Computing & AI for Data Centers Market 2026-2040

cover

Semiconductors, AI Chips & Accelerators, Data Center Processors, AI Infrastructure, Advanced Packaging & Memory, Semiconductor Supply Chain

Published: September 2026
Pages: 315
Tables: 108
Figures: 128

The market for computing and AI silicon in data centers covers the processors that do the work inside AI and cloud infrastructure: discrete GPUs, custom AI ASICs, server CPUs and data center FPGAs. What has changed since 2023 is not simply scale but structure. The server CPU, which accounted for the clear majority of this market in 2021, now represents a small fraction of it, while the GPU has moved from a minority position to dominance — the fastest reversal of category leadership in semiconductor history.

Recent activity has been defined by three developments. Custom silicon has moved from experiment to volume: Google's TPU, AWS Trainium, Meta's MTIA and Microsoft's MAIA together now ship millions of accelerators annually, and OpenAI's own programme is expected in volume from 2027. Merchant vendors have responded by selling systems rather than chips, with rack-scale platforms integrating 72 to 144 accelerators behind a single coherent fabric — a shift that raises the barrier to competing from designing a chip to delivering an entire rack, along with its power delivery, liquid cooling and system software. And the binding constraint has migrated from silicon to electricity: after packaging shortages in 2023 and high-bandwidth memory shortages through 2024 and 2025, grid interconnection and electrical equipment lead times now govern how quickly capacity can be commissioned.

The outlook to 2040 is for continued growth at a materially slower rate than the 2023–2027 period. Three findings shape that trajectory. Revenue keeps growing after units stop: accelerator shipments peak around 2032 while average selling prices rise more than five-fold across the period, meaning capacity sized against the revenue curve will be overbuilt. AI ASICs overtake GPUs on unit shipments in 2028 but never on revenue, because custom silicon displaces volume at the lower-value inference end while frontier training remains merchant territory. And the cost reductions driving demand come predominantly from model efficiency and serving software rather than from process scaling — meaning much of the value created accrues above the silicon layer.

Value in this chain is determined by position more than by execution. The constrained layers — leading-edge foundry, high-bandwidth memory, advanced packaging and custom silicon co-design — combine growth with genuine defensibility, while system assembly and the merchant accelerator start-up cohort face structurally weaker economics. Risks are concentrated rather than diffuse: power availability, packaging capacity, memory supply, and whether enterprise AI adoption converts from pilot to production at the rate the buildout assumes.

Computing and AI for Data Centers: Global Market 2027–2040 is a comprehensive market intelligence report on the semiconductors powering global AI and cloud infrastructure. The report covers chip designers, foundries, memory suppliers, packaging houses, equipment vendors, hyperscalers, model developers, systems manufacturers and infrastructure suppliers across the United States, Taiwan, South Korea, Japan, China and Europe.

Report contents include:

Executive summary and market definition
Global AI infrastructure investment and hyperscaler capital expenditure
Data center power constraints and regional capacity buildout
Export controls and the US–China technology divide
Processor market revenue forecasts to 2040: GPU, AI ASIC, server CPU, FPGA
Average selling price and unit volume forecasts by vendor and programme
Wafer, die and advanced packaging demand forecasts
Server tray and rack architecture forecasts
Cost of AI inference and training, and the token cost roadmap
Demand drivers: agentic AI, physical AI, recommendation, coding, search
Capital expenditure versus operating expenditure economics
Ecosystem, supply chain and co-designer relationship maps
Market share by revenue, units and deployment volume
Financial analysis of the leading chip designers
AI semiconductor start-up funding landscape
Mainland China market, manufacturers and supply chain
CPU, GPU and AI ASIC technology and roadmap analysis
HBM, advanced packaging and rack bill of materials
Emerging architectures: photonics, neuromorphic, quantum
Bull, base and bear scenarios to 2040, risks and investment outlook
81 company profiles. Companies profiled include Advanced Micro Devices (AMD), Alchip Technologies, Alibaba (T-Head Semiconductor), Alphawave Semi, Amazon Web Services (Annapurna Labs), Amkor Technology, Ampere Computing, Analog Devices, Applied Materials, Arm Holdings, ASE Technology Holding, ASML Holding, Astera Labs, Axelera AI, Baidu (Kunlun), Biren Technology, Broadcom, Cadence Design Systems, Cambricon Technologies, Celestica, Cerebras Systems, Cisco Systems, Coherent Corp, CoreWeave, Credo Technology Group, ChangXin Memory Technologies (CXMT), d-Matrix, Delta Electronics, Dell Technologies, Eaton Corporation, Enflame Technology, Etched, Foxconn (Hon Hai Precision Industry), FuriosaAI, GlobalFoundries, Google (Alphabet), Groq, Global Unichip Corporation (GUC), Hewlett Packard Enterprise, Hygon Information Technology, Ibiden, Iluvatar CoreX, Infineon Technologies, Innolight Technology, Intel Corporation, JCET Group, KLA Corporation, Lam Research, Lightmatter, Lumentum Holdings, Marvell Technology, MediaTek, Meta Platforms, Micron Technology, Microsoft, Monolithic Power Systems, Moore Threads, Nebius Group, NVIDIA Corporation, onsemi, OpenAI, Powertech Technology, Quanta Computer, Rambus, Rebellions, Renesas Electronics, Samsung Electronics, SambaNova Systems, Schneider Electric, Shinko Electric Industries, SiPearl, SK Hynix, Semiconductor Manufacturing International Corporation (SMIC), Super Micro Computer, Synopsys, Tenstorrent, Tokyo Electron, Taiwan Semiconductor Manufacturing Company (TSMC), Unimicron Technology, Vertiv Holdings, and Wistron Corporation.

1 EXECUTIVE SUMMARY 19

1.1 Global AI Infrastructure and Investment Landscape 19
1.2 Capital formation and the venture channel 21
1.3 US and Chinese Hyperscaler CapEx Trends and Projections 23
1.4 Power as the binding constraint 24
1.5 AI Regulatory Landscape and Export Controls 27
1.6 The US–China Technology Divide 28

2 MARKET FORECASTS 30

2.1 Processor Revenue Forecast 30
- 2.1.1 Total Data Center Processor Market, 2021–2040 30
- 2.1.2 GPU Revenue Forecast, 2021–2040 (p. 64) 34
- 2.1.3 AI ASIC Revenue Forecast, 2021–2040 (p. 68) 39
- 2.1.4 Server CPU Revenue Forecast, 2021–2040 (p. 71) 41
- 2.1.5 FPGA Data Center Revenue Forecast, 2021–2040 43
2.2 Average Selling Price (ASP) Forecast 44
- 2.2.1 GPU ASP Trends by Product Tier, 2021–2040 45
- 2.2.2 AI ASIC ASP Trends by Hyperscaler, 2021–2040 47
- 2.2.3 CPU ASP Trends — Intel Xeon vs. AMD EPYC, 2021–2040 (p. 84) 49
2.3 Processor Volume Forecast 50
- 2.3.1 GPU Unit Shipments by Vendor, 2021–2040 50
- 2.3.2 AI ASIC Unit Shipments by Hyperscaler, 2021–2040 54
- 2.3.3 CPU Unit Shipments by Vendor, 2021–2040 58
2.4 Wafer Forecast 62
- 2.4.1 GPU & AI ASIC Wafer Starts by Technology Node, 2021–2040 62
- 2.4.2 Wafer Starts by Foundry 65
- 2.4.3 GPU & AI ASIC Compute Die Forecast, 2021–2040 67
- 2.4.4 HBM-Driven Revenue Separation from GPU & AI ASIC 69
2.5 Server Tray Volume Forecast 71
2.6 AI server rack architecture 73
2.7 CPU Focus 74
2.8 The Arm ramp 76
2.9 GPU & AI ASIC Focus 79

3 MARKET TRENDS 84

3.1 Cost of Generative AI Inference and Training 84
3.2 Why training costs what it does 86
3.3 From Agentic AI to Physical AI 90
3.4 Physical AI 93
3.5 Recommendation Models for Social Networks 95
3.6 Coding Assistants 98
3.7 Search Engine vs. LLM 102
3.8 OpenClaw 105
- 3.8.1 What it is 105
- 3.8.2 Why it matters to this forecast 105
3.9 CapEx vs. OpEx in the Era of Generative AI 106
3.10 Is the Future of AI Data Centers in Space? 111

4 MARKET SHARE & SUPPLY CHAIN 115

4.1 Data Center Ecosystem Map 115
4.2 Foundation Models Ecosystem Map 119
4.3 U.S. vs. China Tech War — Timeline 123
4.4 Financial Metrics of Data Center Chip Designers 127
4.5 AI semiconductor start-up fundraising 132
4.6 Case Study: OpenAI Revenue and Gigawatt 135
4.7 Market Share: CPU, GPU, AI ASIC & XPU Co-Designers 139
- 4.7.1 GPU Market Share by Revenue and Units (p. 247) 139
- 4.7.2 AI ASIC Market Share by Hyperscaler 142
- 4.7.3 CPU Market Share by Vendor 144
- 4.7.4 XPU Co-Designer Revenue Market Share 146
4.8 Focus on China 148

5 TECHNOLOGY ANALYSIS 156

5.1 CPU Technology Trends 156
- 5.1.1 x86 Architecture Evolution 157
- 5.1.2 Arm-Based CPU Momentum in the Data Center 159
- 5.1.3 RISC-V in the Data Center (p. 289) 160
- 5.1.4 CPU Specialization for AI Workloads 161
5.2 GPU Technology Trends 162
Process Node Roadmap and Transition 162
- 5.2.1 Chiplet and Multi-Die Architectures 164
- 5.2.2 Rack-Scale GPU Architectures — NVL72 and Beyond 165
- 5.2.3 Memory Bandwidth and HBM Integration 167
- 5.2.4 Networking and Interconnect Evolution 168
5.3 AI ASIC Technology Trends 170
- 5.3.1 Hyperscaler ASIC Product Roadmaps 170
- 5.3.2 AI ASIC Start-Up Landscape 171
- 5.3.3 AI ASIC Technology Specification Database 172
- 5.3.4 Compute Disaggregation for AI Inference 174
5.4 GPU vs. AI ASIC: Comparative Analysis 175
5.5 Advanced Packaging and HBM Memory 179
- 5.5.1 HBM Technology Roadmap — HBM2E to HBM4 179
- 5.5.2 CoWoS and Advanced Packaging Capacity 181
- 5.5.3 Custom HBM and Co-Design Trends 184
- 5.5.4 AI Rack Bill of Materials 185
5.6 Emerging Computing Architectures 187
- 5.6.1 Photonic Computing 187
- 5.6.2 Neuromorphic Computing 189
- 5.6.3 Quantum Computing Outlook 190

6 OUTLOOK & SCENARIOS 192

6.1 Market Outlook 2026–2040 192
6.2 Technology Outlook 2026–2040 195
6.3 Key Risks and Opportunities 196
6.4 Strategic Recommendations 198

7 COMPANY PROFILES 200 (81 company profiles)

8 REPORT METHODOLOGY 302

8.1 Objective of the report 302
8.2 Scope of this report 302

9 GLOSSARY OF TERMS AND ABBREVIATIONS 303

10 REFERENCES 311

List of Tables

Table 1. Global AI Infrastructure Investment by Category, 2021–2040 ($B) 20
Table 2. US Early-Stage Venture Deployment in AI and Adjacent Technologies, 2016–2026 YTD 21
Table 3. Early-stage round size and investor concentration, 2026 YTD 22
Table 4. US vs. Chinese Hyperscaler CapEx, 2021–2040 ($B) 24
Table 5. Data Center Installed IT Load by Workload Type, 2024–2040 (GW) 25
Table 6. Data Center Processor Market Revenue Summary, 2021–2040 ($B) 31
Table 7. Revenue Breakdown by Processor Type (CPU, GPU, AI ASIC, FPGA), 2021–2040 32
Table 8. GPU Revenue by Vendor, 2021–2040 ($B) 35
Table 9. Nvidia GPU Revenue by Product Generation, 2021–2028 ($B) 37
Table 10. AMD GPU Revenue by Product Generation, 2021–2028 ($B) 38
Table 11. AI ASIC Revenue by Hyperscaler, 2021–2040 ($B) 40
Table 12. Server CPU Revenue by Vendor, 2021–2040 ($B) 42
Table 13. FPGA Data Center Revenue Forecast, 2021–2040 ($M) 44
Table 14. GPU ASP by Product Tier, 2021–2040 ($K per unit) 45
Table 15. AI ASIC ASP by Hyperscaler, 2021–2040 ($K per unit) 47
Table 16. Server CPU ASP Trends — Intel Xeon vs. AMD EPYC, 2021–2040 ($) 49
Table 17. GPU Unit Shipments by Vendor, 2021–2040 (K units) 50
Table 18. Nvidia GPU Unit Shipments by Product Generation, 2021–2028 (K units) 52
Table 19. AMD GPU Unit Shipments by Product Generation, 2021–2028 (K units) 53
Table 20. AI ASIC Unit Shipments by Hyperscaler, 2021–2040 (K units) 54
Table 21. CPU Unit Shipments by Vendor, 2021–2040 (M units) 59
Table 22. Hyperscaler Custom CPU Unit Adoption, 2022–2040 (M units) 60
Table 23. GPU & AI ASIC Wafer Starts by Node and Foundry, 2021–2040 (KWPM, 300mm equivalent) 63
Table 24. Average Die Size Trend — GPU vs. AI ASIC, 2021–2040 (mm²) 68
Table 25. HBM Revenue Separated from GPU & AI ASIC Total, 2021–2040 ($B) 70
Table 26. AI Server vs. General-Purpose Server Tray Volume, 2021–2040 (M units) 71
Table 27. AI Server Rack Configuration and Architecture, 2025–2040 73
Table 28. CPU Market Share by Revenue: Intel vs. AMD vs. Arm-based, 2021–2040 75
Table 29. Hyperscaler Arm CPU Deployment Ramp, 2022–2040 76
Table 30. CPU Processor Roadmap Summary — Major Vendors, 2024–2030 77
Table 31.GPU Market Share by Revenue, 2021–2040 (%) 79
Table 32. AI ASIC Market Share by Deployment Volume, 2021–2040 (%) 80
Table 33. GPU & AI ASIC Split by Technology Node, 2021–2040 81
Table 34. GPU & AI ASIC Product Roadmap Summary, 2024–2030 82
Table 35. Cost per Token Trend: Training and Inference, 2021–2040 ($/M tokens) 85
Table 36. Cost per Token by Model Size and Hardware Configuration, 2024–2040 ($/M output tokens) 85
Table 37. Cost per Token Trend: Training and Inference, 2021–2040 ($/M tokens) 86
Table 38. Inference Cost Breakdown by Infrastructure Component, 2025 (%) 87
Table 39. AI Model Parameter Count vs. Hardware Requirements, 2020–2028 89
Table 40. Agentic AI Use Cases by Industry and Hardware Requirements 91
Table 41. AI Agent Deployment Forecast by Sector, 2025–2040 (M concurrently deployed agents) 92
Table 42. Physical AI Hardware Requirements vs. Generative AI, 2025–2040 93
Table 43. Robotics Semiconductor Market Forecast, 2024–2040 ($B) 95
Table 44. Recommendation Model Architecture Evolution, 2018–2028 96
Table 45. Recommendation Model Compute Demand by Platform, 2024–2040 ($B) 97
Table 46. AI-Powered Coding Assistant Market Share, 2024–2028 (%) 99
Table 47. Coding Assistant Market Share and Underlying Infrastructure 100
Table 48. Coding AI GPU Compute Demand, 2024–2040 ($B) 101
Table 49. LLM vs. Traditional Search: Query Volume Forecast, 2022–2040 (B queries/day) 102
Table 50. AI Search Compute Infrastructure Requirements, 2024–2040 104
Table 51. CapEx Cycle: US Hyperscalers, 2015–2040 ($B) 107
Table 52. CapEx-to-Revenue Ratio: Major Hyperscalers, 2020–2040 (%) 108
Table 53. AI Infrastructure OpEx vs. CapEx Split, 2024–2040 109
Table 54. Cloud AI Chip Rental vs. Ownership Economics, 2025–2040 111
Table 55. Low Earth Orbit Latency and Bandwidth Projections, 2025–2035 113
Table 56. AI Chip Supply Chain: From Silicon to Hyperscaler 116
Table 57. Foundation Model Training Infrastructure by Developer 122
Table 58. Chinese AI Chip Import Replacement Progress, 2022–2028 (%) 124
Table 59. Sanctioned vs. Unsanctioned Chinese AI Chip Revenues, 2022–2028 ($B) 126
Table 60. Financial Metrics: Top 10 Data Center Chip Designers, 2021–2025 127
Table 61. Gross Margin Comparison: Nvidia vs. AMD vs. Intel, 2020–2025 (%) 129
Table 62. R&D Spend as % of Revenue: Key Chip Designers, 2020–2025 130
Table 63. US and Chinese Hyperscaler CapEx Summary, 2021–2026 ($B) 131
Table 64. AI Semiconductor Start-Up Fundraising, 2019–Q1 2026 ($M) 132
Table 65. AI Semiconductor Start-Up Fundraising Database, 2019–Q1 2026 133
Table 66. OpenAI Revenue Forecast, 2023–2030 ($B) 136
Table 67. OpenAI Compute Demand (Gigawatt), 2023–2030 137
Table 68. OpenAI GPU Procurement Forecast by Generation, 2023–2028 (K units) 138
Table 69. GPU Market Share Summary by Revenue and Units, 2021–2025 140
Table 70. Nvidia, AMD, Google, AWS GPU/ASIC Unit Split, 2021–2028 (K units) 142
Table 71. AI ASIC Market Share by Hyperscaler, 2021–2025 (%) 143
Table 72. AI ASIC Specifications: Google, AWS, Microsoft, Meta, 2024–2026 143
Table 73. CPU Market Share by Revenue: Intel vs. AMD vs. Arm, 2021–2025 (%) 145
Table 74. Hyperscaler Custom CPU Market Share Evolution, 2022–2028 145
Table 75. Co-Designer Revenue Share, 2021–2026 (%) 147
Table 76. China Data Center Processor Market by Type, 2021–2030 ($B) 149
Table 77. Chinese Hyperscaler Processor Demand, 2021–2028 ($B) 150
Table 78. Domestic Chinese AI Chip Makers: Unit Share, 2022–2028 (%) 151
Table 79. Chinese AI Chip Makers: Product Specifications and Capabilities 152
Table 80. China Data Center Semiconductor Supply Chain Map 154
Table 81. CPU Architecture Comparison: x86, Arm, RISC-V for the Data Center 156
Table 82. CPU Specifications: Intel, AMD, AWS, Google, Microsoft, Huawei, Nvidia, 2024–2026 157
Table 83. Arm Server CPU Shipment Forecast, 2022–2040 (M units) 159
Table 84. RISC-V Data Center Adoption Forecast, 2025–2040 160
Table 85. CPU Specialization for AI Inference Workloads 162
Table 86. GPU Specifications: Nvidia Blackwell, Rubin; AMD MI350X, MI450, 2024–2026 163
Table 87. GPU Die Size Evolution and Chiplet Transition, 2020–2030 (mm²) 164
Table 88. Rack-Scale GPU Architecture: NVL72 and Next-Generation Platforms 165
Table 89. GPU Memory Bandwidth Trend: HBM Generations, 2020–2030 (TB/s) 167
Table 90. NVLink and Interconnect Bandwidth Evolution, 2020–2030 169
Table 91. AI ASIC Technology Specification Database 172
Table 92. GPU vs. AI ASIC: Performance per Watt Comparison, 2022–2026 176
Table 93. GPU vs. AI ASIC: Training vs. Inference Suitability Matrix 177
Table 94. GPU vs. AI ASIC: Total Cost of Ownership Analysis 178
Table 95. HBM Specification Comparison: HBM2E, HBM3, HBM3E, HBM4 180
Table 96. CoWoS Capacity Expansion Roadmap: TSMC, 2022–2028 (KWPM) 182
Table 97. Advanced Packaging Market Share: CoWoS, SoIC, Others, 2024–2028 (%) 183
Table 98. AI Server Rack BoM: Itemized Cost Breakdown, 2025 ($K) 185
Table 99. AI Rack BoM Cost Evolution, 2023–2028 ($K) 186
Table 100. Silicon Photonics Market Forecast in Data Centers, 2024–2040 ($B) 188
Table 101. Neuromorphic Computing Roadmap, 2024–2040 189
Table 102. Quantum Computing Timeline to Commercial Viability, 2025–2040 190
Table 103. Emerging Computing Technology Readiness Assessment 191
Table 104. Market Forecast Summary: Bull / Base / Bear Scenarios, 2026–2040 ($B) Source: Future Markets, Inc., 2026 192
Table 105. Bull, Base, Bear Case Revenue Scenarios by Processor Type, 2040 194
Table 106. Technology Roadmap Summary: CPU, GPU, AI ASIC, 2026–2040 195
Table 107. Key Risk Register: Probability and Impact Assessment 197
Table 108. Investment Opportunity Map: Data Center Semiconductor Ecosystem 198

List of Figures

Figure 1. Global AI Infrastructure Investment Forecast, 2021–2040 ($B) 20
Figure 2. US vs. Chinese Hyperscaler CapEx, 2021–2040 ($B) 23
Figure 3. Data Center Power Consumption Forecast, 2024–2040 (GW installed IT load) 25
Figure 4. AI-Related Data Center Construction Starts by Region, 2022–2028 (GW of IT capacity) 26
Figure 5. US Export Controls on AI Chips: Key Milestones, 2019–2026 27
Figure 6. US–China Technology Decoupling Timeline, 2018–2026 28
Figure 7. Total Data Center Processor Market Revenue Forecast, 2021–2040 ($B) 30
Figure 8. Revenue Breakdown by Processor Type (CPU, GPU, AI ASIC, FPGA), 2021–2040 32
Figure 9. Data Center Processor CAGR by Category, 2025–2040 (%) 33
Figure 10. GPU Market Revenue Forecast, 2021–2040 ($B) 34
Figure 11. GPU Revenue Split by Vendor (Nvidia, AMD, Others), 2021–2040 35
Figure 12. Nvidia GPU Revenue by Product Generation, 2021–2028 ($B) 37
Figure 13. AMD GPU Revenue by Product Generation, 2021–2028 ($B) 38
Figure 14. AI ASIC Market Revenue Forecast, 2021–2040 ($B) 39
Figure 15. AI ASIC Revenue Split by Hyperscaler, 2021–2040 40
Figure 16. Server CPU Market Revenue Forecast, 2021–2040 ($B) 41
Figure 17. Server CPU Revenue Split by Architecture (x86 vs. Arm), 2021–2040 42
Figure 18. FPGA Data Center Revenue Forecast, 2021–2040 ($M) 43
Figure 19. GPU ASP Evolution by Product Tier, 2021–2040 ($K) 45
Figure 20. AI ASIC ASP Trends by Hyperscaler, 2021–2040 ($K) 47
Figure 21. Server CPU ASP Trends — Intel Xeon vs. AMD EPYC, 2021–2040 ($) 49
Figure 22. GPU Unit Shipments by Vendor, 2021–2040 (K units) 50
Figure 23. Nvidia GPU Unit Shipments by Product Generation, 2021–2028 (K units) 52
Figure 24. AMD GPU Unit Shipments by Product Generation, 2021–2028 (K units) 53
Figure 25. AI ASIC Unit Shipments by Hyperscaler, 2021–2040 (K units) 54
Figure 26. Google TPU Unit Deployment Forecast, 2021–2040 (K units) 56
Figure 27. AWS Trainium & Inferentia Unit Forecast, 2021–2040 (K units) 57
Figure 28. Microsoft MAIA Unit Forecast, 2021–2040 (K units) 58
Figure 29. CPU Unit Shipments — Data Center, 2021–2040 (M units) 58
Figure 30. Intel vs. AMD CPU Market Share in Unit Terms, 2021–2040 (%) 59
Figure 31. Hyperscaler Custom CPU Unit Adoption, 2022–2040 (M units) 60
Figure 32. GPU & AI ASIC Wafer Starts by Technology Node, 2021–2040 (KWPM) 62
Figure 33. Wafer Consumption Split: Advanced Nodes, 2021–2040 63
Figure 34. GPU & AI ASIC Wafer Starts by Foundry, 2021–2040 65
Figure 35. TSMC Advanced Node Capacity Forecast, 2024–2040 (KWPM) 66
Figure 36. GPU & AI ASIC Compute Die Forecast, 2021–2040 67
Figure 37. Average Die Size Trend — GPU vs. AI ASIC, 2021–2040 (mm²) 68
Figure 38. HBM Revenue Separated from GPU & AI ASIC Total, 2021–2040 ($B) 69
Figure 39. AI Server vs. General-Purpose Server Tray Volume, 2021–2040 (M units) 71
Figure 40. AI Server Rack Configuration and Architecture, 2025–2040 73
Figure 41. CPU Market Share by Revenue: Intel vs. AMD vs. Arm-based, 2021–2040 75
Figure 42. Hyperscaler Arm CPU Deployment Ramp, 2022–2040 76
Figure 43. CPU Product Roadmap: Intel, AMD, Arm, Google, AWS, Nvidia, 2024–2030 77
Figure 44. GPU Market Share by Revenue, 2021–2040 (%) 79
Figure 45. AI ASIC Market Share by Deployment Volume, 2021–2040 (%) 80
Figure 46. GPU & AI ASIC Split by Technology Node, 2021–2040 81
Figure 47. Cost per Token Trend: Training and Inference, 2021–2040 ($/M tokens) 84
Figure 48. Training Compute Requirements by Model Type, 2020–2028 (FLOPs) 86
Figure 49. Inference Cost Breakdown by Infrastructure Component, 2025 (%) 87
Figure 50. Token Cost Reduction Roadmap, 2025–2040 88
Figure 51. AI Model Parameter Count vs. Hardware Requirements, 2020–2028 89
Figure 52. Agentic AI Market Taxonomy and Use Cases 90
Figure 53. AI Agent Deployment Forecast by Sector, 2025–2040 (M concurrently deployed agents) 92
Figure 54. Physical AI Hardware Requirements vs. Generative AI, 2025–2040 93
Figure 55. Robotics Semiconductor Market Forecast, 2024–2040 ($B) 94
Figure 56. Recommendation Model Architecture Evolution, 2018–2028 96
Figure 57. Recommendation Model Compute Demand by Platform, 2024–2040 ($B) 97
Figure 58. AI-Powered Coding Assistant Market Share, 2024–2028 (%) 99
Figure 59. Coding AI GPU Compute Demand, 2024–2040 ($B) 101
Figure 60. LLM vs. Traditional Search: Query Volume Forecast, 2022–2040 (B queries/day) 102
Figure 61. AI Search Compute Infrastructure Requirements, 2024–2040 104
Figure 62. CapEx Cycle: US Hyperscalers, 2015–2040 ($B) 107
Figure 63. CapEx-to-Revenue Ratio: Major Hyperscalers, 2020–2040 (%) 108
Figure 64. AI Infrastructure OpEx vs. CapEx Split, 2024–2040 109
Figure 65. Cloud AI Chip Rental vs. Ownership Economics, 2025–2040 110
Figure 66. Space-Based Data Center Conceptual Architecture 112
Figure 67. Low Earth Orbit Latency and Bandwidth Projections, 2025–2035 113
Figure 68. Global Data Center Processor Ecosystem Map 115
Figure 69. AI Chip Supply Chain: From Silicon to Hyperscaler Source: Future Markets, Inc., 2026 116
Figure 70. Co-Designer and Hyperscaler Relationship Map 117
Figure 71. OSAT and Advanced Packaging Supply Chain Map 118
Figure 72. Foundation Models Ecosystem Map: Developers and Infrastructure 119
Figure 73. Open vs. Closed Source AI Model Landscape, 2024 121
Figure 74. Foundation Model Training Infrastructure by Developer 122
Figure 75. US Export Control Timeline: Semiconductors, 2018–2026 123
Figure 76. Chinese AI Chip Import Replacement Progress, 2022–2028 (%) 124
Figure 77. Sanctioned vs. Unsanctioned Chinese AI Chip Revenues, 2022–2028 ($B) 126
Figure 78. Comparative Revenue: Data Center Chip Designers, 2021–2025 ($B) 127
Figure 79. Gross Margin Comparison: Nvidia vs. AMD vs. Intel, 2020–2025 (%) 129
Figure 80. R&D Spend as % of Revenue: Key Chip Designers, 2020–2025 130
Figure 81. AI Semiconductor Start-Up Fundraising, 2019–Q1 2026 ($M) 132
Figure 82. OpenAI Revenue Forecast, 2023–2030 ($B) 135
Figure 83. OpenAI Compute Demand (Gigawatt), 2023–2030 136
Figure 84. OpenAI GPU Procurement Forecast by Generation, 2023–2028 (K units) 138
Figure 85. GPU Market Share by Revenue, 2021–2025 (%) 139
Figure 86. GPU Market Share by Units, 2021–2025 (%) 140
Figure 87. Nvidia, AMD, Google, AWS GPU/ASIC Unit Split, 2021–2028 (K units) 141
Figure 88. AI ASIC Market Share by Hyperscaler, 2021–2025 (%) 142
Figure 89. CPU Market Share by Revenue: Intel vs. AMD vs. Arm, 2021–2025 (%) 144
Figure 90. Hyperscaler Custom CPU Market Share Evolution, 2022–2028 145
Figure 91. XPU Co-Designer Revenue, 2023–2026 ($B) 146
Figure 92. XPU Co-Designer Revenue Share, 2021–2026 (%) 147
Figure 93. China Data Center Processor Market Size, 2021–2025 ($B) 149
Figure 94. Chinese Hyperscaler Processor Demand, 2021–2028 ($B) 150
Figure 95. Domestic Chinese AI Chip Makers: Unit Share, 2022–2028 (%) 151
Figure 96. HiSilicon, Cambricon, Baidu Kunlun, Hygon Roadmap, 2024–2028 153
Figure 97. China Data Center Semiconductor Supply Chain Map 154
Figure 98. CPU Architecture Comparison: x86, Arm, RISC-V for the Data Center 156
Figure 99. Arm Server CPU Shipment Forecast, 2022–2040 (M units) 159
Figure 100. RISC-V Data Center Adoption Forecast, 2025–2040 160
Figure 101. CPU Specialization for AI Inference Workloads 161
Figure 102. GPU Process Node Roadmap: Nvidia, AMD, 2020–2030 162
Figure 103. GPU Die Size Evolution and Chiplet Transition, 2020–2030 (mm²) 164
Figure 104. Rack-Scale GPU Architecture: NVL72 and Next-Generation Platforms 165
Figure 105. GPU Memory Bandwidth Trend: HBM Generations, 2020–2030 (TB/s) 167
Figure 106. NVLink and Interconnect Bandwidth Evolution, 2020–2030 168
Figure 107. Hyperscaler ASIC Roadmap Comparison: Google, AWS, Microsoft, Meta 170
Figure 108. AI ASIC Start-Up Landscape by Funding Stage, 2024 171
Figure 109. AI ASIC Technology Specification Matrix 172
Figure 110. Disaggregated Inference Architecture Diagram 174
Figure 111. GPU vs. AI ASIC: Performance per Watt Comparison, 2022–2026 175
Figure 112. GPU vs. AI ASIC: Training vs. Inference Suitability Matrix 177
Figure 113. GPU vs. AI ASIC: Total Cost of Ownership Analysis 178
Figure 114. HBM Technology Roadmap: HBM2E to HBM4, 2020–2028 179
Figure 115. HBM Bandwidth and Capacity per Stack by Generation, 2020–2028 180
Figure 116. CoWoS Capacity Expansion Roadmap: TSMC, 2022–2028 (KWPM) 181
Figure 117. Advanced Packaging Market Share: CoWoS, SoIC, Others, 2024–2028 (%) 183
Figure 118. Custom HBM Co-Design Relationships Map 184
Figure 119. AI Server Rack Bill of Materials: Component Breakdown, 2025 ($K) 185
Figure 120. AI Rack BoM Cost Evolution, 2023–2028 ($K) 186
Figure 121. Silicon Photonics Market Forecast in Data Centers, 2024–2040 ($B) 188
Figure 122. Neuromorphic Computing Roadmap, 2024–2040 189
Figure 123. Quantum Computing Timeline to Commercial Viability, 2025–2040 190
Figure 124. Data Center Processor Market Scenario Analysis, 2026–2040 ($B) 192
Figure 125. Bull, Base, Bear Case Revenue Scenarios by Processor Type, 2040 194
Figure 126. Technology Roadmap Summary: CPU, GPU, AI ASIC, 2026–2040 195
Figure 127. Competitive Landscape Risk Matrix, 2026–2040 196
Figure 128. Investment Opportunity Map: Data Center Semiconductor Ecosystem 198

Purchasers will receive the following:

PDF report download/by email.
Comprehensive Excel spreadsheet of all data.
Mid-year Update

Computing and AI for Data Centers: Global Market 2027–2040

PDF download.

Computing and AI for Data Centers: Global Market 2027–2040

PDF and Print Edition (including tracked delivery).

Convert these prices to your currency:

Payment methods: Visa, Mastercard, American Express, Bank Transfer. To order by Bank Transfer (Invoice) select this option from the payment methods menu after adding to cart, or contact info@futuremarketsinc.com

This report's downloads are available to subscribers. Log in to access, or subscribe for full access.