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The Global Thermal Interface Materials Market 2027-2037

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  • Published: August 2026
  • Pages: 391
  • Tables: 117
  • Figures: 89

 

Thermal interface materials fill the microscopic voids between a heat-generating component and the surface carrying heat away, and they have moved from a commodity consumable to a rate-limiting factor in electronics design.  Demand is set by power density rather than device count. GPUs running AI workloads dissipate heat fluxes on the order of 140 W/cm², while three-dimensional stacked architectures record average fluxes near 300 W/cm² with localised hotspots between 500 and 1,000 W/cm². Filled polymers, adequate when packages dissipated around 100 W, are reaching their ceiling as advanced packages approach 1,000 W. Metal interfaces, indium alloys in particular, are increasingly specified above roughly 400 W, where switching from polymer has been shown to cut junction temperature by more than 10°C — significant given a 10°C rise typically halves die lifetime.

This report provides a comprehensive technical and commercial assessment of thermal interface materials across eleven end markets. The market is analysed from the materials up. Coverage spans greases and pastes, gap pads, dispensed gap fillers, potting compounds and encapsulants, adhesive tapes, phase change materials, metal-based interfaces including solders, sintered silver and copper, and liquid metals, and the full range of carbon-based options from graphite sheet to vertically aligned nanotube arrays and graphene composites. Filler chemistry is treated separately, covering alumina, boron nitride, aluminium nitride, diamond, graphene and boron nitride nanotubes, with pricing and adoption barriers for each.

A dedicated chapter addresses emerging materials and processes, organised by the engineering problem each solves rather than by chemistry. It covers TIM0 through TIM3 nomenclature and the collapse in allowable application pressure for large HPC modules, hybrid and confined liquid metal architectures, warpage-tolerant phase change materials for AI server dies, anchored nanocarbon interfaces, very high density graphite, boron arsenide, liquid-infused nanowire composites, die backside power delivery, immersion cooling compatibility, AI-directed formulation discovery, circularity, and the shift from datasheet-based specification to knowledge-based qualification.

Market forecasts are provided for consumer electronics, electric vehicles, data centres, advanced semiconductor packaging, ADAS sensors, EMI shielding, 5G infrastructure, aerospace and defence, industrial electronics, renewable energy and medical electronics, segmented by material type at annual granularity. Area forecasts in m² are given for server boards, ADAS die attach, 5G antennas, baseband units and power supplies, alongside a 5G power consumption model.

The report profiles 118 companies across the value chain, from multinational formulators to venture-backed materials startups, with recent product launches, partnerships and corporate developments. An accompanying Excel workbook contains all underlying data as live, editable models.

Contents include: 

  • Introduction — active and passive thermal management, TIM types and thermal conductivity, comparative properties, pads versus grease, advantages and disadvantages by type, performance, prices, supply chain, raw material analysis and pricing, environmental regulations and sustainability, system-level performance, thermal conductivity versus thermal resistance, TIM chemistry
  • Materials — advanced and multi-functional TIMs, fillers and trends, greases and pastes, gap pads, gap fillers, potting compounds and encapsulants, adhesive tapes, phase change materials, metal-based TIMs, carbon-based TIMs, metamaterials, self-healing TIMs, dispensing equipment and methods
  • Emerging materials and processes — interface as constraint, TIM0–TIM3 nomenclature, hybrid and confined liquid metals, next-generation PCMs, anchored nanocarbon, graphene and VHD graphite, boron nitride and boron arsenide, liquid-infused and nanowire composites, metal TIM1, heterogeneous integration and backside power, immersion cooling, AI-directed discovery, sustainability and circularity, metrology and qualification, networking silicon
  • Markets — consumer electronics, electric vehicles, data centres, advanced semiconductor packaging, ADAS sensors, EMI shielding, 5G, aerospace and defence, industrial electronics, renewable energy, medical electronics
  • 118 Company profiles. Companies profiled include  3M, ADA Technologies, Aismalibar, AI Technology, Alpha Assembly, AluChem, AOK Technologies, AOS Thermal Compounds, Arkema, Arieca, ATP Adhesive Systems, Aztrong, Bando Chemical Industries, Bdtronic, BestGraphene, BNNano, BNNT, Boston Materials, Boyd Corporation, BYK, Cambridge Nanotherm, Carbice, Carbon Waters, Carbodeon, CondAlign, Denka, Detakta, Dexerials, Deyang Carbonene Technology, Discovered Materials, Dow Corning, Dowa Electronics Materials, Dymax, Dynex Semiconductor (CRRC), ELANTAS, Elkem Silcones, Enerdyne Thermal Solutions, Epoxies Etc., First Graphene, Fujipoly, Fujitsu Laboratories, GCS Thermal, GLPOLY, Global Graphene Group, Goodfellow, Graphmatech, Green Critical Minerals, GuangDong KingBali New Material, HALA Contec, Hamamatsu Carbonics, H.B. Fuller, Henkel, Hitek Electronic Materials, Honeywell, Hongfucheng New Materials, Huber Martinswerk, HyMet Thermal Interfaces, Indium Corporation, Inkron, KB Element, Kerafol, Kitagawa and more.....

 

 

 

 

1             EXECUTIVE SUMMARY            22

  • 1.1        Scope of this edition 22
  • 1.2        Market size and growth           22
  • 1.3        Key findings    23
  • 1.4        Technology outlook to 2037 23
  • 1.5        What has changed in this edition     24

 

2             INTRODUCTION          25

  • 2.1        Thermal Management-active and passive  25
  • 2.2        What are Thermal Interface Materials (TIMs)?         25
    • 2.2.1    Types of TIMs 27
    • 2.2.2    Thermal conductivity                28
  • 2.3        Comparative properties of TIMs        29
  • 2.4        Thermal Pads and Thermal Grease  34
  • 2.5        Advantages and Disadvantages of TIMs, by type    35
  • 2.6        Performance  37
  • 2.7        Prices  40
  • 2.8        Emerging Technologies in TIMs          40
  • 2.9        Supply Chain for TIMs              41
  • 2.10     Raw Material Analysis and Pricing   42
  • 2.11     Environmental Regulations and Sustainability        42
  • 2.12     System Level Performance   43
  • 2.13     Thermal Conductivity vs Thermal Resistance          44
  • 2.14     TIM Chemistry               45

 

3             MATERIALS      47

  • 3.1        Advanced and Multi-Functional TIMs            48
    • 3.1.1    Carbon-based TIMs   49
      • 3.1.1.1 Overview           49
    • 3.1.2    Thermal Conductivity By Filler Type 50
    • 3.1.3    Thermal Conductivity By Matrix         51
  • 3.2        TIM fillers          53
    • 3.2.1    Trends 53
    • 3.2.2    Pros and Cons              54
    • 3.2.3    Thermal Conductivity               55
    • 3.2.4    Spherical Alumina      56
    • 3.2.5    Alumina Fillers              56
    • 3.2.6    Boron nitride (BN)       57
      • 3.2.6.1 Overview           57
      • 3.2.6.2 Suppliers          58
      • 3.2.6.3 Nano Boron Nitride    60
    • 3.2.7    Filler and polymer TIMs           62
    • 3.2.8    Diamond          63
    • 3.2.9    Filler Sizes        65
  • 3.3        Thermal Greases and Pastes              66
    • 3.3.1    Overview and properties        66
    • 3.3.2    SWOT analysis              70
  • 3.4        Thermal Gap Pads      71
    • 3.4.1    Overview and properties        71
    • 3.4.2    Application in EV Batteries    72
    • 3.4.3    Transitioning to Gap fillers from Pads            72
    • 3.4.4    SWOT analysis              73
  • 3.5        Thermal Gap Fillers    75
    • 3.5.1    Overview and properties        75
    • 3.5.2    Products           75
    • 3.5.3    SWOT analysis              76
  • 3.6        Potting Compounds/Encapsulants 78
    • 3.6.1    Overview and properties        78
    • 3.6.2    SWOT analysis              80
  • 3.7        Adhesive Tapes             82
    • 3.7.1    Overview and properties        82
    • 3.7.2    Application in EV Batteries    83
    • 3.7.3    TCA Requirements     84
    • 3.7.4    SWOT analysis              84
  • 3.8        Phase Change Materials         86
    • 3.8.1    Overview           86
    • 3.8.2    Products           86
    • 3.8.3    Properties         87
    • 3.8.4    Types   88
      • 3.8.4.1 Organic/biobased phase change materials               89
        • 3.8.4.1.1           Advantages and disadvantages        90
        • 3.8.4.1.2           Paraffin wax    90
        • 3.8.4.1.3           Non-Paraffins/Bio-based      91
      • 3.8.4.2 Inorganic phase change materials   91
        • 3.8.4.2.1           Salt hydrates  91
          • 3.8.4.2.1.1      Advantages and disadvantages        92
        • 3.8.4.2.2           Metal and metal alloy PCMs (High-temperature)   92
      • 3.8.4.3 Eutectic mixtures        93
      • 3.8.4.4 Encapsulation of PCMs           93
        • 3.8.4.4.1           Macroencapsulation 94
        • 3.8.4.4.2           Micro/nanoencapsulation    94
      • 3.8.4.5 Nanomaterial phase change materials         94
    • 3.8.5    Thermal energy storage (TES)              94
      • 3.8.5.1 Sensible heat storage              95
      • 3.8.5.2 Latent heat storage    95
    • 3.8.6    Application in TIMs    96
      • 3.8.6.1 Thermal pads 97
      • 3.8.6.2 Low Melting Alloys (LMAs)    98
      • 3.8.6.3 Thermal storage units              98
      • 3.8.6.4 Thermal energy storage panels          98
      • 3.8.6.5 Space systems             99
    • 3.8.7    SWOT analysis              101
  • 3.9        Metal-based TIMs       102
    • 3.9.1    Overview           102
      • 3.9.1.1 Metal-Based TIM1 and TIM2 102
      • 3.9.1.2 Metal Filled Polymer TIMs      103
    • 3.9.2    Solders and low melting temperature alloy TIMs   103
      • 3.9.2.1 Solder TIM1     105
      • 3.9.2.2 Sintering            106
    • 3.9.3    Liquid metals 108
      • 3.9.3.1 Liquid metal for high-performance GPU      109
      • 3.9.3.2 Challenges      110
    • 3.9.4    Solid liquid hybrid (SLH) metals        110
      • 3.9.4.1 Hybrid liquid metal pastes    110
      • 3.9.4.2 SLH created during chip assembly (m2TIMs)           112
      • 3.9.4.3 Die-attach materials 112
        • 3.9.4.3.1           Solder Alloys and Conductive Adhesives    114
        • 3.9.4.3.2           Silver-Sintered Paste 116
        • 3.9.4.3.3           Copper (Cu) sintered TIMs    117
          • 3.9.4.3.3.1      TIM1 - Sintered Copper            117
          • 3.9.4.3.3.2      Cu Sinter Materials    118
          • 3.9.4.3.3.3      Copper Sintering Challenges              120
          • 3.9.4.3.3.4      Commercial Use         121
        • 3.9.4.3.4           Sintered Copper Die-Bonding Paste               121
          • 3.9.4.3.4.1      Commercial activity  122
        • 3.9.4.3.5           Graphene Enhanced Sintered Copper TIMs              122
      • 3.9.4.4 Laminar Metal Form With High Softness     122
    • 3.9.5    SWOT analysis              123
  • 3.10     Carbon-based TIMs   125
    • 3.10.1 Carbon nanotube (CNT) TIM Fabrication     125
    • 3.10.2 Challenges      126
    • 3.10.3 Market players               127
    • 3.10.4 Multi-walled nanotubes (MWCNT)  128
      • 3.10.4.1            Properties         128
      • 3.10.4.2            Application as thermal interface materials                129
    • 3.10.5 Single-walled carbon nanotubes (SWCNTs)             130
      • 3.10.5.1            Properties         130
      • 3.10.5.2            Application as thermal interface materials                132
    • 3.10.6 Vertically aligned CNTs (VACNTs)     133
      • 3.10.6.1            Properties         133
      • 3.10.6.2            Applications   133
      • 3.10.6.3            Application as thermal interface materials                134
    • 3.10.7 BN nanotubes (BNNT) and nanosheets (BNNS)      135
      • 3.10.7.1            Properties         135
      • 3.10.7.2            Application as thermal interface materials                135
    • 3.10.8 Graphene         136
      • 3.10.8.1            Properties         137
      • 3.10.8.2            Application as thermal interface materials                139
        • 3.10.8.2.1        Graphene fillers            140
        • 3.10.8.2.2        Graphene foam            140
        • 3.10.8.2.3        Graphene aerogel       140
        • 3.10.8.2.4        Graphene Heat Spreaders     140
        • 3.10.8.2.5        Graphene in Thermal Interface Pads              142
      • 3.10.8.3            Advantages of Graphene        142
      • 3.10.8.4            Through-Plane Alignment      143
    • 3.10.9 Nanodiamonds            144
      • 3.10.9.1            Properties         144
      • 3.10.9.2            Application as thermal interface materials                145
    • 3.10.10              Graphite            145
      • 3.10.10.1         Properties         145
      • 3.10.10.2         Natural graphite           147
        • 3.10.10.2.1     Classification 147
        • 3.10.10.2.2     Processing       148
        • 3.10.10.2.3     Flake    148
          • 3.10.10.2.3.1 Grades               149
          • 3.10.10.2.3.2 Applications   149
      • 3.10.10.3         Synthetic graphite      151
        • 3.10.10.3.1     Classification 151
          • 3.10.10.3.1.1 Primary synthetic graphite    151
          • 3.10.10.3.1.2 Secondary synthetic graphite             152
          • 3.10.10.3.1.3 Processing       152
      • 3.10.10.4         Applications as thermal interface materials             152
        • 3.10.10.4.1     Graphite Sheets           153
        • 3.10.10.4.2     Vertical graphite          154
        • 3.10.10.4.3     Graphite pastes           155
      • 3.10.10.5         Challenges      155
        • 3.10.10.5.1     Through-plane thermal conductivity limitations    155
        • 3.10.10.5.2     Interfacing with Heat Source and Disrupting Alignment    156
    • 3.10.11              Hexagonal Boron Nitride        156
      • 3.10.11.1         Properties         157
      • 3.10.11.2         Application as thermal interface materials                158
    • 3.10.12              SWOT analysis              159
  • 3.11     Metamaterials               160
    • 3.11.1 Types and properties 160
      • 3.11.1.1            Electromagnetic metamaterials       161
        • 3.11.1.1.1        Double negative (DNG) metamaterials         161
        • 3.11.1.1.2        Single negative metamaterials           162
        • 3.11.1.1.3        Electromagnetic bandgap metamaterials (EBG)    162
        • 3.11.1.1.4        Bi-isotropic and bianisotropic metamaterials          162
        • 3.11.1.1.5        Chiral metamaterials                162
        • 3.11.1.1.6        Electromagnetic “Invisibility” cloak 163
      • 3.11.1.2            Terahertz metamaterials        163
      • 3.11.1.3            Photonic metamaterials         163
      • 3.11.1.4            Tunable metamaterials           164
      • 3.11.1.5            Frequency selective surface (FSS) based metamaterials 164
      • 3.11.1.6            Nonlinear metamaterials       164
      • 3.11.1.7            Acoustic metamaterials         165
    • 3.11.2 Application as thermal interface materials                165
  • 3.12     Self-healing thermal interface materials     165
    • 3.12.1 Extrinsic self-healing 167
    • 3.12.2 Capsule-based             167
    • 3.12.3 Vascular self-healing 167
    • 3.12.4 Intrinsic self-healing 167
    • 3.12.5 Healing volume            168
    • 3.12.6 Types of self-healing materials, polymers and coatings    169
    • 3.12.7 Applications in thermal interface materials              170
  • 3.13     TIM Dispensing             170
    • 3.13.1 Low-volume Dispensing Methods    170
    • 3.13.2 High-volume Dispensing Methods  171
    • 3.13.3 Meter, Mix, Dispense (MMD) Systems           171
    • 3.13.4 TIM Dispensing Equipment Suppliers            172

 

4             EMERGING MATERIALS AND PROCESSES 174

  • 4.1        Why the interface has become the constraint         174
  • 4.2        Nomenclature               174
  • 4.3        Hybrid and confined liquid metal architectures      175
    • 4.3.1    Fibre-reinforced liquid metal composites  175
    • 4.3.2    Liquid metal embedded elastomers              175
    • 4.3.3    Hybrid dam architectures      175
    • 4.3.4    Phase change metal alloys   175
  • 4.4        Next-generation phase change materials   175
  • 4.5        Anchored nanocarbon interfaces     176
  • 4.6        Graphene, graphite and very high density carbon  176
  • 4.7        Boron nitride, boron arsenide and engineered fillers           177
  • 4.8        Liquid-infused and nanowire composites  177
  • 4.9        Metal TIM1: solder, sintering and indium     178
  • 4.10     Packaging architecture: heterogeneous integration and backside power              178
  • 4.11     Immersion cooling compatibility      179
  • 4.12     AI-directed formulation discovery    179
  • 4.13     Sustainability and circularity               179
  • 4.14     Metrology, reliability and qualification practice      180
  • 4.15     Thermal demand beyond compute: networking silicon     180

 

5             MARKETS FOR THERMAL INTERFACE MATERIALS (TIMs)  182

  • 5.1        Consumer Electronics             182
    • 5.1.1    Market overview           182
      • 5.1.1.1 Market drivers                182
      • 5.1.1.2 Applications   183
        • 5.1.1.2.1           Smartphones and tablets      184
          • 5.1.1.2.1.1      Graphitic Heat Spreaders      187
          • 5.1.1.2.1.2      Liquid metals 188
        • 5.1.1.2.2           Wearable electronics                189
    • 5.1.2    Global market 2022-2037, by TIM type          190
  • 5.2        Electric Vehicles (EV)               192
    • 5.2.1    Market overview           192
      • 5.2.1.1 Market drivers                192
      • 5.2.1.2 Applications   192
        • 5.2.1.2.1           EV Battery Packs         193
          • 5.2.1.2.1.1      TIM Pack and Module               193
          • 5.2.1.2.1.2      TIM Application by Cell Format          193
          • 5.2.1.2.1.3      Thermal Interface Material Fillers for EV Batteries 195
          • 5.2.1.2.1.4      Factors Impacting TIM Pricing             196
          • 5.2.1.2.1.5      TIM Pricing       197
          • 5.2.1.2.1.6      Companies     198
        • 5.2.1.2.2           Lithium-ion batteries 198
          • 5.2.1.2.2.1      Cell-to-pack designs 199
          • 5.2.1.2.2.2      Cell-to-chassis/body                200
        • 5.2.1.2.3           Power electronics       202
          • 5.2.1.2.3.1      Types   203
          • 5.2.1.2.3.2      Trends 203
          • 5.2.1.2.3.3      Properties for TIM2 Properties  in EV power electronics     204
          • 5.2.1.2.3.4      TIM1s  207
          • 5.2.1.2.3.5      TIM2 in SiC MOSFET  209
        • 5.2.1.2.4           Charging stations        210
    • 5.2.2    Global market 2022-2037, by TIM type          210
  • 5.3        Data Centers  213
    • 5.3.1    Market overview           213
      • 5.3.1.1 Market drivers                213
      • 5.3.1.2 Applications   214
        • 5.3.1.2.1           Router, switches and line cards         215
          • 5.3.1.2.1.1      Transceivers   216
          • 5.3.1.2.1.2      Server Boards                216
          • 5.3.1.2.1.3      Switches and Routers              218
        • 5.3.1.2.2           AI Servers         219
          • 5.3.1.2.2.1      Overview           219
          • 5.3.1.2.2.2      Trends 219
          • 5.3.1.2.2.3      TRL       222
        • 5.3.1.2.3           Power supply converters        229
          • 5.3.1.2.3.1      Overview           229
          • 5.3.1.2.3.2      Laminar metal form TIMs       229
          • 5.3.1.2.3.3      TIM Consumption in Data Center Power Supplies 230
          • 5.3.1.2.3.4      Immersion cooling     231
    • 5.3.2    Global market 2022-2037, by TIM type          232
  • 5.4        Advanced Semiconductor Packaging           234
    • 5.4.1    Market Overview          234
    • 5.4.2    TIM1     235
      • 5.4.2.1 Indium foil TIM1           235
      • 5.4.2.2 Products           235
        • 5.4.2.2.1           Thermal Gel    236
        • 5.4.2.2.2           Thermal grease             236
        • 5.4.2.2.3           Graphene         237
        • 5.4.2.2.4           Liquid metal   238
        • 5.4.2.2.5           Diamond thermal interface materials in TIM0 applications            239
        • 5.4.2.2.6           Integrated silicon micro-cooler systems     239
        • 5.4.2.2.7           Copper nanowire (CuNWs)  240
    • 5.4.3    Global market 2022-2037, by TIM type          241
  • 5.5        ADAS Sensors               243
    • 5.5.1    Market overview           243
      • 5.5.1.1 Market drivers                243
        • 5.5.1.1.1           Sensor Suite for Autonomous Cars 243
        • 5.5.1.1.2           Thermal Management in ADAS Sensors       244
      • 5.5.1.2 Applications   245
        • 5.5.1.2.1           ADAS Cameras             246
          • 5.5.1.2.1.1      Commercial examples            246
        • 5.5.1.2.2           ADAS Radar    247
          • 5.5.1.2.2.1      Radar technology        247
          • 5.5.1.2.2.2      Radar boards 248
          • 5.5.1.2.2.3      Commercial examples            249
        • 5.5.1.2.3           ADAS LiDAR    250
          • 5.5.1.2.3.1      Role of TIMs    250
          • 5.5.1.2.3.2      Commercial examples            250
        • 5.5.1.2.4           Electronic control units (ECUs) and computers      251
          • 5.5.1.2.4.1      Overview           251
          • 5.5.1.2.4.2      Commercial examples            252
        • 5.5.1.2.5           Die attach materials  253
          • 5.5.1.2.5.1      Overview           253
          • 5.5.1.2.5.2      Commercial examples            254
      • 5.5.1.3 Companies     256
    • 5.5.2    Global market 2022-2037, by TIM type          257
  • 5.6        EMI shielding 259
    • 5.6.1    Market overview           259
      • 5.6.1.1 Market drivers                259
      • 5.6.1.2 Applications   259
        • 5.6.1.2.1           Dielectric Constant   260
        • 5.6.1.2.2           ADAS   261
          • 5.6.1.2.2.1      Radar  262
          • 5.6.1.2.2.2      5G         262
      • 5.6.1.2.3           Commercial examples            263
  • 5.7        5G         264
    • 5.7.1    Market overview           264
      • 5.7.1.1 Market drivers                264
      • 5.7.1.2 Applications   264
        • 5.7.1.2.1           EMI shielding and EMI gaskets           265
        • 5.7.1.2.2           Antenna            265
        • 5.7.1.2.3           Base Band Unit (BBU)              268
        • 5.7.1.2.4           Liquid TIMs      271
        • 5.7.1.2.5           Power supplies             271
      • 5.7.1.2.5.1      Increased power consumption in 5G             272
    • 5.7.2    Market players               273
    • 5.7.3    Global market 2022-2037, by TIM type          273
  • 5.8        Aerospace & Defense               276
    • 5.8.1    Market overview           276
      • 5.8.1.1 Market drivers                276
    • 5.8.1.2 Applications   276
      • 5.8.1.2.1           Satellite thermal management          276
        • 5.8.1.2.1.1      Temperature range     277
        • 5.8.1.2.1.2      Heat Spreaders            278
        • 5.8.1.2.1.3      Carbon fiber reinforced TIM 278
        • 5.8.1.2.1.4      Thermal pads 279
        • 5.8.1.2.1.5      Thermal straps             280
        • 5.8.1.2.1.6      Graphene         280
        • 5.8.1.2.1.7      Challenges      281
      • 5.8.1.2.2           Avionics cooling           283
      • 5.8.1.2.3           Military electronics     283
    • 5.8.1.3 Global market 2022-2037, by TIM type          283
  • 5.9        Industrial Electronics               286
    • 5.9.1    Market overview           286
      • 5.9.1.1 Market drivers                286
      • 5.9.1.2 Applications   286
        • 5.9.1.2.1           Industrial automation              286
        • 5.9.1.2.2           Power supplies             287
        • 5.9.1.2.3           Motor drives    287
        • 5.9.1.2.4           LED lighting     287
    • 5.9.2    Global market 2022-2037, by TIM type          287
  • 5.10     Renewable Energy      289
    • 5.10.1 Market overview           289
      • 5.10.1.1            Market drivers                289
      • 5.10.1.2            Applications   289
        • 5.10.1.2.1        Solar inverters               289
        • 5.10.1.2.2        Wind power electronics          290
        • 5.10.1.2.3        Energy storage systems          290
    • 5.10.2 Global market 2022-2037, by TIM type          290
  • 5.11     Medical Electronics   292
    • 5.11.1 Market overview           292
      • 5.11.1.1            Market drivers                292
      • 5.11.1.2            Applications   292
        • 5.11.1.2.1        Diagnostic equipment             292
        • 5.11.1.2.2        Medical imaging systems      293
        • 5.11.1.2.3        Patient monitoring devices   293
    • 5.11.2 Global market 2022-2037, by TIM type          293

 

6             COMPANY PROFILES                295 (119 company profiles)

 

7             RESEARCH METHODOLOGY              383

 

8             REFERENCES 384

 

List of Tables

  • Table 1. Global market for thermal interface materials by application, 2026-2037 (millions USD).     22
  • Table 2. Thermal conductivities (κ) of common metallic, carbon, and ceramic fillers employed in TIMs.                29
  • Table 3. Commercial TIMs and their properties.     31
  • Table 4. Advantages and disadvantages of TIMs, by type. 35
  • Table 5. Key Factors in System Level Performance for TIMs.          37
  • Table 6. TIM Materials by Thermal, Mechanical, and Application Properties        38
  • Table 7. Thermal interface materials prices.             40
  • Table 8. Comparisons of Price and Thermal Conductivity for TIMs.           40
  • Table 9. Price Comparison of TIM Fillers.     40
  • Table 10. Raw Material Analysis and Pricing.            42
  • Table 11. System Level Performance Comparison.              43
  • Table 12. Thermal Conductivity vs Thermal Resistance Comparison.     44
  • Table 13. TIM Chemistry Comparison           45
  • Table 14. Characteristics of some typical TIMs.     47
  • Table 15. Carbon-Based TIM Performance.               49
  • Table 16. Thermal Conductivity By Filler Type           51
  • Table 17. Thermal Conductivity By Matrix.  52
  • Table 18. Trends on TIM Fillers.          54
  • Table 19. Pros and Cons of TIM Fillers.          54
  • Table 20. Thermal Conductivity Comparison ATH and Al2O3.       57
  • Table 21. BNNT Companies and Prices.       60
  • Table 22.BNNT Property Variation.  61
  • Table 23. Diamond fillers with varied sizes for thermal interface materials.        64
  • Table 24. Commercial thermal paste products.     68
  • Table 25.Commercial thermal gap pads (thermal interface materials).  71
  • Table 26. Commercial thermal gap fillers products.            75
  • Table 27. Types of Potting Compounds/Encapsulants.     79
  • Table 28. TIM adhesives tapes.          82
  • Table 29. Commercial phase change materials (PCM) thermal interface materials (TIMs) products. 86
  • Table 30. Properties of PCMs.             87
  • Table 31.  PCM Types and properties.            89
  • Table 32. Advantages and disadvantages of organic PCMs.           90
  • Table 33. Advantages and disadvantages of organic PCM Fatty Acids.    91
  • Table 34. Advantages and disadvantages of salt hydrates               92
  • Table 35. Advantages and disadvantages of low melting point metals.   93
  • Table 36. Advantages and disadvantages of eutectics.      93
  • Table 37. Benefits and drawbacks of PCMs in TIMs.            96
  • Table 38. PCM Selection Criteria and Considerations for Space Systems.           99
  • Table 39. PCM selection criteria and considerations for space systems.              100
  • Table 40. Liquid Metal Challenges. 110
  • Table 41. Copper Sintering Technical Challenges. 120
  • Table 42. Technology Readiness Level (TRL) for Carbon Materials in Thermal Management     125
  • Table 43. Challenges with CNT-TIMs.             126
  • Table 44. Market players in CNT-TIMs.          127
  • Table 45. Properties of CNTs and comparable materials. 128
  • Table 46. Typical properties of SWCNT and MWCNT.          130
  • Table 47. Comparison of carbon-based additives in terms of the main parameters influencing their value proposition as a conductive additive.              132
  • Table 48. Thermal conductivity of CNT-based polymer composites.        134
  • Table 49. Comparative properties of BNNTs and CNTs.     135
  • Table 50. Properties of graphene, properties of competing materials, applications thereof.     137
  • Table 51. Graphene Heat Spreaders Performance.              141
  • Table 52. Comparison of Conventional and Graphene-Enhanced Thermal Pads.            142
  • Table 53. Advantages of Graphene in Thermal Interface Materials             143
  • Table 54. Properties of nanodiamonds.       144
  • Table 55. Comparison between Natural and Synthetic Graphite.               145
  • Table 56. Thermal Conductivity Comparison of Graphite TIMs.   146
  • Table 57. Classification of natural graphite with its characteristics.         147
  • Table 58. Characteristics of synthetic graphite.      151
  • Table 59. Thermal Conductivity Comparison of Graphite TIMs.   155
  • Table 60. Properties of hexagonal boron nitride (h-BN).    158
  • Table 61. Comparison of self-healing systems.      168
  • Table 62. Types of self-healing coatings and materials.     169
  • Table 63. Comparative properties of self-healing materials.          170
  • Table 64. Challenges for Dispensing TIM.   170
  • Table 65. Thermal Management Application Areas in Consumer Electronics.    182
  • Table 66. Thermal Management Differences: 4G vs 5G Smartphones.    183
  • Table 67. Trends in Smartphone Thermal Materials.            184
  • Table 68. Thermal Management approaches in commercial Smartphones.        186
  • Table 69. Global market in consumer electronics 2022-2037, by TIM type (millions USD).        190
  • Table 70. Material Options and Market Comparison.          194
  • Table 71. TIM Filler Comparison and Adoption.       196
  • Table 72. Thermal Conductivity Comparison of Suppliers for EV Batteries.          196
  • Table 73. TIM Pricing by Supplier.      197
  • Table 74. Thermal Conductivity Comparison of TIM1s.     207
  • Table 75. Global market in electric vehicles 2022-2037, by TIM type (millions USD).     211
  • Table 76. Types of TIMs in Data Centers.      213
  • Table 77. Area of TIM per Switch.      216
  • Table 78. Leaf and Spine Switch TIM Areas.               217
  • Table 79. Novel TIM Technologies in Data Centers.               217
  • Table 80. Emerging Trends in TIM Materials for AI Servers.               219
  • Table 81. Applications of TIM Materials in AI Servers with Technology Readiness Levels (TRL).              222
  • Table 82. Companies Utilizing and Providing TIM Materials for AI Servers              225
  • Table 83. TIM Trends in Data Centers.            230
  • Table 84. TIM Area Forecast in Server Boards: 2022-2037 (m2).  231
  • Table 85. Global market in data centers 2022-2037, by TIM type (millions USD).             232
  • Table 86. Global market in advanced semiconductor packaging 2022-2037, by TIM type (millions USD).                241
  • Table 87. Autonomous Vehicle Sensor Suite TIM Requirements. 244
  • Table 88. TIM Players in ADAS.            245
  • Table 89. TIM Players in ADAS.            246
  • Table 90. Die Attach for ADAS Sensors.        255
  • Table 91. Die Attach Area Forecast for Key Components Within ADAS Sensors: 2022-2037 (m2).       255
  • Table 92. TIM Players in ADAS              256
  • Table 93. Global market in ADAS sensors 2022-2037, by TIM type (millions USD).          257
  • Table 94. Applications of TIMs in EMI Shielding for ADAS Radars.              261
  • Table 95. TIM Area Forecast for 5G Antennas by Station Size: 2022-2037 (m2). 267
  • Table 96. TIM Area Forecast for 5G Antennas by Station Frequency: 2022-2037 (m2). 267
  • Table 97. TIMS in BBU.             268
  • Table 98. 5G BBY models.      270
  • Table 99. TIM Area Forecast for 5G BBU: 2022-2037 (m2).              270
  • Table 100. Power Consumption Forecast for 5G: 2022-2037 (GW).          272
  • Table 101. TIM Area Forecast for Power Supplies: 2022-2037 (m2).          272
  • Table 102. TIM market players in 5G.              273
  • Table 103. Global market in 5G 2022-2037, by TIM type (millions USD). 274
  • Table 104. Market Drivers for TIMS in aerospace and defense.     276
  • Table 105. Applications for TIMS in aerospace and defense.          276
  • Table 106. Temperature range of space subsystems and passive cooling approaches.               277
  • Table 107. TIMs for space satellites - challenges and considerations.     281
  • Table 108. Global Market for TIMs in aerospace and defense 2022-2037, by TIM Type (Millions USD).                284
  • Table 109. Market Drivers for TIMs in industrial electronics.           286
  • Table 110. Applications for TIMs in industrial electronics.               286
  • Table 111. Global Market 2022-2037, by TIM Type in Industrial Electronics (Millions USD).      288
  • Table 112. Market Drivers for TIMs in renewable energy.   289
  • Table 113. Applications for TIMs in renewable energy.        289
  • Table 114. Global Market for TIMs in Renewable Energy 2022-2037 (Millions USD).      290
  • Table 115. Market Drivers for TIMs in medical electronics.              292
  • Table 116. Applications for TIMs in medical electronics.  292
  • Table 117. Global Market 2022-2037 for TIMs in Medical Electronics (Millions USD).   293

 

List of Figures

  • Figure 1. (L-R) Surface of a commercial heatsink surface at progressively higher magnifications, showing tool marks that create a rough surface and a need for a thermal interface material. 26
  • Figure 2. Schematic of thermal interface materials used in a flip chip package.              27
  • Figure 3. Thermal grease.      27
  • Figure 4. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module.             28
  • Figure 5. Supply Chain for TIMs.        41
  • Figure 6. Commercial thermal paste products.      66
  • Figure 7. Application of thermal silicone grease.   67
  • Figure 8. A range of thermal grease products.          67
  • Figure 9. SWOT analysis for thermal greases and pastes. 70
  • Figure 10. Thermal Pad.          71
  • Figure 11. SWOT analysis for thermal gap pads.    74
  • Figure 12. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module.             75
  • Figure 13. SWOT analysis for thermal gap fillers.   77
  • Figure 14. SWOT analysis for Potting compounds/encapsulants.              81
  • Figure 15. Thermal adhesive products.         82
  • Figure 16. SWOT analysis for TIM adhesives tapes.              85
  • Figure 17. Phase-change TIM products.       86
  • Figure 18. PCM mode of operation. 88
  • Figure 19. Classification of PCMs.   88
  • Figure 20. Phase-change materials in their original states.             89
  • Figure 21. Thermal energy storage materials.           95
  • Figure 22. Phase Change Material transient behaviour.     95
  • Figure 23. PCM TIMs. 97
  • Figure 24. Phase Change Material - die cut pads ready for assembly.      97
  • Figure 25. SWOT analysis for phase change materials.      101
  • Figure 26. Typical IC package construction identifying TIM1 and TIM2    104
  • Figure 27. Liquid metal TIM product.              109
  • Figure 28. Pre-mixed SLH.     111
  • Figure 29. HLM paste and Liquid Metal Before and After Thermal Cycling.           111
  • Figure 30.  SLH with Solid Solder Preform. 112
  • Figure 31. Automated process for SLH with solid solder preforms and liquid metal.     112
  • Figure 32. SWOT analysis for metal-based TIMs.   124
  • Figure 33. Schematic of single-walled carbon nanotube. 130
  • Figure 34. Types of single-walled carbon nanotubes.         131
  • Figure 35. Schematic of a vertically aligned carbon nanotube (VACNT) membrane used for water treatment.        134
  • Figure 36. Schematic of Boron Nitride nanotubes (BNNTs). Alternating B and N atoms are shown in blue and red.             135
  • Figure 37. Graphene layer structure schematic.     136
  • Figure 38. Illustrative procedure of the Scotch-tape based micromechanical cleavage of HOPG.       136
  • Figure 39. Graphene and its descendants: top right: graphene; top left: graphite = stacked graphene; bottom right: nanotube=rolled graphene; bottom left: fullerene=wrapped graphene. 138
  • Figure 40. Graphene Thermal Management Applications Roadmap.       139
  • Figure 41. Flake graphite.       149
  • Figure 42. Applications of flake graphite.    150
  • Figure 43. Graphite-based TIM products.    153
  • Figure 44. Structure of hexagonal boron nitride.     157
  • Figure 45. SWOT analysis for carbon-based TIMs. 159
  • Figure 46. Classification of metamaterials based on functionalities.      160
  • Figure 47. Electromagnetic metamaterial. 161
  • Figure 48. Schematic of Electromagnetic Band Gap (EBG) structure.      162
  • Figure 49. Schematic of chiral metamaterials.        163
  • Figure 50. Nonlinear metamaterials- 400-nm thick nonlinear mirror that reflects frequency-doubled output using input light intensity as small as that of a laser pointer.         165
  • Figure 51. Schematic of self-healing polymers. Capsule based (a), vascular (b), and intrinsic (c) schemes for self-healing materials.  Red and blue colours indicate chemical species which react (purple) to heal damage.       166
  • Figure 52. Stages of self-healing mechanism.         166
  • Figure 53. Self-healing mechanism in vascular self-healing systems.     167
  • Figure 54. Schematic of TIM operation in electronic devices.        183
  • Figure 55. Schematic of Thermal Management Materials in smartphone.            186
  • Figure 56. Wearable technology inventions.             189
  • Figure 57. Global market in consumer electronics 2022-2037, by TIM type (millions USD).      191
  • Figure 58. Application of thermal interface materials in automobiles.    192
  • Figure 59. EV battery components including TIMs.               199
  • Figure 60. Battery pack with a cell-to-pack design and prismatic cells.  200
  • Figure 61. Cell-to-chassis battery pack.      202
  • Figure 62. TIMS in EV charging station.         210
  • Figure 63. Global market in electric vehicles 2022-2037, by TIM type (millions USD).   212
  • Figure 64. Image of data center layout.         214
  • Figure 65. Application of TIMs in line card. 215
  • Figure 66. Global market in data centers 2022-2037, by TIM type (millions USD).           233
  • Figure 67. Global market in advanced semiconductor packaging 2022-2037, by TIM type (millions USD).                242
  • Figure 68. ADAS radar unit incorporating TIMs.       248
  • Figure 69. Global market in ADAS sensors 2022-2037, by TIM type (millions USD).        258
  • Figure 70. Coolzorb 5G.          260
  • Figure 71. TIMs in Base Band Unit (BBU).    269
  • Figure 72. Global market in 5G 2022-2037, by TIM type (millions USD). 275
  • Figure 73. Global Market for TIMs in aerospace and defense 2022-2037, by TIM Type (Millions USD).                285
  • Figure 74. Global Market 2022-2037, by TIM Type in Industrial Electronics (Millions USD).       288
  • Figure 75. Global Market for TIMs in Renewable Energy 2022-2037 (Millions USD).       291
  • Figure 76. Global Market 2022-2037 for TIMs in Medical Electronics (Millions USD).    294
  • Figure 77. Boron Nitride Nanotubes products.        306
  • Figure 78. Transtherm® PCMs.            307
  • Figure 79. Carbice carbon nanotubes.         310
  • Figure 80.  Internal structure of carbon nanotube adhesive sheet.            327
  • Figure 81. Carbon nanotube adhesive sheet.           327
  • Figure 82. HI-FLOW Phase Change Materials.         335
  • Figure 83. Thermoelectric foil, consists of a sequence of semiconductor elements connected with conductive metal. At the top (in red) is the thermal interface.       347
  • Figure 84. Parker Chomerics THERM-A-GAP GEL. 360
  • Figure 85. Metamaterial structure used to control thermal emission.     361
  • Figure 86. Shinko Carbon Nanotube TIM product. 371
  • Figure 87. The Sixth Element graphene products.  375
  • Figure 88. Thermal conductive graphene film.         376
  • Figure 89. VB Series of TIMS from Zeon.       382

 

 

 

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