficiency         137
      • 6.4.3.4 Scalability        137
    • 6.4.4    Applications   138
      • 6.4.4.1 Data Center and Cloud Computing 138
      • 6.4.4.2 Edge Devices and IoT                138
      • 6.4.4.3 Healthcare and Medical Devices      138
      • 6.4.4.4 Autonomous Vehicles              138
  • 6.5        Mobile Devices             139
    • 6.5.1    Challenges      139
    • 6.5.2    Advanced Packaging Solutions         139
      • 6.5.2.1 System-in-Package (SiP)        139
      • 6.5.2.2 Fan-Out Wafer-Level Packaging (FOWLP)   140
      • 6.5.2.3 3D IC Packaging          140
      • 6.5.2.4 Wafer-Level Chip-Scale Packaging (WLCSP)            140
    • 6.5.3    Addressing Challenges through Advanced Packaging        140
      • 6.5.3.1 Power Consumption and Thermal Management    140
      • 6.5.3.2 Size Constraints          140
      • 6.5.3.3 Cost     141
    • 6.5.4    Applications   141
      • 6.5.4.1 Smartphones 141
      • 6.5.4.2 Tablets                141
      • 6.5.4.3 Wearables       141
      • 6.5.4.4 AR/VR Devices              141
    • 6.5.5    Future trends 142
  • 6.6        High Performance Computing (HPC)             142
    • 6.6.1    Challenges      143
    • 6.6.2    Advanced Packaging Solutions for HPC       143
      • 6.6.2.1 2.5D and 3D Integration          143
      • 6.6.2.2 Hybrid bonding             144
      • 6.6.2.3 Multi-Chip Modules (MCMs)               145
      • 6.6.2.4 Chiplet-based Architectures                145
      • 6.6.2.5 Advanced Interconnect Technologies           145
    • 6.6.3    Addressing HPC Challenges through Advanced Packaging            145
      • 6.6.3.1 Performance Scaling 145
      • 6.6.3.2 Power Consumption 146
      • 6.6.3.3 Interconnect Bandwidth        146
      • 6.6.3.4 Reliability         147
    • 6.6.4    Applications   147
      • 6.6.4.1 Supercomputers          147
      • 6.6.4.2 Data Center and Cloud Computing 147
      • 6.6.4.3 Artificial Intelligence and Machine Learning             147
      • 6.6.4.4 Scientific Computing and Simulation            147
      • 6.6.4.5 Co-Packaged Optics 148
        • 6.6.4.5.1           Network Switch            148
        • 6.6.4.5.2           Optical communication in data centers       148
        • 6.6.4.5.3           Thermal Management             148
        • 6.6.4.5.4           Challenges in CPO     148
        • 6.6.4.5.5           Package Structure       149
        • 6.6.4.5.6           Fan-Out Embedded Bridge (FOEB) structure            150
        • 6.6.4.5.7           Advancing Switching and AI Networks          150
        • 6.6.4.5.8           Making on-chip photonics manufacturable              151
    • 6.6.5    Thermal Interface Materials 151
    • 6.6.6    Future Trends 151
  • 6.7        Automotive Electronics           152
    • 6.7.1    Challenges      152
    • 6.7.2    Advanced Packaging Solutions for Automotive Electronics            153
      • 6.7.2.1 System-in-Package (SiP)        153
      • 6.7.2.2 Flip-Chip and Wafer-Level Packaging (WLP)             153
      • 6.7.2.3 3D Integration and Through-Silicon Vias (TSVs)      154
    • 6.7.3    Addressing Automotive Electronics Challenges through Advanced Packaging 154
      • 6.7.3.1 ADAS/Autonomous driving systems               154
      • 6.7.3.2 Harsh Environment Reliability            154
      • 6.7.3.3 Safety and Reliability 155
      • 6.7.3.4 Miniaturization and Integration          155
      • 6.7.3.5 High-Speed Communication              155
      • 6.7.3.6 Thermal Management             155
    • 6.7.4    Applications   155
      • 6.7.4.1 Advanced Driver Assistance Systems (ADAS) and Autonomous Driving 155
        • 6.7.4.1.1           Radar packaging         157
      • 6.7.4.2 Electric Vehicle (EV) Power Electronics        157
      • 6.7.4.3 Infotainment and Telematics               158
      • 6.7.4.4 Sensors and Actuators            158
    • 6.7.5    Future Trends 159
  • 6.8        Internet of Things (IoT) Devices           160
    • 6.8.1    Challenges      160
    • 6.8.2    Advanced Packaging Solutions for IoT Devices        160
      • 6.8.2.1 Wafer-Level Packaging (WLP)             160
      • 6.8.2.2 System-in-Package (SiP)        161
      • 6.8.2.3 Fan-Out Wafer-Level Packaging (FOWLP)   161
      • 6.8.2.4 3D Packaging and Through-Silicon Vias (TSVs)        161
    • 6.8.3    Addressing IoT Device Challenges through Advanced Packaging               161
      • 6.8.3.1 Size Constraints          161
      • 6.8.3.2 Power Consumption 161
      • 6.8.3.3 Cost Pressures             162
      • 6.8.3.4 Integration and Functionality              162
      • 6.8.3.5 Reliability and Robustness   162
    • 6.8.4    Applications   162
      • 6.8.4.1 Wearable Devices       162
      • 6.8.4.2 Smart Home Devices                163
      • 6.8.4.3 Industrial IoT Devices                163
      • 6.8.4.4 Medical IoT Devices   163
    • 6.8.5    Future Trends 163
  • 6.9        5G & 6G Communications Infrastructure    164
    • 6.9.1    Challenges      164
    • 6.9.2    Trends in 5G and 6G packaging         165
    • 6.9.3    Advanced Packaging Solutions for 5G and 6G Communications Infrastructure                165
      • 6.9.3.1 Antenna-in-Package (AiP)      165
      • 6.9.3.2 System-in-Package (SiP)        166
      • 6.9.3.3 3D Packaging and Through-Silicon Vias (TSVs)        167
      • 6.9.3.4 Fan-Out Wafer-Level Packaging (FOWLP)   167
    • 6.9.4    Addressing 5G and 6G Infrastructure Challenges through Advanced Packaging              167
      • 6.9.4.1 High-Frequency Operation   167
      • 6.9.4.2 Massive MIMO and Beamforming    168
      • 6.9.4.3 Energy Efficiency         169
      • 6.9.4.4 Cost and Scalability  169
      • 6.9.4.5 Thermal Management             169
    • 6.9.5    Applications   169
      • 6.9.5.1 Base Stations and Small Cells            169
      • 6.9.5.2 Backhaul and Fronthaul Networks  169
      • 6.9.5.3 Edge Computing and Network Slicing           170
      • 6.9.5.4 Satellite and Non-Terrestrial Networks          170
    • 6.9.6    Future Trends 170
  • 6.10     Aerospace and Defense Electronics               171
    • 6.10.1 Challenges      171
    • 6.10.2 Advanced Packaging Solutions for Aerospace and Defense Electronics                172
      • 6.10.2.1            3D Packaging and Through-Silicon Vias (TSVs)        172
      • 6.10.2.2            Chip-Scale Packaging (CSP) and Wafer-Level Packaging (WLP)  172
      • 6.10.2.3            Flip-Chip and Ball Grid Array (BGA) Packaging        172
      • 6.10.2.4            Hermetic Packaging and Sealing      172
    • 6.10.3 Addressing Aerospace and Defense Electronics Challenges through Advanced Packaging     173
      • 6.10.3.1            Size, Weight, and Power (SWaP) Optimization         173
      • 6.10.3.2            Harsh Environment Reliability            173
      • 6.10.3.3            High Performance and Speed             173
      • 6.10.3.4            Long-Term Reliability and Maintainability   173
      • 6.10.3.5            Security and Anti-Tamper Features  174
    • 6.10.4 Applications   174
      • 6.10.4.1            Avionics and Flight Control Systems              174
      • 6.10.4.2            Radar and Electronic Warfare Systems        174
      • 6.10.4.3            Satellite Communications and Payload Electronics            174
      • 6.10.4.4            Missile Guidance and Control Electronics 175
    • 6.10.5 Future Trends 175
  • 6.11     Medical Electronics   176
    • 6.11.1 Challenges      176
    • 6.11.2 Advanced Packaging Solutions for Medical Electronics    177
      • 6.11.2.1            3D Packaging and Through-Silicon Vias (TSVs)        177
      • 6.11.2.2            Wafer-Level Packaging (WLP) and Chip-Scale Packaging (CSP)  177
      • 6.11.2.3            Flexible and Stretchable Packaging 177
      • 6.11.2.4            Microfluidic Packaging            177
    • 6.11.3 Addressing Medical Electronics Challenges through Advanced Packaging         178
      • 6.11.3.1            Miniaturization              178
      • 6.11.3.2            Biocompatibility          178
      • 6.11.3.3            Reliability         178
      • 6.11.3.4            Power Efficiency          178
      • 6.11.3.5            High Performance       178
    • 6.11.4 Applications   179
      • 6.11.4.1            Implantable Devices 179
      • 6.11.4.2            Wearable Health Monitors    179
      • 6.11.4.3            Diagnostic Imaging Equipment          179
      • 6.11.4.4            Surgical Robotics and Instruments 179
    • 6.11.5 Future Trends 180
  • 6.12     Consumer Electronics             181
    • 6.12.1 Challenges      181
    • 6.12.2 Advanced Packaging Solutions for Consumer Electronics              182
      • 6.12.2.1            System-in-Package (SiP)        182
      • 6.12.2.2            Fan-Out Wafer-Level Packaging (FOWLP)   182
      • 6.12.2.3            3D Packaging and Through-Silicon Vias (TSVs)        182
      • 6.12.2.4            Embedded Die Packaging     182
    • 6.12.3 Addressing Consumer Electronics Challenges through Advanced Packaging   183
      • 6.12.3.1            Miniaturization              183
      • 6.12.3.2            Power Efficiency          183
      • 6.12.3.3            High Performance       183
      • 6.12.3.4            Cost Reduction            183
      • 6.12.3.5            Time-to-Market             183
    • 6.12.4 Applications   184
      • 6.12.4.1            Smartphones and Tablets      184
      • 6.12.4.2            Wearables and IoT Devices   184
      • 6.12.4.3            Gaming Consoles and VR/AR Devices           184
      • 6.12.4.4            Smart Home Devices                184
    • 6.12.5 Future Trends 185
  • 6.13     Additive manufacturing for advanced packaging  186
  • 6.14     Silicon photonics        187

 

7             GLOBAL MARKET FORECASTS            189

  • 7.1        By type                189
  • 7.2        By Units & Wafers       190
  • 7.3        By end-use market     190
  • 7.4        By region           191
  • 7.5        3D SoC               192
  • 7.6        3D Stacked memory 193
  • 7.7        UHD FO / RDL Interposer       193
  • 7.8        2.5D Interposers          193
  • 7.9        Embedded Si bridge  194

 

8             MARKET TRENDS        195

  • 8.1        Data center      195
  • 8.2        AI and Graphics            195
  • 8.3        CPU      195
  • 8.4        Autonomous vehicles               196
  • 8.5        Roadmap         196
    • 8.5.1    Interconnect technology trend           196
    • 8.5.2    By interconnect density and technology node         197
    • 8.5.3    By reticle size 197
    • 8.5.4    By front-end vs back-end       198
    • 8.5.5    By 2.5D and 3D Technology Trends  198
    • 8.5.6    By I/O density, I/O pitch and package size  199
  • 8.6        Commercialized Products    199
    • 8.6.1    3D Memory     200
    • 8.6.2    GPU      200
      • 8.6.2.1 Nvidia 200
      • 8.6.2.2 AMD     200
      • 8.6.2.3 Intel      201
    • 8.6.3    AI ASICs             201
      • 8.6.3.1 Intel      201
      • 8.6.3.2 Google                201
      • 8.6.3.3 Amazon             202
      • 8.6.3.4 Microsoft          202
      • 8.6.3.5 Huawei               202
      • 8.6.3.6 Meta    202
    • 8.6.4    CPU      202
      • 8.6.4.1 AMD     203
      • 8.6.4.2 Amazon             203
      • 8.6.4.3 Intel      203
      • 8.6.4.4 Nvidia 204
    • 8.6.5    Networking and CPO switches          204
      • 8.6.5.1 Nvidia Quantum-X and Spectrum-X Photonics       204
      • 8.6.5.2 Broadcom Tomahawk CPO (Bailly / Davisson)        205

 

9             MARKET PLAYERS       206

  • 9.1        Integrated Device Manufacturers     206
  • 9.2        Outsourced Semiconductor Assembly and Test (OSAT) Companies        207
  • 9.3        Foundries         209
  • 9.4        Electronics OEMs       212
  • 9.5        Packaging Equipment and Materials Companies  214

 

10          MARKET CHALLENGES            216

 

11          COMPANY PROFILES                218

  • 11.1     AaltoSemi        218
  • 11.2     Absolic, Inc.    218
  • 11.3     ACCRETECH (Europe) GmbH              219
  • 11.4     Adeia, Inc.        220
  • 11.5     Advanced Micro Devices, Inc. (AMD)             220
  • 11.6     Ajinomoto        223
  • 11.7     Analog Devices, Inc. (ADI)     224
  • 11.8     Amkor Technology      225
  • 11.9     Anmuquan Intelligent Technology (AMQ Intelligent)            227
  • 11.10  Apple   227
  • 11.11  Applied Materials        228
  • 11.12  Ardentec Corporation              228
  • 11.13  Arieca 229
  • 11.14  ARM     230
  • 11.15  ASE       230
  • 11.16  ASMPT Ltd        232
  • 11.17  Ayar Labs         232
  • 11.18  Besi      233
  • 11.19  Biren Technology         234
  • 11.20  Blue Ocean Smart System    235
  • 11.21  Brewer Science             236
  • 11.22  Broadcom        237
  • 11.23  BroadPak         238
  • 11.24  Cadence Design Systems     239
  • 11.25  Cambricon Technologies Co.              239
  • 11.26  Capcon Semiconductor         240
  • 11.27  CAS Microelectronics Integration     241
  • 11.28  CD Micro-Technology               242
  • 11.29  CEA-Leti            242
  • 11.30  Cerebras           243
  • 11.31  China Wafer Level CSP Co    244
  • 11.32  Chipbond Technology Corporation 244
  • 11.33  Chipletz             246
  • 11.34  ChipMOS Technologies, Inc.                246
  • 11.35  Coherent           247
  • 11.36  Corning              248
  • 11.37  Dai Nippon Printing (DNP)     248
  • 11.38  Dewo Advanced Automation (DAA  249
  • 11.39  Disco   250
  • 11.40  Dupont               250
  • 11.41  Ebara  251
  • 11.42  Eliyan  252
  • 11.43  EMC Semi-Conductor Technology   252
  • 11.44  EPS Technology            253
  • 11.45  Entegris             254
  • 11.46  EV Group           254
  • 11.47  GlobalFoundries          255
  • 11.48  Global Unichip              256
  • 11.49  Gloway               256
  • 11.50  Goldenscope Tech      257
  • 11.51  Gona Semiconductor Technology    257
  • 11.52  Graphcore        258
  • 11.53  Greatek Electronics Inc           259
  • 11.54  Hangke Chuangxing (Aero Inno-Star)             259
  • 11.55  Hanmi Semiconductor            260
  • 11.56  HD Microsystems       261
  • 11.57  HiSilicon           261
  • 11.58  HLMC (Shanghai Huali Microelectronics Corporation)      262
  • 11.59  Huatian Huichuang Technology (Xi'an) Co., Ltd.    263
  • 11.60  Huawei               263
  • 11.61  Ibiden  264
  • 11.62  IBM       265
  • 11.63  ICLeague Technology Co Ltd               266
  • 11.64  IMEC    266
  • 11.65  Indium Corporation   267
  • 11.66  Infineon Technologies AG      268
  • 11.67  Integra 268
  • 11.68  Inari Amertron Berhad             269
  • 11.69  Intel Corporation         270
  • 11.70  JCET Group      272
  • 11.71  Jiangsu IC Assembly & Test (ICAT)    273
  • 11.72  Jingdu Semiconductor             274
  • 11.73  Keyang Semiconductor (KYS)              274
  • 11.74  King Yuan Electronics Co., Ltd.          275
  • 11.75  Kioxia  275
  • 11.76  KyLitho               276
  • 11.77  Kyocera              276
  • 11.78  Lam Research               277
  • 11.79  Lapis Technology         277
  • 11.80  LB Semicon Co Ltd     278
  • 11.81  Leading Interconnect Semiconductor Technology                278
  • 11.82  LG Innotek       279
  • 11.83  Lidrotec GmbH             280
  • 11.84  Lux Semiconductors 281
  • 11.85  Malaysian Pacific Industries Berhad              281
  • 11.86  Micron Technology, Inc.          282
  • 11.87  Mediatek           282
  • 11.88  Micross Components               283
  • 11.89  Mitsubishi        284
  • 11.90  National Center For Advanced Packaging China (NCAP China)   284
  • 11.91  NEC      285
  • 11.92  Nvidia Corporation     285
  • 11.93  Nepes Corporation    286
  • 11.94  Nippon Electric Glass (NEG)                287
  • 11.95  Onsemi              288
  • 11.96  Orient Semiconductor Electronics Ltd.        288
  • 11.97  Panasonic       289
  • 11.98  Plan Optik AG 290
  • 11.99  Powertech Technology Inc.   291
  • 11.100 Pragmatic Semiconductor    291
  • 11.101 Qorvo  292
  • 11.102 Renesas            293
  • 11.103 Rigger Micro Technologies (RMT)      293
  • 11.104 Rohm  294
  • 11.105 Rong Semiconductor                294
  • 11.106 Samsung Electronics                295
  • 11.107 Samtec, Inc.   298
  • 11.108 Schott AG         298
  • 11.109 Sharp  299
  • 11.110 Shinko Electric Industries      299
  • 11.111 Showa Denko (Resonac)        300
  • 11.112 Sigurd Microelectronics Corporation             301
  • 11.113 Silicon Box       301
  • 11.114 Siliconware Precision Industries (SPIL)        302
  • 11.115 SJ Semiconductor       303
  • 11.116 SK Hynix            304
  • 11.117 Skywater           307
  • 11.118 Sony Corporation        307
  • 11.119 Starmask          308
  • 11.120 STMicroelectronics    309
  • 11.121 Suss Microtec                309
  • 11.122 Synopsys          310
  • 11.123 SZLQ Intelligence (Suzhou Lieqi Intelligent Equipment)    311
  • 11.124 Taiwan Semiconductor Manufacturing Company (TSMC)                311
  • 11.125 Techsense International         314
  • 11.126 Tezzaron Semiconductor        314
  • 11.127 Tokyo Electron (TEL)  315
  • 11.128 Tongfu Microelectronics Co., Ltd.    315
  • 11.129 Toppan               316
  • 11.130 Toray    317
  • 11.131 Texas Instruments      317
  • 11.132 Tokyo Electron               318
  • 11.133 Tokyo Seimitsu Co., Ltd.         319
  • 11.134 Tong Hsing Electronic Industries, Ltd.           320
  • 11.135 Toshiba              320
  • 11.136 Tower Semiconductor              321
  • 11.137 Unimicron        322
  • 11.138 Unisem              322
  • 11.139 UTAC Group    323
  • 11.140 Walton Advanced Engineering Inc.  324
  • 11.141 Winstek Semiconductor Technology Co., Ltd.         324
  • 11.142 Xinhe Semiconductor               325
  • 11.143 Yibu Semiconductor  326
  • 11.144 Yuehai Integrated         326

 

12          RESEARCH METHODOLOGY              327

 

13          REFERENCES 328

 

List of Tables

  • Table 1. Evolution of semiconductor packaging.   22
  • Table 2. Summary of key advanced semiconductor packaging approaches.      25
  • Table 3. Key Technology Trends in Advanced Semiconductor Packaging.             28
  • Table 4. Market Growth Drivers for advanced semiconductor packaging.            29
  • Table 5. Challenges Facing Advanced Packaging Adoption.           30
  • Table 6. Challenges in transistor scaling.    38
  • Table 7. Leading-edge logic node roadmap, 2026–2030. 38
  • Table 8. Use cases and benefits of using chiplets in semiconductor design.      43
  • Table 9.  Specifications of interconnection methods.         46
  • Table 10. Interconnection technique in semiconductor packaging           47
  • Table 11. Passive vs active interposer.          48
  • Table 12. Interposer technology comparison           49
  • Table 13. Technical challenges of glass interposer               50
  • Table 14. Different Interposer material comparison            50
  • Table 15. Comparative benchmark overview table of key semiconductor interconnection technologies                51
  • Table 16. Die-to-die I/O approaches compared      52
  • Table 17. Fan-out packaging process overview.      56
  • Table 18. Comparison between mainstream silicon dioxide (SiO2) and leading organic dielectrics for electronic interconnect substrates.               59
  • Table 19. Benefits of glass in 2.5D glass-based packaging.            61
  • Table 20. Through-glass-via (TGV) formation methods compared.             63
  • Table 21. Comparison between key properties of glass and polymer molding compounds commonly used in semiconductor packaging applications.   66
  • Table 22. Challenges of glass semiconductor packaging.               67
  • Table 23. Comparison between silicon, organic laminates and glass as packaging substrates.            68
  • Table 24. Through-glass-via (TGV) formation methods compared (insert after Table 16)             69
  • Table 25. 2.5D vs. 3D packaging.      69
  • Table 26. 2.5D packaging challenges.           70
  • Table 27. Market players in 2.5D packaging.             71
  • Table 28. Glass substrate/packaging supplier landscape (2026).              71
  • Table 29. Advantages and disadvantages of 3D packaging.           73
  • Table 30.  W2W vs D2W vs Collective D2W – Process and Comparison. 75
  • Table 31. 3D Stacking Trends - Direct Molecular Bonding Technologies.                76
  • Table 32. 3D interconnect trends      78
  • Table 33. Hybrid bonding Advantages and Challenges.     78
  • Table 34. Hybrid Bond Timeline for Chip Makers and Equipment Makers.             79
  • Table 35. Comparison between 2.5D, 3D micro bump, and 3D hybrid bonding.               81
  • Table 36. Challenges in scaling bumps.       84
  • Table 37. Key methods for enabling copper-to-copper (Cu-Cu) hybrid bonding in advanced semiconductor packaging:  85
  • Table 38. Micro bumps vs Cu-Cu bumpless hybrid bonding.         85
  • Table 39. Panel-level packaging format scaling.     88
  • Table 40. Benefits of Wafer-Level Packaging.           88
  • Table 41. Types of wafer level packaging.   89
  • Table 42. Key trends shaping wafer level packaging.           104
  • Table 43. Packaging approaches utilized for assembling System-in-Package modules.              110
  • Table 44. Considerations for integrating key component categories into system-in-package (SiP) modules/          112
  • Table 45. Key factors driving adoption of heterogeneous integration through SiPs and multi-die packages.        112
  • Table 46. Key trends influencing adoption of System-in-Package modules.        113
  • Table 47.  System-in-package (SiP) module applications.               115
  • Table 48. Co-packaging approaches              118
  • Table 49. Type of couplers     119
  • Table 50. CPO advantages and limitations 120
  • Table 51. Technologies offered by companies         120
  • Table 52. Comparison between heterogeneous 3D integration and monolithic 3D integration.              124
  • Table 53.  Key 2D materials in monolithic 3D integrated circuits. 124
  • Table 54. Benefits of monolithic 3D ICs.      125
  • Table 55. Challenges of monolithic 3D ICs.               126
  • Table 56. Advanced semiconductor packaging trends by market.              131
  • Table 57. Design requirements in advanced packaging, by market.          135
  • Table 58. TIM candidate benchmark               151
  • Table 59. Wide-bandgap power semiconductors compared.        158
  • Table 60. Global market for Advanced semiconductor packaging, 2027-2037, by packaging type, (billions USD).               190
  • Table 61. Global market for Advanced semiconductor packaging, 2020-2035, by Units & Wafers, (billions USD).               190
  • Table 62. Global market for Advanced semiconductor packaging, 2027-2035, by end use market (billions USD).               191
  • Table 63. Global market for advanced semiconductor packaging, 2027–2037, by region (billions USD)                192
  • Table 64. 3D SoC market, 2027–2037 (billions USD)           192
  • Table 65. 3D stacked memory (HBM) packaging market, 2027–2037 (billions USD)      193
  • Table 66. UHD FO / RDL interposer market, 2027–2037 (billions USD)   193
  • Table 67. 2.5D interposer market, 2027–2037 (billions USD)         193
  • Table 68. Large-format 2.5D / CoWoS roadmap.    194
  • Table 69. Embedded Si bridge market, 2027–2037 (billions USD)              194
  • Table 70. Interconnect technology trend     197
  • Table 71. Roadmap By interconnect density and technology node            197
  • Table 72. Roadmap By reticle size    198
  • Table 73. Roadmap front-end vs back-end 198
  • Table 74. Roadmap By 2.5D and 3D Technology Trends    199
  • Table 75. Roadmap By I/O density, I/O pitch and package size     199
  • Table 76. Main Global Wafer Foundry Companies 2023.  211
  • Table 77. Market challenges for advanced semiconductor packaging.   216
  • Table 78. AMD AI chip range.               221
  • Table 79.  Intel's products that adopt 3D FOVEROS.            271

 

List of Figures

  • Figure 1. Timeline of different packaging technologies.     23
  • Figure 2. Evolution roadmap for semiconductor packaging.          25
  • Figure 3. Semiconductor Supply Chain.      27
  • Figure 4. Advanced packaging supply chain.            28
  • Figure 5. Scaling technology roadmap.        38
  • Figure 6. Wafer-level chip scale packaging (WLCSP)           40
  • Figure 7. Embedded wafer-level ball grid array (eWLB).     41
  • Figure 8. Fan-out wafer-level packaging (FOWLP).               42
  • Figure 9. Chiplet design.         43
  • Figure 10. Chiplet SoC.           45
  • Figure 11. 2D chip packaging.            53
  • Figure 12. Typical structure of 2.5D IC package utilizing interposer.          54
  • Figure 13. Fan-out chip-first process flow and Fan-out chip-last process flow. 58
  • Figure 14. Manufacturing process for glass interposers.   64
  • Figure 15. 3D Glass Panel Embedding (GPE) package.      66
  • Figure 16. 3D stacking supply chain.             82
  • Figure 17. Typical FOWLP structure.               92
  • Figure 18. System-in-Package (SiP) for HI.  107
  • Figure 19. 2.5D chiplet integration. 110
  • Figure 20. Advanced packaging supply chain.         129
  • Figure 21. Packaging of sensors used in advanced driver assistance systems (ADAS) and autonomous driving.               158
  • Figure 22. Absolic glass substrate.  219
  • Figure 23. AMD Radeon Instinct.       221
  • Figure 24. AMD Ryzen 7040. 221
  • Figure 25. Alveo V70. 222
  • Figure 26. Versal Adaptive SOC.        222
  • Figure 27. AMD’s MI300 chip.              222
  • Figure 28. 12-layer HBM3.     305

 

 

 

 

 

Purchasers will receive the following:

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  • Comprehensive Excel spreadsheet of all data.
  • Mid-year Update

 

 

The Global Market for Advanced Semiconductor Packaging 2027-2037
The Global Market for Advanced Semiconductor Packaging 2027-2037
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