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The Global Advanced Solid-State Cooling Market 2027-2037

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  • Published: October 2026
  • Pages: 389
  • Tables: 155
  • Figures: 51

 

Solid-state cooling is moving from specialist niche to strategic necessity. For decades, thermoelectric (Peltier) devices served applications where precision, silence and compactness mattered more than efficiency, such as laser stabilisation, scientific cameras and PCR instruments. Three forces are now changing the market. Heat is concentrating in places compressors and fans cannot reach. Refrigerant regulation has fixed deadlines. And new caloric, photonic and airflow technologies have crossed key engineering thresholds. The developments of 2025–2026 mark a turning point. AI accelerators now dissipate 1–2 kW per package, and optical transceivers, high-bandwidth memory and co-packaged optics need active thermal control. That has made thermoelectric modules a core part of AI data-centre infrastructure, with Ferrotec, Phononic and others expanding capacity and launching data-centre cooling products. In October 2026 xMEMS began mass production of all-silicon “fan-on-a-chip” cooling devices. Frore Systems reached unicorn valuation for its AirJet technology, and YPlasma and Ionic Wind introduced fanless plasma and ionic-wind modules for edge AI hardware.

Caloric cooling has advanced from laboratory to pilot. Magnotherm is trialling magnetocaloric refrigeration in supermarkets, and Magnoric showed a pre-series display cabinet at Chillventa 2026. Barocal, Pascal, Exergyn and Qurie raised institutional funding for barocaloric, elastocaloric and electrocaloric heat pumps; low-pressure barocaloric designs and compression-loaded elastocaloric alloys removed long-standing engineering barriers. Passive daytime radiative cooling entered the mainstream with 3M’s vehicle-roof Cooling Film and fast-growing Asian suppliers such as i2Cool. In quantum technologies, scarce helium-3 is driving demand for helium-3-free continuous adiabatic demagnetisation refrigerators from kiutra and others.

Looking ahead, regulation and climate will shape the next decade. The EU F-gas Regulation bans high-GWP refrigerants in small air conditioners and heat pumps in stages from 2027 to 2035, and the Kigali Amendment cuts HFC supply further. Cooling demand is rising rapidly with global warming, while 6G networks and hotter solar panels add new thermal loads. Solid-state cooling will not replace vapour compression overnight. It will gain ground first where size, silence, precision or refrigerant risk matter most: electronics, wearables, optics, sensors and quantum systems. Magnetocaloric commercial refrigeration is expected around 2028–2030 and caloric heat pumps early in the 2030s. LED-based thermophotonic cooling, a longer-term prospect, could enable chip-scale cryogenic cooling of semiconductor sensors without heat sinks or vibration. Hybrid, multimode architectures that combine solid-state and conventional cooling will define the market through 2037.

The Global Advanced Solid-State Cooling Market 2027-2037 is a comprehensive analysis of the technologies, applications, companies and commercial pathways reshaping how heat is managed. Cooling demand is escalating with AI data centres, 1 kW-plus processors, 6G communications, electrification and a warming climate. At the same time, regulation is phasing out high-GWP refrigerants. Solid-state cooling uses no circulating refrigerant gas and few or no moving parts, and is positioned to capture a growing share of this demand.

The report covers nine technology segments: thermoelectric (Peltier) modules and assemblies; solid-state airflow, including piezoelectric MEMS, ionic wind and plasma actuators; passive daytime radiative cooling materials; magnetocaloric, elastocaloric and barocaloric systems; electrocaloric devices; solid-state cryogenic cooling, including adiabatic demagnetisation refrigeration; and LED thermophotonic, optical and thermionic cooling. For each, it assesses operating principles, materials, performance, technology readiness, costs, commercialisation timelines and competitive dynamics, supported by SWOT analyses. There is in-depth coverage of LED-based cooling for semiconductor sensors and quantum applications, including performance targets, beachhead markets and public and private funding pathways.

Detailed market forecasts run from 2027 to 2037, segmented by technology, end-use market, region and operating temperature range. Eleven end-use markets are covered, from data centres, telecoms, consumer electronics and wearables to buildings and HVAC, refrigeration, automotive, medical, scientific instruments, quantum technologies, and defence and aerospace. The report examines customer requirements, adoption barriers, price-performance evolution, value chains, partnership ecosystems and the funding and M&A landscape. The report also includes 67 company profiles. They cover thermoelectric leaders, solid-state airflow innovators, caloric cooling start-ups, radiative cooling suppliers, cryogenic and quantum-cooling specialists, and the incumbent technologies they compete with. Strategy, R&D, business-development and investment teams can use it to identify where, when and how solid-state cooling will win.

Report contents include:

  • Executive summary with primary conclusions, a cooling toolkit, and the leading technologies for reducing temperatures by 5–50 °C
  • Analysis of cooling demand drivers: AI chips, data centres, 6G, solar panels, batteries, buildings and vehicles
  • Regulatory drivers: the Kigali Amendment, the EU F-gas Regulation, the Global Cooling Pledge and the US AIM Act
  • Technology chapters on thermoelectric, magnetocaloric, electrocaloric, elastocaloric, barocaloric, twistocaloric, multicaloric, LED thermophotonic, optical, thermionic, phononic, quantum dot and metamaterial cooling
  • Passive radiative cooling materials, applications and suppliers
  • Solid-state airflow: MEMS, ionic wind and plasma actuators
  • Quantum cryogenic cooling: ADR and continuous ADR, helium-3-free solutions and cryo-CMOS
  • Comparative benchmarking, TRLs, roadmaps and application suitability by temperature
  • Market forecasts for 2027–2037 by technology, end use, region and temperature segment
  • Customer needs, adoption criteria, funding, investment and M&A analysis
  • 155 tables, 51 figures and 19 SWOT analyses
  • 68 company profiles including 3M, Aegiq, Anyon Systems, Anzen Climate Wall, Barocal, Bluefors, Camfridge, Coherent, CoolIT Systems, Crystal Ltd, CryoCoax, Custom Thermoelectric, CustomChill, DBK Industrial, Delft Circuits, EIC Solutions, Exergyn, Ferrotec, Frore Systems, GE Appliances, Hamamatsu Photonics, i2Cool, Iceotope, Infleqtion, Intel, Ionic Wind Technologies, JetCool, KELK, kiutra, Magnoric, Magnotherm, Maybell Quantum, MIMiC Systems, Mingfa Tech, Montana Instruments, Octolife, Origin Quantum, Pascal, Passive Edge, Phononic and more......
 
 
 

1             EXECUTIVE SUMMARY            14

  • 1.1        Market opportunity and strategic overview 14
    • 1.1.1    The global cooling market      14
    • 1.1.2    Global solid-state cooling market size and growth projections (2027-2037)      15
    • 1.1.3    Emerging technologies market opportunity assessment and competitive positioning 17
  • 1.2        The nature of solid-state cooling and why it is now a priority          17
  • 1.3        Advantages of solid-state cooling    19
  • 1.4        Technology landscape             19
    • 1.4.1    Established vs emerging solid-state cooling technologies              19
    • 1.4.2    LED-based thermophotonic cooling performance benchmarks and advantages            20
    • 1.4.3    Quantum cryogenic cooling requirements and market applications        21
  • 1.5        Technology readiness levels and commercialisation timelines across all segments     22
  • 1.6        Cooling toolkit and potential winners on current evidence              23
    • 1.6.1    The cooling toolkit and the trend to multimode cooling    23
    • 1.6.2    Best passive solid-state cooling technologies for reducing temperature by 5 °C to 40 °C, 2027-2047    24
    • 1.6.3    Best solid-state cooling technologies for reducing temperature by 5 °C to 50 °C, 2027-2047 25
    • 1.6.4    Companies commercialising solid-state cooling by technology  25
    • 1.6.5    Solid-state cooling: overall SWOT appraisal             26
  • 1.7        Market segmentation and application analysis      27
    • 1.7.1    Primary target markets: semiconductor cooling, quantum technologies, cryogenic applications                27
    • 1.7.2    Application-specific market sizing with US$-value quantification by segment  27
  • 1.8        Customer needs assessment and adoption barriers analysis      28
  • 1.9        Temperature range segmentation (sub-100 K to 150 K+) and application mapping         28
  • 1.10     Competitive landscape and industry structure       29
    • 1.10.1 Market share analysis across thermoelectric, magnetocaloric and emerging technologies     29
    • 1.10.2 Key player positioning: established manufacturers vs innovation-driven start-ups        29
    • 1.10.3 Technology differentiation strategies and competitive advantages           30
    • 1.10.4 Partnership ecosystems and value chain positioning opportunities         31
  • 1.11     LED-based cooling     31
    • 1.11.1 Technology performance advantages over conventional Peltier and cryogenic systems            31
    • 1.11.2 Addressable market opportunity and penetration scenarios         32
    • 1.11.3 First application priorities and beachhead market strategies        32
    • 1.11.4 Unique value propositions for semiconductor sensor cooling and quantum applications        32
  • 1.12     Funding and investment landscape                33
    • 1.12.1 Private funding trends              33
    • 1.12.2 Government and EU funding               33
    • 1.12.3 Funding pathway recommendations for LED-based cooling developers                34
  • 1.13     Key conclusions          34

 

2             INTRODUCTION          37

  • 2.1        The need for cooling  37
    • 2.1.1    General situation        37
    • 2.1.2    Cooling demand escalation 2027-2047      38
    • 2.1.3    Radical changes in requirements     39
    • 2.1.4    Problems with traditional vapour compression      39
    • 2.1.5    Dangers of heat and localised body cooling              40
    • 2.1.6    Cooling buildings        40
    • 2.1.7    AI data centres              41
    • 2.1.8    Severe new microchip cooling requirements            42
    • 2.1.9    6G communications from 2030        42
    • 2.1.10 Other cooling problems and opportunities in electronics and ICT             42
    • 2.1.11 Grid storage batteries               44
    • 2.1.12 Hot solar panels          45
    • 2.1.13 Fusion and high-power lasers             45
    • 2.1.14 Vehicles and electric vehicles             45
  • 2.2        Regulatory and policy drivers              45
    • 2.2.1    Kigali Amendment to the Montreal Protocol              46
    • 2.2.2    EU F-gas Regulation (EU) 2024/573 46
    • 2.2.3    Global Cooling Pledge              47
    • 2.2.4    Japan Top Runner        47
    • 2.2.5    US AIM Act       48
    • 2.2.6    Public funding programmes 48
  • 2.3        Primary answers to emerging cooling challenges  49
    • 2.3.1    Trend to smart materials        49
    • 2.3.2    Ancient passive cooling revived         49
    • 2.3.3    Reinventing air conditioning 49
    • 2.3.4    Cooling microchips and batteries, with or without solid-state      49
    • 2.3.5    Answers to 6G heat    50
    • 2.3.6    Smart textiles 50
  • 2.4        Solid-state cooling technology fundamentals and classification               50
    • 2.4.1    Classification of operating principles            50
    • 2.4.2    Undesirable materials as an opportunity    52
  • 2.5        Caloric cooling effects             53
    • 2.5.1    Physics of caloric cooling      53
    • 2.5.2    Magnetocaloric            54
    • 2.5.3    Electrocaloric                54
    • 2.5.4    Elastocaloric  54
    • 2.5.5    Barocaloric     54
    • 2.5.6    Twistocaloric 55
    • 2.5.7    Multicaloric effects    55
  • 2.6        Market evolution and technology timeline  55
    • 2.6.1    Attention versus maturity       56
  • 2.7        Scope of analysis: established vs emerging technologies               57
  • 2.8        Value chain analysis across technologies  59
    • 2.8.1    Component and material suppliers 61
    • 2.8.2    Technology developers and IP holders          61
    • 2.8.3    System integrators and OEMs            61
    • 2.8.4    End-user customers and market channels 61
    • 2.8.5    Distribution and service networks   62
  • 2.9        Competing cooling technologies      62
    • 2.9.1    Why solid-state will gradually displace vapour compression        63

 

3             SOLID-STATE COOLING TECHNOLOGIES  65

  • 3.1        Thermoelectric (Peltier) cooling systems    66
    • 3.1.1    Technology maturity and market penetration           67
    • 3.1.2    Thermoelectric materials      68
    • 3.1.3    Performance characteristics and limitations           74
    • 3.1.4    Thermoelectric cooling and temperature control applications    75
    • 3.1.5    Wide-area and flexible thermoelectric cooling: a gap in the market          77
    • 3.1.6    Radiative cooling of buildings combined with thermoelectric harvesting             83
    • 3.1.7    The heat-removal problem of TEC and TEG and evolving solutions           83
    • 3.1.8    Recent advances in thermoelectric cooling              85
    • 3.1.9    Thermoelectric module manufacturers       86
    • 3.1.10 Market size      90
    • 3.1.11 SWOT analysis              92
  • 3.2        Magnetocaloric cooling          92
    • 3.2.1    Technology principles and development status      93
    • 3.2.2    Commercial applications      95
    • 3.2.3    Performance advantages and challenges   97
    • 3.2.4    Magnetic materials supply and cost               97
    • 3.2.5    Market outlook             98
    • 3.2.6    SWOT analysis              100
  • 3.3        Electrocaloric cooling              100
    • 3.3.1    Overview and SWOT appraisal           100
    • 3.3.2    Operating principles, device construction, materials and form factors  101
    • 3.3.3    Electric-field-induced temperature changes            104
    • 3.3.4    Polymer and ceramic-based materials         105
    • 3.3.5    Material popularity in recent research           106
    • 3.3.6    Giant electrocaloric effect through 2025    106
    • 3.3.7    Issues to address        108
    • 3.3.8    Research advances 2025 and 2026 109
    • 3.3.9    Current development stage and commercialisation timeline        110
    • 3.3.10 Scalability, market potential and applications        111
  • 3.4        Barocaloric cooling systems               112
    • 3.4.1    Pressure-induced caloric effects and materials     112
    • 3.4.2    Mechanical pressure cycling mechanisms                113
    • 3.4.3    Development status and research progress             115
    • 3.4.4    Comparison with other caloric cooling technologies          115
  • 3.5        Elastocaloric cooling systems           117
    • 3.5.1    Stress-strain induced temperature changes             117
    • 3.5.2    Shape-memory alloy and polymer-based materials            117
    • 3.5.3    Mechanical cycling and fatigue considerations      118
    • 3.5.4    Performance characteristics and applications       119
  • 3.6        Twistocaloric (torsocaloric) cooling systems           121
    • 3.6.1    Twist-induced caloric effects              121
    • 3.6.2    Carbon nanotube yarns and fibre-based systems 122
    • 3.6.3    Rotational mechanical cycling           122
    • 3.6.4    Research developments and commercialisation potential             122
  • 3.7        Solid-state phase change cooling: caloric and oriented composite phase change materials (OCPCM)          123
    • 3.7.1    Structural and ferroic phase change modes             123
    • 3.7.2    Oriented composite phase change materials (OCPCM)   125
  • 3.8        Multicaloric cooling   126
  • 3.9        Solid-state heat pumps and engines              127
    • 3.9.1    Technology convergence opportunities        127
    • 3.9.2    Hybrid cooling system architectures              127
  • 3.10     Caloric cooling: comparative summary and market outlook         129
  • 3.11     LED-based solid-state cooling technologies            131
    • 3.11.1 LED-based thermophotonic cooling principles       132
    • 3.11.2 Technical specifications and performance parameters    133
    • 3.11.3 Advantages over conventional methods      135
    • 3.11.4 Technology readiness level and development status          136
    • 3.11.5 Manufacturing cost analysis ($/W basis)    138
    • 3.11.6 Temperature range capabilities (sub-100 K to 150 K)           139
    • 3.11.7 Addressable market size and opportunity  140
    • 3.11.8 Competitive landscape within solid-state cooling 142
    • 3.11.9 Market entry barriers and advantages           142
    • 3.11.10              First application priorities and beachhead market strategies        143
    • 3.11.11              Technology differentiation and unique value propositions for semiconductor sensor cooling and quantum applications 143
    • 3.11.12              Performance advantages over Peltier systems        144
    • 3.11.13              Cost competitiveness vs magnetocaloric and Stirling        144
    • 3.11.14              Commercialisation and funding pathways 145
  • 3.12     Optical refrigeration: laser cooling of solids and anti-Stokes fluorescence          146
  • 3.13     Phononic cooling systems    148
    • 3.13.1 Solid-state phonon manipulation principles             148
    • 3.13.2 Technology approach and development status      149
    • 3.13.3 Market positioning and commercial potential         149
  • 3.14     Quantum dot cooling technologies 150
    • 3.14.1 Quantum confinement effects           150
    • 3.14.2 Research developments         151
    • 3.14.3 Integration with quantum computing systems        151
  • 3.15     Photonic crystal and metamaterial cooling               152
    • 3.15.1 Principles and wavelength selectivity            152
    • 3.15.2 Market readiness and manufacturing challenges  153
  • 3.16     Advanced thermionic cooling             154
    • 3.16.1 Introduction    154
    • 3.16.2 Electron emission cooling mechanisms     154
    • 3.16.3 Recent breakthroughs and commercialisation timeline    155
  • 3.17     Passive daytime radiative cooling (PDRC)  158
    • 3.17.1 Definition, origin and purpose            158
    • 3.17.2 Materials           158
    • 3.17.3 Janus and two-sided designs              159
    • 3.17.4 PRC paint and colour without compromise               160
    • 3.17.5 Applications: buildings, data centres, solar panels and more       161
    • 3.17.6 Companies commercialising PRC   162
  • 3.18     Solid-state airflow: MEMS, ionic wind and plasma actuators        165
    • 3.18.1 Piezoelectric MEMS active cooling  165
    • 3.18.2 Ionic wind / electrohydrodynamic cooling  166
    • 3.18.3 Dielectric barrier discharge plasma actuators        167
    • 3.18.4 Comparison with fans, heat pipes and vapour chambers                167
    • 3.18.5 Applications   168
    • 3.18.6 Market outlook             169
  • 3.19     Quantum cryogenic cooling technologies  170
    • 3.19.1 Adiabatic demagnetisation refrigeration (ADR)       172
    • 3.19.2 Dilution refrigeration alternatives     176
    • 3.19.3 Superconducting cooling technologies        179
    • 3.19.4 Quantum sensing and communication cooling      185
    • 3.19.5 Quantum cooling market context     187
  • 3.20     Comparative technology analysis   190
    • 3.20.1 Performance benchmarking matrix across all technologies           190
    • 3.20.2 Cost competitiveness analysis by application segment   192
    • 3.20.3 Application suitability mapping and temperature ranges 193
    • 3.20.4 Technology readiness levels and commercialisation timelines    195
    • 3.20.5 Technology roadmap and convergence trends        197
    • 3.20.6 Quantum technology integration capabilities          199
    • 3.20.7 Winning materials and principles for solid-state cooling generally            199

 

4             GLOBAL SOLID-STATE COOLING MARKET ANALYSIS          202

  • 4.1        Market definition, methodology and assumptions               202
  • 4.2        Overall market segmentation and sizing      204
    • 4.2.1    Global solid-state cooling market overview               204
    • 4.2.2    Technology segment breakdown and market share             206
    • 4.2.3    Regional market analysis and growth patterns        211
    • 4.2.4    Market drivers and growth catalysts               213
    • 4.2.5    Market restraints and risks   215
  • 4.3        Application-based market segmentation    216
    • 4.3.1    Primary market segments by temperature requirements  216
    • 4.3.2    Cross-technology application analysis        218
    • 4.3.3    Growth projections and market dynamics (5-10 year outlook)      226
  • 4.4        Customer needs assessment across market segments   227
    • 4.4.1    Performance requirements by application 227
    • 4.4.2    Cost sensitivity and value drivers     228
    • 4.4.3    Technology adoption criteria and decision factors               229
    • 4.4.4    Adoption barriers        229
  • 4.5        Funding and investment landscape                230
    • 4.5.1    Private funding trends              230
    • 4.5.2    Corporate investment and M&A        231
    • 4.5.3    Government and EU funding               233

 

5             COMPANY PROFILES                235 (68 company profiles)

 

6             APPENDIX        376

  • 6.1        Report methodology 376
    • 6.1.1    Research approach   376
    • 6.1.2    Market definition         376
    • 6.1.3    Forecasting method  376
    • 6.1.4    Limitations      377

 

7             REFERENCES 378

 

List of Tables

  • Table 1. Solid-state cooling in the context of the wider cooling market.  15
  • Table 2. Global advanced solid-state cooling market size, 2023-2037 (US$ millions). 15
  • Table 3. Emerging solid-state cooling technologies: opportunity assessment. 17
  • Table 4. Why solid-state cooling is now a priority: drivers and evidence.                18
  • Table 5. Established vs emerging solid-state cooling technologies.          19
  • Table 6. LED-based thermophotonic cooling: performance benchmarks against incumbents.             21
  • Table 7. Quantum cryogenic cooling requirements and market applications.    21
  • Table 8. Solid-state cooling technology readiness levels and commercialisation milestones.               22
  • Table 9. The cooling toolkit by mode, with leading solid-state tools in bold.        23
  • Table 10. Best passive solid-state cooling technologies for reducing temperature by 5-40 °C, 2027-2047 (Future Markets assessment).           24
  • Table 11. Best active solid-state cooling technologies for reducing temperature by 5-50 °C, 2027-2047 (Future Markets assessment).           25
  • Table 12. Approximate number of companies commercialising solid-state cooling, by technology (2026).               25
  • Table 13. Application-specific market sizing, 2027, 2032 and 2037 (US$ millions).       27
  • Table 14. Customer needs and adoption barriers by segment.     28
  • Table 15. Temperature range segmentation and application mapping.   28
  • Table 16. Market share by technology, 2027, 2032 and 2037.       29
  • Table 17. Key player positioning: established manufacturers vs innovation-driven start-ups. 29
  • Table 18. Technology differentiation strategies and competitive advantages.    30
  • Table 19. LED cooling: technology performance advantages over conventional Peltier and cryogenic systems.           31
  • Table 20. Selected funding rounds in solid-state and novel cooling, 2022-2026.             33
  • Table 21. Public funding pathways relevant to LED and other emerging solid-state cooling technologies.                34
  • Table 22. Key indicators of global cooling demand.             38
  • Table 23. Principal problems with vapour-compression cooling and the solid-state response.              39
  • Table 24. AI accelerator and rack power trajectory.              41
  • Table 25. Emerging cooling problems in electronics and ICT and solid-state responses.           43
  • Table 26. Kigali Amendment HFC phase-down schedule (reduction versus baseline). 46
  • Table 27. Selected EU F-gas Regulation 2024/573 product restrictions. 47
  • Table 28. Selected public funding programmes for solid-state cooling. 48
  • Table 29. Solid-state cooling operating principles compared (part 1: performance).     50
  • Table 30. Solid-state cooling operating principles compared (part 2: practicality).         51
  • Table 31. Undesirable materials widely used in cooling and possible substitutes.         52
  • Table 32. Caloric effects compared by type.             54
  • Table 33. Attention versus maturity by technology, 2027, 2037 and 2047.           56
  • Table 34. Scope of analysis: inclusions and exclusions.   57
  • Table 35. Representative value chain participants by stage.          60
  • Table 36. Competing cooling technologies compared with solid-state cooling.               62
  • Table 37. Technologies covered in Section 3: maturity and Future Markets forecast.    65
  • Table 38. Thermoelectric cooling: market penetration indicators, 2026.               68
  • Table 39. Thermoelectric metrics: what they tell, and where they mislead.         69
  • Table 40. Thermoelectric materials for near-room-temperature cooling: comparison. 71
  • Table 41. Lower-cost and lower-toxicity thermoelectric material routes.              72
  • Table 42. Spin-driven and quasiparticle thermoelectric effects: comparison.   73
  • Table 43. Theoretical maximum COP of single-stage thermoelectric coolers vs temperature lift (hot side 300 K). 74
  • Table 44. Thermoelectric cooler performance characteristics and limitations. 74
  • Table 45. Thermoelectric cooling applications and their requirements. 76
  • Table 46. Approaches to wide-area and flexible thermoelectric cooling.               78
  • Table 47. Flexible and wide-area thermoelectric cooling: state of the art, 2026.              79
  • Table 48. Flexible, wide-area, wearable, printed and fibre thermoelectric research: 33 examples, 2019-2026.  79
  • Table 49. Hot-side heat-removal solutions for thermoelectric coolers and generators.               83
  • Table 50. Selected advances in thermoelectric cooling, 2024-2026.       85
  • Table 51. Thermoelectric (Peltier) module, assembly and product manufacturers: 71 companies.    87
  • Table 52. Thermoelectric (Peltier) modules and assemblies: market forecast, 2026-2037 (US$ millions).                90
  • Table 53. Magnetocaloric materials for near-room-temperature cooling.             94
  • Table 54. Magnetocaloric cooling performance vs conventional systems.           95
  • Table 55. Magnetocaloric cooling: commercial and pre-commercial activity.    96
  • Table 56. Magnetocaloric cooling: advantages and challenges.  97
  • Table 57. Magnetocaloric system supply chain: materials and risk.          98
  • Table 58. Magnetocaloric systems: market forecast, 2026-2037 (US$ millions).             98
  • Table 59. Electrocaloric materials and performance characteristics.      103
  • Table 60. Electrocaloric effect temperature changes by material type.   103
  • Table 61. Comparison of ceramic and polymer electrocaloric routes.    105
  • Table 62. Approximate share of electrocaloric research focus by material family, 2023-2026.              106
  • Table 63. Milestones in giant electrocaloric materials and devices, 2006-2025.              107
  • Table 64. Key electrocaloric technical issues and mitigation routes.        109
  • Table 65. Electrocaloric research and development activity, 2025-2026.             109
  • Table 66. Electrocaloric commercialisation stages and expected timing.            111
  • Table 67. Electrocaloric application areas, fit and expected timing.         111
  • Table 68. Barocaloric material families and characteristics.          112
  • Table 69. Barocaloric developers and funded projects.     114
  • Table 70. Comparison of caloric cooling technologies.     115
  • Table 71. Elastocaloric material families and properties. 118
  • Table 72. Tension versus compression loading in elastocaloric devices.               119
  • Table 73. Elastocaloric performance characteristics and target applications.  120
  • Table 74. Twistocaloric fibre materials.        122
  • Table 75. Phase-change based cooling technologies compared.               124
  • Table 76. Oriented composite PCM approaches for electronics and battery thermal management.  125
  • Table 77. Multicaloric materials and coupled-field approaches. 126
  • Table 78. Hybrid and convergent solid-state cooling architectures.          128
  • Table 79. Caloric cooling market by technology, 2027-2037 (US$ millions).       130
  • Table 80. Companies commercialising caloric cooling.    131
  • Table 81. LED cooling performance parameters and specifications.        133
  • Table 82. GaAs LED performance characteristics for cooling applications.         134
  • Table 83. LED cooling vs thermoelectric cooling performance comparison.      135
  • Table 84. LED and thermophotonic cooling: technology readiness and key research groups. 137
  • Table 85. Indicative cost per watt of cooling by technology at cryogenic and deep-cooling temperatures.                139
  • Table 86. Cooling technologies by operating temperature range and fit with LED cooling targets.        139
  • Table 87. Beachhead applications for LED-based cooling.             140
  • Table 88. LED / optical / thermionic cooling segment: 2037 penetration scenarios.      141
  • Table 89. Competitive positioning of LED cooling within solid-state and adjacent cooling technologies.                142
  • Table 90. Unique value propositions of LED cooling by application domain.      144
  • Table 91. Cost competitiveness of LED cooling vs magnetocaloric and Stirling coolers for small cryogenic loads.          145
  • Table 92. Funding instruments and partnering routes for LED / thermophotonic cooling.          145
  • Table 93. Optical refrigeration of solids: materials and milestones.          146
  • Table 94. Phonon engineering approaches relevant to solid-state cooling.          149
  • Table 95. Quantum dot cooling approaches and research status.             151
  • Table 96. Photonic and metamaterial approaches to cooling and thermal management.         153
  • Table 97. Electron emission cooling mechanisms.              155
  • Table 98. Thermionic cooling commercialisation timeline (Future Markets assessment).         156
  • Table 99. PDRC material families: performance, cost and commercial popularity.        159
  • Table 100. PDRC applications, benefits and adoption status.      161
  • Table 101. Solid-state airflow products: key specifications (company data).     166
  • Table 102. Solid-state airflow vs conventional thermal solutions in compact electronics.        168
  • Table 103. Solid-state airflow applications and adoption timing.               168
  • Table 104. Solid-state airflow market build: indicative units and ASP logic.         169
  • Table 105. Quantum cooling requirements by application.             171
  • Table 106. Comparison of ADR system configurations.     174
  • Table 107. Paramagnetic cooling media for ADR stages.  174
  • Table 108. ADR applications and use cases in quantum technologies.  176
  • Table 109. Helium-3 supply, demand and pricing indicators.        177
  • Table 110. Magnetic and electronic refrigeration methods below 1 K.     178
  • Table 111. Quantum device operating temperature requirements.            179
  • Table 112. Josephson junction cooling applications.          180
  • Table 113. Indicative dilution refrigerator stage temperatures and cooling budgets.     181
  • Table 114. Cryogenic wiring, signal-chain and cryo-CMOS suppliers reducing qubit heat load.            183
  • Table 115. Dilution refrigerator and millikelvin platform suppliers.            184
  • Table 116. Quantum sensor cooling and thermal management requirements. 186
  • Table 117. Optical quantum device cooling challenges.   187
  • Table 118. Future Markets forecast: quantum-relevant solid-state cooling segments (US$ millions).                188
  • Table 119. Cryogenic platform suppliers relevant to quantum technologies.     188
  • Table 120. Performance benchmarking matrix across all technologies. 190
  • Table 121. Cost competitiveness analysis by application segment.         192
  • Table 122. Application suitability mapping by temperature range.             194
  • Table 123. Technology readiness levels and commercialisation status by technology. 196
  • Table 124. Quantum technology integration capabilities by solid-state cooling segment.         199
  • Table 125. Winning materials and principles for solid-state cooling.        200
  • Table 126. Key modelling assumptions by technology.      203
  • Table 127. Global advanced solid-state cooling market size, 2023-2037 (US$ millions).           204
  • Table 128. Global advanced solid-state cooling market by technology, 2023-2026 (US$ millions).    206
  • Table 129. Global advanced solid-state cooling market by technology, 2027-2037 (US$ millions).    206
  • Table 130. Market share by technology, 2027, 2032 and 2037.    207
  • Table 131. Price-performance evolution by technology type.         210
  • Table 132. Global advanced solid-state cooling market by region, 2027-2037 (US$ millions). 211
  • Table 133. Regional growth drivers and leading activity.    212
  • Table 134. Market drivers and growth catalysts.     213
  • Table 135. Market restraints and risks.         215
  • Table 136. Global advanced solid-state cooling market by operating temperature segment, 2027-2037 (US$ millions).              216
  • Table 137. Cryogenic applications (sub-100 K) and solid-state cooling options.              216
  • Table 138. Ultra-low temperature applications (100-150 K).          217
  • Table 139. Moderate cooling applications (>150 K) by technology fit.      218
  • Table 140. Global advanced solid-state cooling market by end-use market, 2023-2026 (US$ millions).                218
  • Table 141. Global advanced solid-state cooling market by end-use market, 2027-2037 (US$ millions).                219
  • Table 142. Market share by end-use market, 2027, 2032 and 2037.         220
  • Table 143. Semiconductor sensor solid-state cooling.      222
  • Table 144. Consumer electronics solid-state thermal management.      223
  • Table 145. Solid-state cooling roles in data centres.            224
  • Table 146. Automotive solid-state cooling applications.  225
  • Table 147. Market scenarios, 2032 and 2037 (US$ millions, constant 2026 US$).           226
  • Table 148. Performance requirements by application.       227
  • Table 149. Cost sensitivity and value drivers by end-use market.               228
  • Table 150. Technology adoption criteria and decision factors.     229
  • Table 151. Selected private funding rounds in solid-state and advanced cooling, 2021-2026.               230
  • Table 152. Selected corporate investments and M&A in cooling technology.      231
  • Table 153. Selected government and EU funding for solid-state cooling.              233
  • Table 154. Companies profiled by technology category.   235
  • Table 155. Forecasting approach by technology segment.              376

 

List of Figures

  • Figure 1. Global advanced solid-state cooling market size, 2023-2037 (US$ millions). 16
  • Figure 2. Solid-state cooling commercialisation timelines by technology, 2024-2040. 23
  • Figure 3. Solid-state cooling overall: SWOT analysis.         26
  • Figure 4. Solid-state cooling value chain.   31
  • Figure 5. Principal drivers of new cooling demand: AI chip power, air-conditioner growth, 6G, batteries and solar heat.              37
  • Figure 6. Solid-state cooling technology milestones, 1834-2032.              56
  • Figure 7. Global advanced solid-state cooling market, 2023-2037 (US$ millions).         58
  • Figure 8. Technology share of the advanced solid-state cooling market, 2027-2037.   59
  • Figure 9. Advanced solid-state cooling value chain.            60
  • Figure 10. Operation of a thermoelectric (Peltier) module: n- and p-type legs between ceramic plates pump heat from the cold side to the hot side when current flows.             67
  • Figure 11. Thermoelectric energy harvesting (TEG) as a power source for solid-state cooling: SWOT analysis.           85
  • Figure 12. Thermoelectric (Peltier) cooling: SWOT analysis.          92
  • Figure 13. Magnetocaloric refrigeration cycle: adiabatic magnetisation, heat rejection, adiabatic demagnetisation and heat absorption in an active magnetic regenerator.            93
  • Figure 14. Magnetocaloric cooling: SWOT analysis.            100
  • Figure 15. Electrocaloric cooling: SWOT analysis. 101
  • Figure 16. Electrocaloric cooling cycle: polarisation, heat rejection, depolarisation and heat absorption.                102
  • Figure 17. Electrocaloric cooling commercialisation timeline.     110
  • Figure 18. Low-pressure barocaloric system: solid refrigerant beds cycled by a gas compressor with secondary-fluid heat transfer.            113
  • Figure 19. Barocaloric cooling: SWOT analysis.     116
  • Figure 20. Elastocaloric cooling cycle: loading, heat rejection, unloading and heat absorption.           117
  • Figure 21. Elastocaloric cooling: SWOT analysis.  121
  • Figure 22. Twistocaloric cooling: SWOT analysis. 123
  • Figure 23. Multicaloric and solid-state heat pumps: SWOT analysis.       129
  • Figure 24. Caloric cooling market by technology, 2026-2037 (US$ millions).     130
  • Figure 25. Principle of electroluminescent (LED) and thermophotonic cooling: photons emitted with energy above qV carry heat from the cold LED to a remote absorber or photovoltaic cell.         132
  • Figure 26. LED thermophotonic cooling: SWOT analysis. 138
  • Figure 27. Anti-Stokes fluorescence cooling: SWOT analysis.      148
  • Figure 28. Phononic cooling: SWOT analysis.          150
  • Figure 29. Quantum dot cooling: SWOT analysis. 152
  • Figure 30. Thermal metamaterials: SWOT analysis.            154
  • Figure 31. Advanced thermionic cooling: research milestones and commercialisation timeline.         155
  • Figure 32. Advanced thermionic cooling: SWOT analysis.               157
  • Figure 33. Passive daytime radiative cooling: high solar reflectance combined with thermal emission through the 8-13 µm atmospheric window.               158
  • Figure 34. Janus thermal management: SWOT analysis.  160
  • Figure 35. Passive radiative cooling: SWOT analysis.          164
  • Figure 36. Solid-state airflow principles: piezoelectric MEMS jets, ionic wind (EHD) and dielectric barrier discharge plasma actuators.              165
  • Figure 37. Solid-state airflow: SWOT analysis.        170
  • Figure 38. Adiabatic demagnetisation refrigeration: magnetisation, isolation, demagnetisation and hold steps.  172
  • Figure 39. Continuous ADR (cADR) architecture: staggered stages with heat switches provide uninterrupted cooling at the cold stage.      173
  • Figure 40. Solid-state cryogenic cooling (ADR / cADR): SWOT analysis. 189
  • Figure 41. Application suitability of cooling technologies by operating temperature range.      194
  • Figure 42. Commercialisation timelines by solid-state cooling technology, 2024-2040.            196
  • Figure 43. Solid-state cooling technology roadmap 2027-2037 by end market. 198
  • Figure 44. Global advanced solid-state cooling market, 2023-2037 (US$ millions, constant 2026 US$).                205
  • Figure 45. Global advanced solid-state cooling market by technology, 2027-2037 (US$ millions).     207
  • Figure 46. Market share by technology, 2027, 2032 and 2037.     208
  • Figure 47. Solid-state cooling revenues by technology on a logarithmic scale, 2023-2037 (US$ millions).                208
  • Figure 48. Global advanced solid-state cooling market by region, 2027-2037 (US$ millions). 211
  • Figure 49. Cooling demand drivers: AI chip power, air-conditioning growth, 6G and climate.  213
  • Figure 50. Global advanced solid-state cooling market by end-use market, 2027-2037 (US$ millions).                220
  • Figure 51. Solid-state cooling application sizing, 2027 versus 2037 (US$ millions).       221

 

 

 

Purchasers will receive the following:

  • PDF report download/by email.
  • Comprehensive Excel spreadsheet of all data including data on all investments & deals segmented by technology, sub-sector, government, region, and company
  • Mid-year Update

 

The Global Advanced Solid-State Cooling Market 2027-2037
The Global Advanced Solid-State Cooling Market 2027-2037
PDF download + Excel Database.
Price: £1,100.00

The Global Advanced Solid-State Cooling Market 2027-2037
The Global Advanced Solid-State Cooling Market 2027-2037
PDF download + Excel Database + Print Edition (including tracked delivery).
Price: £1,200.00

 

 

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