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Thermal Interface Materials Market Report 2027-2037

The Global Thermal Interface Materials Market 2027-2037

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Few specialty materials segments are experiencing demand pressure from as many directions simultaneously as the thermal interface materials market. AI GPU power densities are escalating faster than conventional cooling architectures can follow. EV battery packs require precise cell-level thermal management across tens of millions of vehicles annually. Advanced chiplet-based semiconductor packages concentrate heat in configurations that legacy TIM formulations cannot adequately manage. All three demand signals are compounding at the same time — making the thermal interface materials market one of the strongest structural growth stories in advanced electronic materials through the forecast period.

What further distinguishes the thermal interface materials market is the breadth of the performance requirement spectrum it must serve. The same product category spans low-cost polymer pads for consumer electronics and ultra-high-performance liquid metal TIMs for extreme AI GPU applications — a range that no other electronic materials segment matches — and both ends of that spectrum are growing.

Thermal Interface Materials Market Report 2027-2037 — Key Coverage Areas

  • Thermal Greases and Compounds — silicone and non-silicone thermal greases, metallic thermal compounds using silver or indium particles, and ultra-high-performance TIM formulations developed specifically for NVIDIA Hopper, Blackwell, and next-generation AI GPU packages where die-to-IHS interface resistance is a critical performance parameter
  • Phase-Change Thermal Interface Materials — polymer-based and fusible metal phase-change materials for PCB-level assembly, memory module interfaces, and power module applications requiring re-workability after field deployment
  • Thermal Pad Products — reinforced and non-reinforced polymer-based thermal pads, pyrolytic graphite sheets, exfoliated graphite pads, and indium metal pads covering the full performance and cost spectrum of the pad product category
  • Liquid Metal Thermal Interface Materials — gallium-indium and gallium-indium-tin alloy TIMs delivering the highest available thermal conductivity for CPU and GPU cooling, including application engineering challenges and containment design requirements
  • EV Battery Thermal Interface Materials — cell-to-module and module-to-pack gap filler materials, thermally conductive structural adhesives for cell bonding, and potting compounds for power electronics modules in EV drivetrains
  • Advanced Carbon-Based TIMs — graphene films, laminates, and heat spreaders; vertically aligned carbon nanotube array TIMs; and carbon nanofiber composite materials addressing the performance ceiling of conventional polymer-based products
  • Power Electronics TIMs — materials for SiC and GaN power modules operating at elevated junction temperatures in EV inverters, industrial drives, and renewable energy converters
  • Competitive Landscape — Henkel, Shin-Etsu, Parker LORD, Bergquist, Laird Thermal, Fujipoly, and emerging materials companies with detailed product portfolio and market positioning analysis
  • Regional Market Analysis — North America, Europe, Asia-Pacific, and country-level demand covering Japan, South Korea, Taiwan, and China through 2037
  • 10-Year Forecasts — market value by product type, application segment, and region from 2027 through 2037

The thermal interface materials market report is essential for materials engineers, procurement teams, and strategic planners at semiconductor companies, EV manufacturers, power electronics developers, and consumer electronics OEMs.

Ideal for semiconductor packaging engineers, EV battery developers, thermal management material suppliers, electronics manufacturers, and technology investors.

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  • Published: August 2026
  • Pages: 391
  • Tables: 117
  • Figures: 89

 

Thermal interface materials fill the microscopic voids between a heat-generating component and the surface carrying heat away, and they have moved from a commodity consumable to a rate-limiting factor in electronics design.  Demand is set by power density rather than device count. GPUs running AI workloads dissipate heat fluxes on the order of 140 W/cm², while three-dimensional stacked architectures record average fluxes near 300 W/cm² with localised hotspots between 500 and 1,000 W/cm². Filled polymers, adequate when packages dissipated around 100 W, are reaching their ceiling as advanced packages approach 1,000 W. Metal interfaces, indium alloys in particular, are increasingly specified above roughly 400 W, where switching from polymer has been shown to cut junction temperature by more than 10°C — significant given a 10°C rise typically halves die lifetime.

This report provides a comprehensive technical and commercial assessment of thermal interface materials across eleven end markets. The market is analysed from the materials up. Coverage spans greases and pastes, gap pads, dispensed gap fillers, potting compounds and encapsulants, adhesive tapes, phase change materials, metal-based interfaces including solders, sintered silver and copper, and liquid metals, and the full range of carbon-based options from graphite sheet to vertically aligned nanotube arrays and graphene composites. Filler chemistry is treated separately, covering alumina, boron nitride, aluminium nitride, diamond, graphene and boron nitride nanotubes, with pricing and adoption barriers for each.

A dedicated chapter addresses emerging materials and processes, organised by the engineering problem each solves rather than by chemistry. It covers TIM0 through TIM3 nomenclature and the collapse in allowable application pressure for large HPC modules, hybrid and confined liquid metal architectures, warpage-tolerant phase change materials for AI server dies, anchored nanocarbon interfaces, very high density graphite, boron arsenide, liquid-infused nanowire composites, die backside power delivery, immersion cooling compatibility, AI-directed formulation discovery, circularity, and the shift from datasheet-based specification to knowledge-based qualification.

Market forecasts are provided for consumer electronics, electric vehicles, data centres, advanced semiconductor packaging, ADAS sensors, EMI shielding, 5G infrastructure, aerospace and defence, industrial electronics, renewable energy and medical electronics, segmented by material type at annual granularity. Area forecasts in m² are given for server boards, ADAS die attach, 5G antennas, baseband units and power supplies, alongside a 5G power consumption model.

The report profiles 118 companies across the value chain, from multinational formulators to venture-backed materials startups, with recent product launches, partnerships and corporate developments. An accompanying Excel workbook contains all underlying data as live, editable models.

Contents include: 

  • Introduction — active and passive thermal management, TIM types and thermal conductivity, comparative properties, pads versus grease, advantages and disadvantages by type, performance, prices, supply chain, raw material analysis and pricing, environmental regulations and sustainability, system-level performance, thermal conductivity versus thermal resistance, TIM chemistry
  • Materials — advanced and multi-functional TIMs, fillers and trends, greases and pastes, gap pads, gap fillers, potting compounds and encapsulants, adhesive tapes, phase change materials, metal-based TIMs, carbon-based TIMs, metamaterials, self-healing TIMs, dispensing equipment and methods
  • Emerging materials and processes — interface as constraint, TIM0–TIM3 nomenclature, hybrid and confined liquid metals, next-generation PCMs, anchored nanocarbon, graphene and VHD graphite, boron nitride and boron arsenide, liquid-infused and nanowire composites, metal TIM1, heterogeneous integration and backside power, immersion cooling, AI-directed discovery, sustainability and circularity, metrology and qualification, networking silicon
  • Markets — consumer electronics, electric vehicles, data centres, advanced semiconductor packaging, ADAS sensors, EMI shielding, 5G, aerospace and defence, industrial electronics, renewable energy, medical electronics
  • 118 Company profiles. Companies profiled include  3M, ADA Technologies, Aismalibar, AI Technology, Alpha Assembly, AluChem, AOK Technologies, AOS Thermal Compounds, Arkema, Arieca, ATP Adhesive Systems, Aztrong, Bando Chemical Industries, Bdtronic, BestGraphene, BNNano, BNNT, Boston Materials, Boyd Corporation, BYK, Cambridge Nanotherm, Carbice, Carbon Waters, Carbodeon, CondAlign, Denka, Detakta, Dexerials, Deyang Carbonene Technology, Discovered Materials, Dow Corning, Dowa Electronics Materials, Dymax, Dynex Semiconductor (CRRC), ELANTAS, Elkem Silcones, Enerdyne Thermal Solutions, Epoxies Etc., First Graphene, Fujipoly, Fujitsu Laboratories, GCS Thermal, GLPOLY, Global Graphene Group, Goodfellow, Graphmatech, Green Critical Minerals, GuangDong KingBali New Material, HALA Contec, Hamamatsu Carbonics, H.B. Fuller, Henkel, Hitek Electronic Materials, Honeywell, Hongfucheng New Materials, Huber Martinswerk, HyMet Thermal Interfaces, Indium Corporation, Inkron, KB Element, Kerafol, Kitagawa and more.....

 

 

1             INTRODUCTION          21

  • 1.1        Thermal Management-active and passive  21
  • 1.2        What are Thermal Interface Materials (TIMs)?         21
    • 1.2.1    Types of TIMs 23
    • 1.2.2    Thermal conductivity                24
  • 1.3        Comparative properties of TIMs        25
  • 1.4        Thermal Pads and Thermal Grease  29
  • 1.5        Advantages and Disadvantages of TIMs, by type    30
  • 1.6        Performance  32
  • 1.7        Prices  35
  • 1.8        Emerging Technologies in TIMs          35
  • 1.9        Supply Chain for TIMs              36
  • 1.10     Raw Material Analysis and Pricing   37
  • 1.11     Environmental Regulations and Sustainability        37
  • 1.12     System Level Performance   38
  • 1.13     Thermal Conductivity vs Thermal Resistance          39
  • 1.14     TIM Chemistry               40

 

2             MATERIALS      42

  • 2.1        Advanced and Multi-Functional TIMs            43
    • 2.1.1    Carbon-based TIMs   44
      • 2.1.1.1 Overview           44
    • 2.1.2    Thermal Conductivity By Filler Type 45
    • 2.1.3    Thermal Conductivity By Matrix         46
  • 2.2        TIM fillers          47
    • 2.2.1    Trends 48
    • 2.2.2    Pros and Cons              49
    • 2.2.3    Thermal Conductivity               50
    • 2.2.4    Spherical Alumina      51
    • 2.2.5    Alumina Fillers              51
    • 2.2.6    Boron nitride (BN)       52
      • 2.2.6.1 Overview           52
      • 2.2.6.2 Suppliers          53
      • 2.2.6.3 Nano Boron Nitride    55
    • 2.2.7    Filler and polymer TIMs           57
    • 2.2.8    Diamond          58
    • 2.2.9    Filler Sizes        60
  • 2.3        Thermal Greases and Pastes              61
    • 2.3.1    Overview and properties        61
    • 2.3.2    SWOT analysis              65
  • 2.4        Thermal Gap Pads      66
    • 2.4.1    Overview and properties        66
    • 2.4.2    Application in EV Batteries    67
    • 2.4.3    Transitioning to Gap fillers from Pads            67
    • 2.4.4    SWOT analysis              68
  • 2.5        Thermal Gap Fillers    70
    • 2.5.1    Overview and properties        70
    • 2.5.2    Products           70
    • 2.5.3    SWOT analysis              71
  • 2.6        Potting Compounds/Encapsulants 73
    • 2.6.1    Overview and properties        73
    • 2.6.2    SWOT analysis              75
  • 2.7        Adhesive Tapes             77
    • 2.7.1    Overview and properties        77
    • 2.7.2    Application in EV Batteries    78
    • 2.7.3    TCA Requirements     79
    • 2.7.4    SWOT analysis              79
  • 2.8        Phase Change Materials         81
    • 2.8.1    Overview           81
    • 2.8.2    Products           81
    • 2.8.3    Properties         82
    • 2.8.4    Types   83
      • 2.8.4.1 Organic/biobased phase change materials               84
        • 2.8.4.1.1           Advantages and disadvantages        85
        • 2.8.4.1.2           Paraffin wax    85
        • 2.8.4.1.3           Non-Paraffins/Bio-based      86
      • 2.8.4.2 Inorganic phase change materials   86
        • 2.8.4.2.1           Salt hydrates  86
          • 2.8.4.2.1.1      Advantages and disadvantages        87
        • 2.8.4.2.2           Metal and metal alloy PCMs (High-temperature)   87
      • 2.8.4.3 Eutectic mixtures        88
      • 2.8.4.4 Encapsulation of PCMs           88
        • 2.8.4.4.1           Macroencapsulation 89
        • 2.8.4.4.2           Micro/nanoencapsulation    89
      • 2.8.4.5 Nanomaterial phase change materials         89
    • 2.8.5    Thermal energy storage (TES)              89
    • 2.8.5.1 Sensible heat storage              90
    • 2.8.5.2 Latent heat storage    90
    • 2.8.6    Application in TIMs    91
      • 2.8.6.1 Thermal pads 92
      • 2.8.6.2 Low Melting Alloys (LMAs)    93
      • 2.8.6.3 Thermal storage units              93
      • 2.8.6.4 Thermal energy storage panels          93
      • 2.8.6.5 Space systems             94
    • 2.8.7    SWOT analysis              96
  • 2.9        Metal-based TIMs       97
    • 2.9.1    Overview           97
      • 2.9.1.1 Metal-Based TIM1 and TIM2 97
      • 2.9.1.2 Metal Filled Polymer TIMs      98
    • 2.9.2    Solders and low melting temperature alloy TIMs   98
      • 2.9.2.1 Solder TIM1     100
      • 2.9.2.2 Sintering            101
    • 2.9.3    Liquid metals 103
      • 2.9.3.1 Liquid metal for high-performance GPU      104
      • 2.9.3.2 Challenges      105
    • 2.9.4    Solid liquid hybrid (SLH) metals        105
      • 2.9.4.1 Hybrid liquid metal pastes    105
      • 2.9.4.2 SLH created during chip assembly (m2TIMs)           107
      • 2.9.4.3 Die-attach materials 107
        • 2.9.4.3.1           Solder Alloys and Conductive Adhesives    109
        • 2.9.4.3.2           Silver-Sintered Paste 111
        • 2.9.4.3.3           Copper (Cu) sintered TIMs    112
          • 2.9.4.3.3.1      TIM1 - Sintered Copper            112
          • 2.9.4.3.3.2      Cu Sinter Materials    113
          • 2.9.4.3.3.3      Copper Sintering Challenges              115
          • 2.9.4.3.3.4      Commercial Use         116
        • 2.9.4.3.4           Sintered Copper Die-Bonding Paste               116
          • 2.9.4.3.4.1      Commercial activity  117
        • 2.9.4.3.5           Graphene Enhanced Sintered Copper TIMs              117
      • 2.9.4.4 Laminar Metal Form With High Softness     117
    • 2.9.5    SWOT analysis              118
  • 2.10     Carbon-based TIMs   120
    • 2.10.1 Carbon nanotube (CNT) TIM Fabrication     120
    • 2.10.2 Challenges      121
    • 2.10.3 Market players               122
    • 2.10.4 Multi-walled nanotubes (MWCNT)  123
      • 2.10.4.1            Properties         123
      • 2.10.4.2            Application as thermal interface materials                124
    • 2.10.5 Single-walled carbon nanotubes (SWCNTs)             125
      • 2.10.5.1            Properties         125
      • 2.10.5.2            Application as thermal interface materials                127
    • 2.10.6 Vertically aligned CNTs (VACNTs)     128
      • 2.10.6.1            Properties         128
      • 2.10.6.2            Applications   128
      • 2.10.6.3            Application as thermal interface materials                129
    • 2.10.7 BN nanotubes (BNNT) and nanosheets (BNNS)      129
      • 2.10.7.1            Properties         130
      • 2.10.7.2            Application as thermal interface materials                130
    • 2.10.8 Graphene         131
      • 2.10.8.1            Properties         132
      • 2.10.8.2            Application as thermal interface materials                133
        • 2.10.8.2.1        Graphene fillers            134
        • 2.10.8.2.2        Graphene foam            135
        • 2.10.8.2.3        Graphene aerogel       135
        • 2.10.8.2.4        Graphene Heat Spreaders     135
        • 2.10.8.2.5        Graphene in Thermal Interface Pads              136
      • 2.10.8.3            Advantages of Graphene        137
      • 2.10.8.4            Through-Plane Alignment      138
    • 2.10.9 Nanodiamonds            138
      • 2.10.9.1            Properties         138
      • 2.10.9.2            Application as thermal interface materials                140
    • 2.10.10              Graphite            140
      • 2.10.10.1         Properties         140
      • 2.10.10.2         Natural graphite           141
        • 2.10.10.2.1     Classification 142
        • 2.10.10.2.2     Processing       143
        • 2.10.10.2.3     Flake    143
          • 2.10.10.2.3.1 Grades               144
          • 2.10.10.2.3.2 Applications   144
      • 2.10.10.3         Synthetic graphite      146
        • 2.10.10.3.1     Classification 146
          • 2.10.10.3.1.1 Primary synthetic graphite    146
          • 2.10.10.3.1.2 Secondary synthetic graphite             147
          • 2.10.10.3.1.3 Processing       147
      • 2.10.10.4         Applications as thermal interface materials             147
        • 2.10.10.4.1     Graphite Sheets           148
        • 2.10.10.4.2     Vertical graphite          149
        • 2.10.10.4.3     Graphite pastes           150
      • 2.10.10.5         Challenges      150
        • 2.10.10.5.1     Through-plane thermal conductivity limitations    150
        • 2.10.10.5.2     Interfacing with Heat Source and Disrupting Alignment    151
    • 2.10.11              Hexagonal Boron Nitride        151
      • 2.10.11.1         Properties         152
      • 2.10.11.2         Application as thermal interface materials                153
    • 2.10.12              SWOT analysis              154
  • 2.11     Metamaterials               155
    • 2.11.1 Types and properties 155
      • 2.11.1.1            Electromagnetic metamaterials       156
        • 2.11.1.1.1        Double negative (DNG) metamaterials         156
        • 2.11.1.1.2        Single negative metamaterials           157
        • 2.11.1.1.3        Electromagnetic bandgap metamaterials (EBG)    157
        • 2.11.1.1.4        Bi-isotropic and bianisotropic metamaterials          157
        • 2.11.1.1.5        Chiral metamaterials                157
        • 2.11.1.1.6        Electromagnetic “Invisibility” cloak 158
      • 2.11.1.2            Terahertz metamaterials        158
      • 2.11.1.3            Photonic metamaterials         158
      • 2.11.1.4            Tunable metamaterials           159
      • 2.11.1.5            Frequency selective surface (FSS) based metamaterials 159
      • 2.11.1.6            Nonlinear metamaterials       159
      • 2.11.1.7            Acoustic metamaterials         160
    • 2.11.2 Application as thermal interface materials                160
  • 2.12     Self-healing thermal interface materials     160
    • 2.12.1 Extrinsic self-healing 162
    • 2.12.2 Capsule-based             162
    • 2.12.3 Vascular self-healing 162
    • 2.12.4 Intrinsic self-healing 162
    • 2.12.5 Healing volume            163
    • 2.12.6 Types of self-healing materials, polymers and coatings    164
    • 2.12.7 Applications in thermal interface materials              165
  • 2.13     TIM Dispensing             165
    • 2.13.1 Low-volume Dispensing Methods    165
    • 2.13.2 High-volume Dispensing Methods  166
    • 2.13.3 Meter, Mix, Dispense (MMD) Systems           166
    • 2.13.4 TIM Dispensing Equipment Suppliers            167

 

3             MARKETS FOR THERMAL INTERFACE MATERIALS (TIMs)  169

  • 3.1        Consumer Electronics             169
    • 3.1.1    Market overview           169
      • 3.1.1.1 Market drivers                169
      • 3.1.1.2 Applications   170
        • 3.1.1.2.1           Smartphones and tablets      171
          • 3.1.1.2.1.1      Graphitic Heat Spreaders      174
          • 3.1.1.2.1.2      Liquid metals 175
        • 3.1.1.2.2           Wearable electronics                176
    • 3.1.2    Global market 2022-2037, by TIM type          177
  • 3.2        Electric Vehicles (EV)               179
    • 3.2.1    Market overview           179
      • 3.2.1.1 Market drivers                179
      • 3.2.1.2 Applications   179
        • 3.2.1.2.1           EV Battery Packs         180
          • 3.2.1.2.1.1      TIM Pack and Module               180
          • 3.2.1.2.1.2      TIM Application by Cell Format          180
          • 3.2.1.2.1.3      Thermal Interface Material Fillers for EV Batteries 182
          • 3.2.1.2.1.4      TIM Pricing       184
          • 3.2.1.2.1.5      Companies     184
        • 3.2.1.2.2           Lithium-ion batteries 185
          • 3.2.1.2.2.1      Cell-to-pack designs 186
          • 3.2.1.2.2.2      Cell-to-chassis/body                187
        • 3.2.1.2.3           Power electronics       189
          • 3.2.1.2.3.1      Types   190
          • 3.2.1.2.3.2      Trends 190
          • 3.2.1.2.3.3      Properties for TIM2 Properties  in EV power electronics     191
          • 3.2.1.2.3.4      TIM1s  194
          • 3.2.1.2.3.5      TIM2 in SiC MOSFET  196
        • 3.2.1.2.4           Charging stations        197
    • 3.2.2    Global market 2022-2037, by TIM type          197
  • 3.3        Data Centers  200
    • 3.3.1    Market overview           200
      • 3.3.1.1 Market drivers                200
      • 3.3.1.2 Applications   201
        • 3.3.1.2.1           Router, switches and line cards         201
          • 3.3.1.2.1.1      Transceivers   203
          • 3.3.1.2.1.2      Server Boards                203
          • 3.3.1.2.1.3      Switches and Routers              205
        • 3.3.1.2.2           AI Servers         206
          • 3.3.1.2.2.1      Overview           206
          • 3.3.1.2.2.2      Trends 206
          • 3.3.1.2.2.3      TRL       209
        • 3.3.1.2.3           Power supply converters        216
          • 3.3.1.2.3.1      Overview           216
          • 3.3.1.2.3.2      Laminar metal form TIMs       216
          • 3.3.1.2.3.3      TIM Consumption in Data Center Power Supplies 217
          • 3.3.1.2.3.4      Immersion cooling     218
    • 3.3.2    Global market 2022-2037, by TIM type          219
  • 3.4        Advanced Semiconductor Packaging           221
    • 3.4.1    Market Overview          221
    • 3.4.2    TIM1     222
      • 3.4.2.1 Indium foil TIM1           222
      • 3.4.2.2 Products           222
        • 3.4.2.2.1           Thermal Gel    223
        • 3.4.2.2.2           Thermal grease             223
        • 3.4.2.2.3           Graphene         224
        • 3.4.2.2.4           Liquid metal   225
        • 3.4.2.2.5           Diamond thermal interface materials in TIM0 applications            226
        • 3.4.2.2.6           Integrated silicon micro-cooler systems     226
        • 3.4.2.2.7           Copper nanowire (CuNWs)  227
    • 3.4.3    Global market 2022-2037, by TIM type          228
  • 3.5        ADAS Sensors               230
    • 3.5.1    Market overview           230
      • 3.5.1.1 Market drivers                230
        • 3.5.1.1.1           Sensor Suite for Autonomous Cars 230
        • 3.5.1.1.2           Thermal Management in ADAS Sensors       231
      • 3.5.1.2 Applications   232
        • 3.5.1.2.1           ADAS Cameras             233
          • 3.5.1.2.1.1      Commercial examples            233
        • 3.5.1.2.2           ADAS Radar    234
          • 3.5.1.2.2.1      Radar technology        234
          • 3.5.1.2.2.2      Radar boards 235
          • 3.5.1.2.2.3      Commercial examples            236
        • 3.5.1.2.3           ADAS LiDAR    237
          • 3.5.1.2.3.1      Role of TIMs    237
          • 3.5.1.2.3.2      Commercial examples            237
        • 3.5.1.2.4           Electronic control units (ECUs) and computers      238
          • 3.5.1.2.4.1      Overview           238
          • 3.5.1.2.4.2      Commercial examples            239
        • 3.5.1.2.5           Die attach materials  240
          • 3.5.1.2.5.1      Overview           240
          • 3.5.1.2.5.2      Commercial examples            241
      • 3.5.1.3 Companies     243
    • 3.5.2    Global market 2022-2037, by TIM type          244
  • 3.6        EMI shielding 246
    • 3.6.1    Market overview           246
      • 3.6.1.1 Market drivers                246
      • 3.6.1.2 Applications   246
        • 3.6.1.2.1           Dielectric Constant   247
        • 3.6.1.2.2           ADAS   248
          • 3.6.1.2.2.1      Radar  249
          • 3.6.1.2.2.2      5G         249
        • 3.6.1.2.3           Commercial examples            250
  • 3.7        5G         251
    • 3.7.1    Market overview           251
      • 3.7.1.1 Market drivers                251
      • 3.7.1.2 Applications   251
        • 3.7.1.2.1           EMI shielding and EMI gaskets           252
        • 3.7.1.2.2           Antenna            252
        • 3.7.1.2.3           Base Band Unit (BBU)              255
        • 3.7.1.2.4           Liquid TIMs      258
        • 3.7.1.2.5           Power supplies             258
          • 3.7.1.2.5.1      Increased power consumption in 5G             259
    • 3.7.2    Market players               260
    • 3.7.3    Global market 2022-2037, by TIM type          260
  • 3.8        Aerospace & Defense               262
    • 3.8.1    Market overview           262
      • 3.8.1.1 Market drivers                262
      • 3.8.1.2 Applications   262
        • 3.8.1.2.1           Satellite thermal management          262
          • 3.8.1.2.1.1      Temperature range     263
          • 3.8.1.2.1.2      Heat Spreaders            264
          • 3.8.1.2.1.3      Carbon fiber reinforced TIM 264
          • 3.8.1.2.1.4      Thermal pads 265
          • 3.8.1.2.1.5      Thermal straps             266
          • 3.8.1.2.1.6      Graphene         266
          • 3.8.1.2.1.7      Challenges      267
        • 3.8.1.2.2           Avionics cooling           269
        • 3.8.1.2.3           Military electronics     269
      • 3.8.1.3 Global market 2022-2037, by TIM type          269
  • 3.9        Industrial Electronics               271
    • 3.9.1    Market overview           271
      • 3.9.1.1 Market drivers                271
      • 3.9.1.2 Applications   272
        • 3.9.1.2.1           Industrial automation              272
        • 3.9.1.2.2           Power supplies             272
        • 3.9.1.2.3           Motor drives    272
        • 3.9.1.2.4           LED lighting     273
    • 3.9.2    Global market 2022-2037, by TIM type          273
  • 3.10     Renewable Energy      274
    • 3.10.1 Market overview           274
      • 3.10.1.1            Market drivers                274
      • 3.10.1.2            Applications   275
        • 3.10.1.2.1        Solar inverters               275
        • 3.10.1.2.2        Wind power electronics          275
        • 3.10.1.2.3        Energy storage systems          275
    • 3.10.2 Global market 2022-2037, by TIM type          276
  • 3.11     Medical Electronics   278
    • 3.11.1 Market overview           278
      • 3.11.1.1            Market drivers                278
      • 3.11.1.2            Applications   278
        • 3.11.1.2.1        Diagnostic equipment             278
        • 3.11.1.2.2        Medical imaging systems      279
        • 3.11.1.2.3        Patient monitoring devices   279
    • 3.11.2 Global market 2022-2037, by TIM type          279

 

4             COMPANY PROFILES                281 (116 company profiles)

 

5             RESEARCH METHODOLOGY              366

 

6             REFERENCES 367

 

List of Tables

  • Table 1. Thermal conductivities (κ) of common metallic, carbon, and ceramic fillers employed in TIMs.                25
  • Table 2. Commercial TIMs and their properties.     26
  • Table 3. Advantages and disadvantages of TIMs, by type. 30
  • Table 4. Key Factors in System Level Performance for TIMs.          32
  • Table 5. TIM Materials by Thermal, Mechanical, and Application Properties        33
  • Table 6. Thermal interface materials prices.             35
  • Table 7. Comparisons of Price and Thermal Conductivity for TIMs.           35
  • Table 8. Price Comparison of TIM Fillers.     35
  • Table 9. Raw Material Analysis and Pricing.               37
  • Table 10. System Level Performance Comparison.              38
  • Table 11. Thermal Conductivity vs Thermal Resistance Comparison.     39
  • Table 12. TIM Chemistry Comparison           40
  • Table 13. Characteristics of some typical TIMs.     42
  • Table 14. Carbon-Based TIM Performance.               44
  • Table 15. Thermal Conductivity By Filler Type           46
  • Table 16. Thermal Conductivity By Matrix.  47
  • Table 17. Trends on TIM Fillers.          49
  • Table 18. Pros and Cons of TIM Fillers.          49
  • Table 19. Thermal Conductivity Comparison ATH and Al2O3.       52
  • Table 20. BNNT Companies and Prices.       55
  • Table 21.BNNT Property Variation.  56
  • Table 22. Diamond fillers with varied sizes for thermal interface materials.        59
  • Table 23. Commercial thermal paste products.     63
  • Table 24.Commercial thermal gap pads (thermal interface materials).  66
  • Table 25. Commercial thermal gap fillers products.            70
  • Table 26. Types of Potting Compounds/Encapsulants.     74
  • Table 27. TIM adhesives tapes.          77
  • Table 28. Commercial phase change materials (PCM) thermal interface materials (TIMs) products. 81
  • Table 29. Properties of PCMs.             82
  • Table 30.  PCM Types and properties.            84
  • Table 31. Advantages and disadvantages of organic PCMs.           85
  • Table 32. Advantages and disadvantages of organic PCM Fatty Acids.    86
  • Table 33. Advantages and disadvantages of salt hydrates               87
  • Table 34. Advantages and disadvantages of low melting point metals.   88
  • Table 35. Advantages and disadvantages of eutectics.      88
  • Table 36. Benefits and drawbacks of PCMs in TIMs.            91
  • Table 37. PCM Selection Criteria and Considerations for Space Systems.           94
  • Table 38. PCM selection criteria and considerations for space systems.              95
  • Table 39. Liquid Metal Challenges. 105
  • Table 40. Copper Sintering Technical Challenges. 115
  • Table 41. Technology Readiness Level (TRL) for Carbon Materials in Thermal Management     120
  • Table 42. Challenges with CNT-TIMs.             121
  • Table 43. Market players in CNT-TIMs.          122
  • Table 44. Properties of CNTs and comparable materials. 123
  • Table 45. Typical properties of SWCNT and MWCNT.          125
  • Table 46. Comparison of carbon-based additives in terms of the main parameters influencing their value proposition as a conductive additive.              127
  • Table 47. Thermal conductivity of CNT-based polymer composites.        129
  • Table 48. Comparative properties of BNNTs and CNTs.     130
  • Table 49. Properties of graphene, properties of competing materials, applications thereof.     132
  • Table 50. Graphene Heat Spreaders Performance.              136
  • Table 51. Comparison of Conventional and Graphene-Enhanced Thermal Pads.            137
  • Table 52. Advantages of Graphene in Thermal Interface Materials             137
  • Table 53. Properties of nanodiamonds.       139
  • Table 54. Comparison between Natural and Synthetic Graphite.               140
  • Table 55. Thermal Conductivity Comparison of Graphite TIMs.   141
  • Table 56. Classification of natural graphite with its characteristics.         142
  • Table 57. Characteristics of synthetic graphite.      146
  • Table 58. Thermal Conductivity Comparison of Graphite TIMs.   150
  • Table 59. Properties of hexagonal boron nitride (h-BN).    153
  • Table 60. Comparison of self-healing systems.      163
  • Table 61. Types of self-healing coatings and materials.     164
  • Table 62. Comparative properties of self-healing materials.          165
  • Table 63. Challenges for Dispensing TIM.   165
  • Table 64. Thermal Management Application Areas in Consumer Electronics.    169
  • Table 65. Thermal Management Differences: 4G vs 5G Smartphones.    170
  • Table 66. Trends in Smartphone Thermal Materials.            171
  • Table 67. Thermal Management approaches in commercial Smartphones.        173
  • Table 68. Global market in consumer electronics 2022-2037, by TIM type (millions USD).        177
  • Table 69. Material Options and Market Comparison.          181
  • Table 70. TIM Filler Comparison and Adoption.       183
  • Table 71. Thermal Conductivity Comparison of Suppliers for EV Batteries.          183
  • Table 72. TIM Pricing by Supplier.      184
  • Table 73. Thermal Conductivity Comparison of TIM1s.     194
  • Table 74. Global market in electric vehicles 2022-2037, by TIM type (millions USD).     198
  • Table 75. Types of TIMs in Data Centers.      200
  • Table 76. Area of TIM per Switch.      203
  • Table 77. Leaf and Spine Switch TIM Areas.               204
  • Table 78. Novel TIM Technologies in Data Centers.               204
  • Table 79. Emerging Trends in TIM Materials for AI Servers.               206
  • Table 80. Applications of TIM Materials in AI Servers with Technology Readiness Levels (TRL).              209
  • Table 81. Companies Utilizing and Providing TIM Materials for AI Servers              212
  • Table 82. TIM Trends in Data Centers.            217
  • Table 83. TIM Area Forecast in Server Boards: 2022-2037 (m2).  218
  • Table 84. Global market in data centers 2022-2037, by TIM type (millions USD).             219
  • Table 85. Global market in advanced semiconductor packaging 2022-2037, by TIM type (millions USD).                228
  • Table 86. Autonomous Vehicle Sensor Suite TIM Requirements. 231
  • Table 87. TIM Players in ADAS.            232
  • Table 88. TIM Players in ADAS.            233
  • Table 89. Die Attach for ADAS Sensors.        242
  • Table 90. Die Attach Area Forecast for Key Components Within ADAS Sensors: 2022-2037 (m2).       242
  • Table 91. TIM Players in ADAS              243
  • Table 92. Global market in ADAS sensors 2022-2037, by TIM type (millions USD).          244
  • Table 93. Applications of TIMs in EMI Shielding for ADAS Radars.              248
  • Table 94. TIM Area Forecast for 5G Antennas by Station Size: 2022-2037 (m2). 254
  • Table 95. TIM Area Forecast for 5G Antennas by Station Frequency: 2022-2037 (m2). 254
  • Table 96. TIMS in BBU.             255
  • Table 97. 5G BBY models.      257
  • Table 98. TIM Area Forecast for 5G BBU: 2022-2037 (m2).              257
  • Table 99. Power Consumption Forecast for 5G: 2022-2037 (GW).             259
  • Table 100. TIM Area Forecast for Power Supplies: 2022-2037 (m2).          259
  • Table 101. TIM market players in 5G.              260
  • Table 102. Global market in 5G 2022-2037, by TIM type (millions USD). 261
  • Table 103. Market Drivers for TIMS in aerospace and defense.     262
  • Table 104. Applications for TIMS in aerospace and defense.          262
  • Table 105. Temperature range of space subsystems and passive cooling approaches.               263
  • Table 106. TIMs for space satellites - challenges and considerations.     267
  • Table 107. Global Market for TIMs in aerospace and defense 2022-2037, by TIM Type (Millions USD).                270
  • Table 108. Market Drivers for TIMs in industrial electronics.           271
  • Table 109. Applications for TIMs in industrial electronics.               272
  • Table 110. Global Market 2022-2037, by TIM Type in Industrial Electronics (Millions USD).      273
  • Table 111. Market Drivers for TIMs in renewable energy.   274
  • Table 112. Applications for TIMs in renewable energy.        275
  • Table 113. Global Market for TIMs in Renewable Energy 2022-2037 (Millions USD).      276
  • Table 114. Market Drivers for TIMs in medical electronics.              278
  • Table 115. Applications for TIMs in medical electronics.  278
  • Table 116. Global Market 2022-2037 for TIMs in Medical Electronics (Millions USD).   279

 

List of Figures

  • Figure 1. (L-R) Surface of a commercial heatsink surface at progressively higher magnifications, showing tool marks that create a rough surface and a need for a thermal interface material. 22
  • Figure 2. Schematic of thermal interface materials used in a flip chip package.              23
  • Figure 3. Thermal grease.      24
  • Figure 4. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module.             24
  • Figure 5. Supply Chain for TIMs.        36
  • Figure 6. Commercial thermal paste products.      61
  • Figure 7. Application of thermal silicone grease.   62
  • Figure 8. A range of thermal grease products.          62
  • Figure 9. SWOT analysis for thermal greases and pastes. 65
  • Figure 10. Thermal Pad.          66
  • Figure 11. SWOT analysis for thermal gap pads.    69
  • Figure 12. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module.             70
  • Figure 13. SWOT analysis for thermal gap fillers.   72
  • Figure 14. SWOT analysis for Potting compounds/encapsulants.              76
  • Figure 15. Thermal adhesive products.         77
  • Figure 16. SWOT analysis for TIM adhesives tapes.              80
  • Figure 17. Phase-change TIM products.       81
  • Figure 18. PCM mode of operation. 83
  • Figure 19. Classification of PCMs.   83
  • Figure 20. Phase-change materials in their original states.             84
  • Figure 21. Thermal energy storage materials.           90
  • Figure 22. Phase Change Material transient behaviour.     90
  • Figure 23. PCM TIMs. 92
  • Figure 24. Phase Change Material - die cut pads ready for assembly.      92
  • Figure 25. SWOT analysis for phase change materials.      96
  • Figure 26. Typical IC package construction identifying TIM1 and TIM2    99
  • Figure 27. Liquid metal TIM product.              104
  • Figure 28. Pre-mixed SLH.     106
  • Figure 29. HLM paste and Liquid Metal Before and After Thermal Cycling.           106
  • Figure 30.  SLH with Solid Solder Preform. 107
  • Figure 31. Automated process for SLH with solid solder preforms and liquid metal.     107
  • Figure 32. SWOT analysis for metal-based TIMs.   119
  • Figure 33. Schematic of single-walled carbon nanotube. 125
  • Figure 34. Types of single-walled carbon nanotubes.         127
  • Figure 35. Schematic of a vertically aligned carbon nanotube (VACNT) membrane used for water treatment.        129
  • Figure 36. Schematic of Boron Nitride nanotubes (BNNTs). Alternating B and N atoms are shown in blue and red.             130
  • Figure 37. Graphene layer structure schematic.     131
  • Figure 38. Illustrative procedure of the Scotch-tape based micromechanical cleavage of HOPG.       131
  • Figure 39. Graphene and its descendants: top right: graphene; top left: graphite = stacked graphene; bottom right: nanotube=rolled graphene; bottom left: fullerene=wrapped graphene. 133
  • Figure 40. Graphene Thermal Management Applications Roadmap.       134
  • Figure 41. Flake graphite.       144
  • Figure 42. Applications of flake graphite.    145
  • Figure 43. Graphite-based TIM products.    148
  • Figure 44. Structure of hexagonal boron nitride.     152
  • Figure 45. SWOT analysis for carbon-based TIMs. 154
  • Figure 46. Classification of metamaterials based on functionalities.      155
  • Figure 47. Electromagnetic metamaterial. 156
  • Figure 48. Schematic of Electromagnetic Band Gap (EBG) structure.      157
  • Figure 49. Schematic of chiral metamaterials.        158
  • Figure 50. Nonlinear metamaterials- 400-nm thick nonlinear mirror that reflects frequency-doubled output using input light intensity as small as that of a laser pointer.         160
  • Figure 51. Schematic of self-healing polymers. Capsule based (a), vascular (b), and intrinsic (c) schemes for self-healing materials.  Red and blue colours indicate chemical species which react (purple) to heal damage.       161
  • Figure 52. Stages of self-healing mechanism.         161
  • Figure 53. Self-healing mechanism in vascular self-healing systems.     162
  • Figure 54. Schematic of TIM operation in electronic devices.        170
  • Figure 55. Schematic of Thermal Management Materials in smartphone.            173
  • Figure 56. Wearable technology inventions.             176
  • Figure 57. Global market in consumer electronics 2022-2037, by TIM type (millions USD).      178
  • Figure 58. Application of thermal interface materials in automobiles.    179
  • Figure 59. EV battery components including TIMs.               186
  • Figure 60. Battery pack with a cell-to-pack design and prismatic cells.  187
  • Figure 61. Cell-to-chassis battery pack.      189
  • Figure 62. TIMS in EV charging station.         197
  • Figure 63. Global market in electric vehicles 2022-2037, by TIM type (millions USD).   199
  • Figure 64. Image of data center layout.         201
  • Figure 65. Application of TIMs in line card. 202
  • Figure 66. Global market in data centers 2022-2037, by TIM type (millions USD).           220
  • Figure 67. Global market in advanced semiconductor packaging 2022-2037, by TIM type (millions USD).                229
  • Figure 68. ADAS radar unit incorporating TIMs.       235
  • Figure 69. Global market in ADAS sensors 2022-2037, by TIM type (millions USD).        245
  • Figure 70. Coolzorb 5G.          247
  • Figure 71. TIMs in Base Band Unit (BBU).    256
  • Figure 72. Global market in 5G 2022-2037, by TIM type (millions USD). 261
  • Figure 73. Global Market for TIMs in aerospace and defense 2022-2037, by TIM Type (Millions USD).                271
  • Figure 74. Global Market 2022-2037, by TIM Type in Industrial Electronics (Millions USD).       274
  • Figure 75. Global Market for TIMs in Renewable Energy 2022-2037 (Millions USD).       277
  • Figure 76. Global Market 2022-2037 for TIMs in Medical Electronics (Millions USD).    280
  • Figure 77. Boron Nitride Nanotubes products.        291
  • Figure 78. Transtherm® PCMs.            292
  • Figure 79. Carbice carbon nanotubes.         295
  • Figure 80.  Internal structure of carbon nanotube adhesive sheet.            311
  • Figure 81. Carbon nanotube adhesive sheet.           311
  • Figure 82. HI-FLOW Phase Change Materials.         318
  • Figure 83. Thermoelectric foil, consists of a sequence of semiconductor elements connected with conductive metal. At the top (in red) is the thermal interface.       330
  • Figure 84. Parker Chomerics THERM-A-GAP GEL. 343
  • Figure 85. Metamaterial structure used to control thermal emission.     344
  • Figure 86. Shinko Carbon Nanotube TIM product. 353
  • Figure 87. The Sixth Element graphene products.  357
  • Figure 88. Thermal conductive graphene film.         358
  • Figure 89. VB Series of TIMS from Zeon.       364

 

 

 

 

 

 

The Global Thermal Interface Materials Market 2027-2037
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