cover
- Published: November 2026
- Pages: 427
- Tables: 68
- Figures: 24
Advanced semiconductor packaging has become the main way to keep improving computing performance. Shrinking transistors at 3 nm and 2 nm gives smaller gains at higher cost, while AI workloads are limited by memory bandwidth, die-to-die bandwidth and power density. Those limits are now solved inside the package, and so the materials in the package increasingly set system performance.
The market for advanced semiconductor packaging materials covers eight classes:
- organic substrate materials (build-up films, low-CTE glass cloth, cores, ultra-thin copper foil)
- glass-core and glass interposer materials
- redistribution-layer (RDL) dielectrics
- low-loss dielectrics
- fine-pitch interconnect materials (copper plating, solder microbumps, under-bump metallisation, sputter targets)
- hybrid-bonding consumables
- underfills and encapsulants
- temporary bonding and debonding materials
AI accelerators drive the market. Their packages consume these materials out of all proportion to unit volumes: reticle-scale logic dies sit on ever-larger interposers alongside up to sixteen high-bandwidth memory (HBM) stacks, on substrates of 100 mm and more with 20 or more layers. AI and data-centre products take about 41% of materials demand in 2027 and 55% by 2037. Four technology shifts are reshaping supply:
- Solder to engineered copper. Copper plating for advanced packaging overtook front-end chip copper plating in 2025.
- Underfilled microbumps to hybrid bonding. Bonded copper interfaces reach pitches below 10 µm, which brings new demand for CMP slurries, post-CMP cleans and SiCN bonding dielectrics.
- Organic cores to glass. Adhesion, seed-layer and via-fill metallisation remain the gating problems.
- Round wafers to rectangular panels. This changes how dielectrics, plating and carriers are processed.
Shortages and price rises of 20–30% in 2026 have shown how exposed AI hardware is to a handful of materials plants. Qualification cycles of 18 to 60 months protect incumbents, so market share changes mostly at technology transitions. Glass-core materials grow fastest, at about 29% a year from a small base, followed by hybrid-bonding consumables at about 23%. Fine-pitch interconnect materials stay the largest class and add the most absolute value. Taiwan remains the largest consuming region, and the United States grows fastest as subsidised packaging capacity ramps up.
The Global Market for Advanced Semiconductor Packaging Materials 2027–2037 is a 427-page analysis of the materials that make AI-era chip packages possible. It forecasts eight material classes and 39 segments from 2027 to 2037, by region, packaging platform and end-use market. The forecasts are built bottom-up from wafer, panel and substrate activity and are consistent with Future Markets’ companion reports on advanced packaging, IC substrates, polymeric materials and glass.
Report contents include:
- Executive summary with market size, growth, key findings and the Future Markets view
- Definitions, scope and methodology, including how the forecasts reconcile with the companion reports
- Demand drivers: AI accelerators, HBM generations, the interconnect pitch roadmap, the move to panels and glass, and regional capacity
- Global forecasts 2027–2037 by material class, segment, region, platform and end market, with scenarios and pricing assumptions
- Fine-pitch interconnect materials: copper plating chemistries, nanotwinned copper, SnAg microbumps, fluxless bonding, UBM, sputter targets, solder spheres and fluxes
- Hybrid-bonding materials and consumables: CMP slurries and pads, post-CMP cleans, SiCN/SiO₂ bonding dielectrics, low-temperature and polymer hybrid bonding, die-to-wafer consumables and the adoption roadmap
- Glass-core substrates and interposers: glass types, through-glass via formation, adhesion and seed layers, via fill, cracking and the ecosystem’s timing
- Organic substrate materials: build-up film, cores, T-glass cloth, copper foil and supply constraints
- RDL dielectrics, including benchmarks of how RDL is made and how microvias are formed
- Low-loss dielectric materials for 224 Gb/s data links, co-packaged optics and mmWave
- Underfills and encapsulants, including the latest moulding compound developments
- Temporary bonding and debonding materials, carriers and process tapes
- The stack as a system: interactions, warpage, thermal interface materials and reliability
- Supply chain concentration, regional dynamics, pricing, regulation and corporate restructuring
- Start-up and investment analysis from SemiEngineering funding data, Q3 2024–Q3 2026
- 153 company profiles including 3D Glass Solutions (3DGS), 3M Company, 6K, Absolics Inc., Accurus Scientific (Mi Material Holding), ACM Research, Adeia, ADEKA Corporation, Admatechs, AGC Inc., AIM Solder, Air Liquide Electronics, Ajinomoto / Ajinomoto Fine-Techno, Anji Microelectronics, Applied Materials, Arakawa Chemical Industries, Asahi Kasei, AT&S, BASF (Electronic Materials), BE Semiconductor Industries (Besi), Brewer Science, C. Uyemura & Co., Chang Chun Group, ChEmpower, Corning, Dai Nippon Printing (DNP), Darbond Technology, Daxin Materials, DELO Industrial Adhesives, Denka, Dexerials, DIC Corporation, DNF, Dongjin Semichem, Dongwoo Fine-Chem, Doosan Electronic BG, Dow, Duksan Hi-Metal, Ebara, Elite Material (EMC), Entegris, ErzM-Technologies, Eternal Materials, EuQlid, EV Group, Fabric8Labs, FononTech, Fujifilm Electronic Materials, Fujimi, Fukuda Metal Foil & Powder, Furukawa Electric, Grace Fabric Technology, GRIKIN Advanced Material, Hanmi Semiconductor, Hansol Chemical, HD MicroSystems, Henkel, Heraeus Electronics, HOYA, Hubei Dinglong, Ibiden, Indium Corporation, Ishihara Chemical, JCU, Jiangsu Huahai Chengke, JNTC, JSR, JX Advanced Metals, Kaneka, Kanto Chemical, KCC, KCTech, Kinik, Kools, Kuraray, Kurita Water Industries, Kyocera, Lam Research, Lens Technology, LG Innotek, Lightmatter and more....
Purchasers will receive the following:
- PDF report download/by email.
- Comprehensive Excel spreadsheet of all data.
- Mid-year Update
The Global Market for Advanced Semiconductor Packaging Materials 2027–2037
PDF + Excel Database. The Global Market for Advanced Semiconductor Packaging Materials 2027–2037
PDF + Excel Database + Print Edition. Payment methods: Visa, Mastercard, American Express, Paypal, Bank Transfer. To order by Bank Transfer (Invoice) select this option from the payment methods menu after adding to cart, or use the Request a quote/Pay by invoice button or contact info@futuremarketsinc.com
1 EXECUTIVE SUMMARY 13
- 1.1 The market at a glance 13
- 1.2 Key findings 14
- 1.3 Areas of dedicated coverage 15
- 1.4 The stack must be evaluated as a whole 15
- 1.5 Regional and supplier outlook 16
2 INTRODUCTION AND SCOPE 17
- 2.1 Why packaging materials now decide system performance 17
- 2.2 Report scope 17
- 2.3 Where this report adds coverage 19
- 2.4 Market definition and units 19
- 2.5 Methodology 19
- 2.6 Structure of the report 20
3 THE DEMAND BASE FOR ADVANCED PACKAGING MATERIALS 21
- 3.1 Packaging platforms and their materials signatures 21
- 3.2 AI accelerators: the package as the computer 22
- 3.3 High-bandwidth memory 23
- 3.4 The interconnect pitch roadmap 24
- 3.5 Panels, glass and the scaling of package area 25
- 3.6 Regional capacity build-out 26
4 GLOBAL MARKET FORECASTS 2027–2037 27
- 4.1 Total market 27
- 4.2 Historical base, 2024–2026 30
- 4.3 Materials intensity 31
- 4.4 By region 32
- 4.5 By packaging platform 33
- 4.6 By end-use market 34
- 4.7 Scenarios 35
- 4.8 Pricing assumptions 36
5 FINE-PITCH INTERCONNECT MATERIALS 37
- 5.1 Overview 37
- 5.2 Market size and forecast 38
- 5.3 Copper electroplating chemistries 39
- 5.3.1 Application map 39
- 5.3.2 Additive chemistry 40
- 5.3.3 Nanotwinned and fine-grain copper 41
- 5.3.4 Fine-line RDL and panel-level plating 41
- 5.4 Solder microbumps and solder caps 42
- 5.4.1 Pitch roadmap and the persistence of the microbump 42
- 5.4.2 Alloys and processes 43
- 5.4.3 Thermocompression and fluxless bonding 43
- 5.5 Under-bump metallisation, barrier and seed layers 44
- 5.6 Solder spheres and second-level interconnect 45
- 5.7 Fluxes, flux removers and alternatives 45
- 5.8 Thick-film plating resists 45
- 5.9 Technical challenges and research priorities 45
- 5.10 Competitive landscape 46
6 HYBRID-BONDING MATERIALS AND CONSUMABLES 48
- 6.1 Overview 48
- 6.2 Process flow and consumable map 49
- 6.2.1 Wafer-to-wafer, direct die-to-wafer and collective die-to-wafer 50
- 6.3 CMP slurries, pads and conditioners 51
- 6.3.1 Technical requirements 51
- 6.3.2 Dedicated product launches 51
- 6.3.3 Pads, conditioners and filtration 52
- 6.4 Post-CMP cleans, contamination control and activation 52
- 6.5 Bonding dielectrics and precursors 53
- 6.5.1 Why SiCN 53
- 6.6 Bond-pad copper and die-preparation consumables 54
- 6.7 Low-temperature and room-temperature hybrid bonding 54
- 6.8 Polymer-dielectric hybrid bonding 55
- 6.9 Adoption roadmap 56
- 6.10 Market size and forecast 57
- 6.11 Equipment ecosystem and its influence on materials 59
- 6.12 Intellectual property 59
7 GLASS-CORE SUBSTRATES, GLASS INTERPOSERS AND GLASS METALLISATION 61
- 7.1 Overview 61
- 7.2 Glass materials 62
- 7.3 Through-glass via formation 62
- 7.4 Adhesion and seed layers 64
- 7.4.1 The problem 64
- 7.4.2 Dry routes 64
- 7.4.3 Wet routes 64
- 7.5 Via fill, stress and cracking 65
- 7.5.1 Fill strategies 65
- 7.5.2 Cracking 66
- 7.6 Build-up dielectrics on glass 67
- 7.7 Ecosystem and timing 67
- 7.8 Market size and forecast 68
8 ORGANIC PACKAGE SUBSTRATE MATERIALS 70
- 8.1 Overview 70
- 8.2 Market size and forecast 70
- 8.3 Build-up dielectric film 71
- 8.4 Core laminates, glass cloth and copper foil 72
- 8.5 Substrate-maker demand and investment 73
- 8.6 Technical challenges 73
9 REDISTRIBUTION-LAYER DIELECTRICS 75
- 9.1 Overview 75
- 9.2 Market size and forecast 75
- 9.3 Chemistries 76
- 9.4 Patterning roadmap and damascene RDL 77
- 9.5 RDL formation technologies 78
- 9.6 Requirements and challenges 79
- 9.7 Competitive landscape 79
10 LOW-LOSS DIELECTRIC MATERIALS 80
- 10.1 Overview 80
- 10.2 Market size and forecast 80
- 10.3 Materials and properties 81
- 10.4 Drivers 82
- 10.5 Challenges 82
11 UNDERFILLS AND ENCAPSULANTS 83
- 11.1 Overview 83
- 11.2 Market size and forecast 83
- 11.3 Underfill types 84
- 11.4 Epoxy moulding compounds and liquid moulding 85
- 11.5 Competitive landscape 86
- 11.6 Technical challenges 86
12 TEMPORARY BONDING AND DEBONDING MATERIALS 87
- 12.1 Overview 87
- 12.2 Market size and forecast 87
- 12.3 Debonding technologies 88
- 12.4 Requirements 89
- 12.5 Process tapes 89
- 12.6 Competitive landscape 90
13 THE MATERIALS STACK AS A SYSTEM: INTERACTIONS, RELIABILITY AND RESEARCH PRIORITIES 91
- 13.1 Why the stack must be evaluated as a whole 91
- 13.2 Key interactions 91
- 13.3 Warpage: the integrating problem 92
- 13.4 Thermal management at the materials level 92
- 13.5 Reliability qualification 93
- 13.6 Research priorities 93
14 SUPPLY CHAIN, REGIONAL DYNAMICS, REGULATION AND PRICING 95
- 14.1 Concentration and single points of failure 95
- 14.2 Regional dynamics 96
- 14.3 Pricing 97
- 14.4 Regulation and sustainability 98
- 14.5 Supplier consolidation and corporate change 98
15 START-UP AND INVESTMENT LANDSCAPE 99
- 15.1 Overview 99
- 15.2 Where packaging-relevant capital is going 99
- 15.3 Selected packaging-relevant start-up rounds 100
- 15.4 Implications for materials suppliers 103
16 COMPANY PROFILES 104 (153 company profiles)
17 APPENDIX 416
- 17.1 Research methodology 416
- 17.2 Abbreviations 416
- 17.3 Related Future Markets reports 418
18 REFERENCES 419
- 18.1 Market data and industry statistics 419
- 18.2 Advanced packaging technology, HBM and AI packaging 420
- 18.3 Fine-pitch interconnect materials (plating, solder, UBM, targets, fluxes) 420
- 18.4 Hybrid bonding materials, processes and equipment 422
- 18.5 Glass-core substrates, TGV and glass metallisation 424
- 18.6 Organic substrate materials and low-loss dielectrics 425
- 18.7 Start-up funding and investment (SemiEngineering round-ups etc.) 426
- 18.8 Company announcements and financial disclosures 426
- 18.9 Future Markets companion reports and standards 428
List of Tables
- Table 1. Advanced semiconductor packaging materials market by material class, 2027–2037 (US$ millions). 13
- Table 2. Dedicated coverage in this report. 15
- Table 3. Material classes covered in this report, with the materials and technologies included and the main research questions. 18
- Table 4. Reconciliation with Future Markets companion reports. 20
- Table 5. Advanced packaging platforms and their principal materials consumption. 21
- Table 6. Evolution of AI accelerator packages and implications for materials. 22
- Table 7. HBM generations, stack architecture and materials consumption per stack. 23
- Table 8. Demand drivers and their materials impact, 2027–2037. 25
- Table 9. Advanced semiconductor packaging materials market by material class, 2027–2032 (US$ millions). 27
- Table 10. Advanced semiconductor packaging materials market by material class, 2032–2037 (US$ millions). 27
- Table 11. Absolute growth and CAGR by material class, ranked by growth rate. 28
- Table 12. Market share by material class, 2027, 2030 and 2037. 29
- Table 13. Advanced packaging materials market, 2024–2026 (US$ millions). 30
- Table 14. Packaging materials spend relative to advanced packaging revenue, 2027–2037. 31
- Table 15. Advanced packaging materials market by region of consumption, 2027–2037 (US$ millions). 32
- Table 16. Advanced packaging materials market by packaging platform, 2027–2037 (US$ millions). 33
- Table 17. Advanced packaging materials market by end-use market, 2027–2037 (US$ millions). 34
- Table 18. Scenario analysis for 2037 market value. 35
- Table 19. Price trajectory assumptions by material class (real terms). 36
- Table 20. Fine-pitch interconnect materials market by segment, 2027–2037 (US$ millions, constant 2025 dollars). 38
- Table 21. Market sizing reference points for fine-pitch interconnect materials. 39
- Table 22. Copper electroplating applications in advanced packaging, 2025–2026. 40
- Table 23. Commercial low-temperature copper plating products. 41
- Table 24. Solder bump and microbump pitch roadmap. 42
- Table 25. Solder materials for advanced packaging by application. 43
- Table 26. UBM, barrier and seed stacks in advanced packaging. 44
- Table 27. Technical challenges in fine-pitch interconnect materials and materials responses. 45
- Table 28. Supplier positioning in fine-pitch interconnect materials (Future Markets assessment). 46
- Table 29. Hybrid-bonding process steps and the consumables used at each. 49
- Table 30. Hybrid-bonding CMP and cleaning product launches, 2025–2026. 51
- Table 31. Bonding dielectric options for hybrid bonding. 53
- Table 32. Approaches to lowering the hybrid-bonding thermal budget. 55
- Table 33. Polymer hybrid-bonding development programmes. 55
- Table 34. Inorganic versus organic bonding dielectrics. 56
- Table 35. Hybrid-bonding adoption by application. 56
- Table 36. Hybrid-bonding consumables market by segment, 2027–2037 (US$ millions, constant 2025 dollars). 57
- Table 37. Market reference points for hybrid bonding. 58
- Table 38. Glass types for packaging cores and interposers. 62
- Table 39. TGV formation methods. 62
- Table 40. Glass metallisation chemistries and new entrants, 2025–2026. 65
- Table 41. TGV fill options compared. 66
- Table 42. Glass-core and glass-interposer programmes, status in late 2026. 67
- Table 43. Glass-core and interposer materials market by segment, 2027–2037 (US$ millions, constant 2025 dollars). 68
- Table 44. Organic substrate materials market by segment, 2027–2037 (US$ millions, constant 2025 dollars). 70
- Table 45. Build-up film requirements by generation. 72
- Table 46. Organic substrate material segments, suppliers and constraints. 73
- Table 47. RDL dielectrics market by segment, 2027–2037 (US$ millions, constant 2025 dollars). 75
- Table 48. RDL dielectric chemistries compared. 76
- Table 49. RDL design-rule roadmap and dielectric implications. 77
- Table 50. Benchmark of RDL formation technologies. 78
- Table 51. Microvia formation technologies. 79
- Table 52. Low-loss dielectrics market by segment, 2027–2037 (US$ millions, constant 2025 dollars). 80
- Table 53. Low-loss dielectric material families. 81
- Table 54. Panasonic MEGTRON series — benchmark low-loss laminate properties. 82
- Table 55. Underfills and encapsulants market by segment, 2027–2037 (US$ millions, constant 2025 dollars). 83
- Table 56. Underfill types compared. 84
- Table 57. EMC innovation trends and materials responses. 85
- Table 58. Temporary bonding/debonding market by segment, 2027–2037 (US$ millions, constant 2025 dollars). 87
- Table 59. Debonding mechanisms compared. 88
- Table 60. Principal cross-layer interactions in advanced packages. 91
- Table 61. TIM1 options for advanced packages and their interaction with packaging materials. 93
- Table 62. Research priorities for advanced packaging materials, 2027–2037. 94
- Table 63. Supply concentration in critical advanced packaging materials. 95
- Table 64. Advanced packaging materials market by region of consumption, 2027–2037 (US$ millions). 96
- Table 65. Semiconductor start-up funding by quarter, Q3 2024–Q3 2026. 99
- Table 66. Selected packaging-relevant start-up funding rounds, Q3 2024–Q3 2026. 100
- Table 67. Companies profiled in this report, by headquarters and report category. 104
- Table 68. Abbreviations used in this report. 416
List of Figures
- Figure 1. Advanced semiconductor packaging materials market by material class, 2027–2037. 14
- Figure 2. The eight material classes mapped to a 2.5D/3D AI accelerator package. 16
- Figure 3. The eight material classes mapped to a 2.5D/3D AI accelerator package. 22
- Figure 4. Interconnect pitch roadmap by bonding technology, 2005–2037. 24
- Figure 5. Advanced semiconductor packaging materials market by material class, 2027–2037. 28
- Figure 6. Compound annual growth rate by material class, 2027–2037. The three areas of dedicated coverage are highlighted. 29
- Figure 7. Market value by material class, 2027 vs 2037. 29
- Figure 8. Packaging materials spend as a share of advanced packaging revenue, 2027–2037. 31
- Figure 9. Advanced packaging materials market by region of consumption, 2027–2037. 32
- Figure 10. Advanced packaging materials market by packaging platform, 2027–2037. 33
- Figure 11. Advanced packaging materials market by end-use market, 2027–2037. 35
- Figure 12. Fine-pitch interconnect materials market by segment, 2027–2037 (US$ millions). 38
- Figure 13. Hybrid-bonding process flow and associated materials consumption. 49
- Figure 14. Hybrid-bonding materials and consumables market by segment, 2027–2037 (US$ millions). 58
- Figure 15. Glass-core substrate metallisation stack (schematic). 64
- Figure 16. Glass-core substrate and interposer materials market by segment, 2027–2037 (US$ millions). 69
- Figure 17. Organic package substrate materials market by segment, 2027–2037 (US$ millions). 71
- Figure 18. RDL dielectrics market by chemistry, 2027–2037 (US$ millions). 76
- Figure 19. Low-loss dielectric materials market by segment, 2027–2037 (US$ millions). 81
- Figure 20. Underfills and encapsulants market by segment, 2027–2037 (US$ millions). 84
- Figure 21. Temporary bonding and debonding materials market by segment, 2027–2037 (US$ millions). 88
- Figure 22. Interaction matrix: influence of each material layer on package-level failure modes. 91
- Figure 23. Advanced packaging materials market by region of consumption, 2027–2037. 97
- Figure 24. Start-up funding in packaging-relevant categories, Q3 2024–Q3 2026. 100
Purchasers will receive the following:
- PDF report download/by email.
- Comprehensive Excel spreadsheet of all data.
- Mid-year Update
The Global Market for Advanced Semiconductor Packaging Materials 2027–2037
PDF + Excel Database. The Global Market for Advanced Semiconductor Packaging Materials 2027–2037
PDF + Excel Database + Print Edition. Payment methods: Visa, Mastercard, American Express, Paypal, Bank Transfer. To order by Bank Transfer (Invoice) select this option from the payment methods menu after adding to cart, or use the Request a quote/Pay by invoice button or contact info@futuremarketsinc.com
