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The Global Market for Thermal Interface Materials 2023-2033

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 Published May 2023 | 197 pages, 74 figures, 30 tables | Download table of contents

The effective transfer/removal of heat from a semiconductor device is crucial to ensure reliable operation and to enhance the lifetime of these components. The development of high-power and high-frequency electronic devices has greatly increased issues with excessive heat accumulation. There is therefore a significant requirement for effective thermal management materials to remove excess heat from electronic devices to ambient environment.

Thermal interface materials (TIMs) offer efficient heat dissipation to maintain proper functions and lifetime for these devices. TIMs are materials that are applied between the interfaces of two components (typically a heat generating device such as microprocessors, photonic integrated circuits, etc. and a heat dissipating device e.g. heat sink) to enhance the thermal coupling between these devices. A range of Carbon-based, metal/solder and filler-based TIMs are available both commercially and in the research and development (R&D) phase.

Report contents include:

  • Analysis of recent commercial and R&D developments in thermal interface materials (TIMs).
  • Market trends and drivers.
  • Market map. 
  • Analysis of thermal interface materials (TIMs) including:
    • Thermal Pads/Insulators.
    • Thermally Conductive Adhesives.
    • Thermal Compounds or Greases.
    • Thermally Conductive Epoxy/Adhesives.
    • Phase Change Materials.
    • Metal-based TIMs.
    • Carbon-based TIMs.
  • Market analysis. Markets covered include:
    • Consumer electronics.
    • Electric Vehicles (EV) batteries.
    • Data Center infrastructure.
    • ADAS sensors.
    • EMI shielding.
    • 5G.
  • Global market revenues for thermal interface materials (TIMs), historical and forecast to 2033. 
  • Profiles of 87 producers. Companies profiled include Arieca, Carbice Corporation, CondAlign, Fujipoly, Henkel, Indium Corporation, KULR Technology Group, Inc., Parker-Hannifin Corporation, Shin-Etsu Chemical Co., Ltd, and SHT Smart High-Tech AB. 

 

 

1              INTRODUCTION 14

  • 1.1          Thermal management-active and passive             14
  • 1.2          What are thermal interface materials (TIMs)?     14
    • 1.2.1      Types    16
    • 1.2.2      Thermal conductivity      17
  • 1.3          Comparative properties of TIMs 19
  • 1.4          Advantages and disadvantages of TIMs, by type 19
  • 1.5          Prices    22

 

2              MATERIALS         23

  • 2.1          Thermal greases and pastes        24
  • 2.2          Thermal gap pads            26
  • 2.3          Thermal gap fillers           27
  • 2.4          Thermal adhesives and potting compounds          28
  • 2.5          Phase Change Materials 29
    • 2.5.1      Properties of Phase Change Materials (PCMs)     30
    • 2.5.2      Types    31
      • 2.5.2.1   Organic/biobased phase change materials            33
        • 2.5.2.1.1               Advantages and disadvantages  33
        • 2.5.2.1.2               Paraffin wax       34
        • 2.5.2.1.3               Non-Paraffins/Bio-based              34
      • 2.5.2.2   Inorganic phase change materials             35
        • 2.5.2.2.1               Salt hydrates      35
          • 2.5.2.2.1.1           Advantages and disadvantages  36
        • 2.5.2.2.2               Metal and metal alloy PCMs (High-temperature) 37
      • 2.5.2.3   Eutectic mixtures             37
      • 2.5.2.4   Encapsulation of PCMs  37
        • 2.5.2.4.1               Macroencapsulation       38
        • 2.5.2.4.2               Micro/nanoencapsulation            38
      • 2.5.2.5   Nanomaterial phase change materials     39
    • 2.5.3      Thermal energy storage (TES)     39
      • 2.5.3.1   Sensible heat storage     39
      • 2.5.3.2   Latent heat storage         40
    • 2.5.4      Application in TIMs         40
      • 2.5.4.1   Thermal pads     42
      • 2.5.4.2   Low Melting Alloys (LMAs)           42
  • 2.6          Metal-based TIMs           43
    • 2.6.1      Solders and low melting temperature alloy TIMs 43
    • 2.6.2      Liquid metals     44
    • 2.6.3      Solid liquid hybrid (SLH) metals  45
      • 2.6.3.1   Hybrid liquid metal pastes           45
      • 2.6.3.2   SLH created during chip assembly (m2TIMs)        47
  • 2.7          Carbon-based TIMs         48
    • 2.7.1      Multi-walled nanotubes (MWCNT)           48
      • 2.7.1.1   Properties           48
      • 2.7.1.2   Application as thermal interface materials            49
    • 2.7.2      Single-walled carbon nanotubes (SWCNTs)           50
      • 2.7.2.1   Properties           50
      • 2.7.2.2   Application as thermal interface materials            53
    • 2.7.3      Vertically aligned CNTs (VACNTs)              53
      • 2.7.3.1   Properties           53
      • 2.7.3.2   Applications       53
      • 2.7.3.3   Application as thermal interface materials            54
    • 2.7.4      BN nanotubes (BNNT) and nanosheets (BNNS).  55
      • 2.7.4.1   Properties           55
      • 2.7.4.2   Application as thermal interface materials            55
    • 2.7.5      Graphene           57
      • 2.7.5.1   Properties           58
      • 2.7.5.2   Application as thermal interface materials            60
        • 2.7.5.2.1               Graphene fillers 60
        • 2.7.5.2.2               Graphene foam 60
        • 2.7.5.2.3               Graphene aerogel           60
    • 2.7.6      Nanodiamonds 61
      • 2.7.6.1   Properties           61
      • 2.7.6.2   Application as thermal interface materials            63
    • 2.7.7      Graphite              63
      • 2.7.7.1   Properties           63
      • 2.7.7.2   Natural graphite               64
        • 2.7.7.2.1               Classification      65
        • 2.7.7.2.2               Processing          66
        • 2.7.7.2.3               Flake     66
          • 2.7.7.2.3.1           Grades 67
          • 2.7.7.2.3.2           Applications       67
      • 2.7.7.3   Synthetic graphite           69
        • 2.7.7.3.1               Classification      69
          • 2.7.7.3.1.1           Primary synthetic graphite           70
          • 2.7.7.3.1.2           Secondary synthetic graphite      70
          • 2.7.7.3.1.3           Processing          70
      • 2.7.7.4   Applications as thermal interface materials           71
    • 2.7.8      Hexagonal Boron Nitride               72
      • 2.7.8.1   Properties           72
      • 2.7.8.2   Application as thermal interface materials            74
  • 2.8          Metamaterials  74
    • 2.8.1      Types and properties     75
      • 2.8.1.1   Electromagnetic metamaterials 76
        • 2.8.1.1.1               Double negative (DNG) metamaterials   76
        • 2.8.1.1.2               Single negative metamaterials   76
        • 2.8.1.1.3               Electromagnetic bandgap metamaterials (EBG)  76
        • 2.8.1.1.4               Bi-isotropic and bianisotropic metamaterials       77
        • 2.8.1.1.5               Chiral metamaterials      77
        • 2.8.1.1.6               Electromagnetic “Invisibility” cloak           78
      • 2.8.1.2   Terahertz metamaterials              78
      • 2.8.1.3   Photonic metamaterials 78
      • 2.8.1.4   Tunable metamaterials  79
      • 2.8.1.5   Frequency selective surface (FSS) based metamaterials  79
      • 2.8.1.6   Nonlinear metamaterials              79
      • 2.8.1.7   Acoustic metamaterials 80
    • 2.8.2      Application as thermal interface materials            80
  • 2.9          Self-healing thermal interface materials 81
    • 2.9.1      Extrinsic self-healing       82
    • 2.9.2      Capsule-based  82
    • 2.9.3      Vascular self-healing      82
    • 2.9.4      Intrinsic self-healing       83
    • 2.9.5      Healing volume 84
    • 2.9.6      Types of self-healing materials, polymers and coatings    85
    • 2.9.7      Applications in thermal interface materials           86

 

3              MARKETS FOR THERMAL INTERFACE MATERIALS (TIMs)  87

  • 3.1          Consumer electronics    87
    • 3.1.1      Market overview             87
      • 3.1.1.1   Market drivers  87
      • 3.1.1.2   Applications       88
        • 3.1.1.2.1               Smartphones and tablets              88
        • 3.1.1.2.2               Wearable electronics      89
  • 3.2          Electric Vehicles (EV)      91
    • 3.2.1      Market overview             91
      • 3.2.1.1   Market drivers  91
      • 3.2.1.2   Applications       92
        • 3.2.1.2.1               Lithium-ion batteries      92
          • 3.2.1.2.1.1           Cell-to-pack designs        93
          • 3.2.1.2.1.2           Cell-to-chassis/body       94
        • 3.2.1.2.2               Power electronics            95
        • 3.2.1.2.3               Charging stations             96
  • 3.3          Data Centers      97
    • 3.3.1      Market overview             97
      • 3.3.1.1   Market drivers  97
      • 3.3.1.2   Applications       98
        • 3.3.1.2.1               Router, switches and line cards  98
        • 3.3.1.2.2               Servers 99
        • 3.3.1.2.3               Power supply converters              100
  • 3.4          ADAS Sensors    101
    • 3.4.1      Market overview             101
      • 3.4.1.1   Market drivers  101
      • 3.4.1.2   Applications       101
        • 3.4.1.2.1               ADAS Cameras  101
        • 3.4.1.2.2               ADAS Radar        101
        • 3.4.1.2.3               ADAS LiDAR        102
  • 3.5          EMI shielding     103
    • 3.5.1      Market overview             103
      • 3.5.1.1   Market drivers  103
      • 3.5.1.2   Applications       103
  • 3.6          5G          104
    • 3.6.1      Market overview             104
      • 3.6.1.1   Market drivers  104
      • 3.6.1.2   Applications       104
        • 3.6.1.2.1               Antenna              104
        • 3.6.1.2.2               Base Band Unit (BBU)     106
  • 3.7          Global revenues for TIMs 2018-2033, by market 107
  • 3.8          Future market prospects              109

 

4              COMPANY PROFILES       110 (87 company profiles)

 

5              RESEARCH METHODOLOGY         188

 

6              REFERENCES       189

 

List of Tables

  • Table 1. Thermal conductivities (κ) of common metallic, carbon, and ceramic fillers employed in TIMs.      18
  • Table 2. Commercial TIMs and their properties.  19
  • Table 3. Advantages and disadvantages of TIMs, by type.               19
  • Table 4. Thermal interface materials prices.          22
  • Table 5. Characteristics of some typical TIMs.      23
  • Table 6. Properties of PCMs.       30
  • Table 7.  PCM Types and properties.        32
  • Table 8. Advantages and disadvantages of organic PCMs.               33
  • Table 9. Advantages and disadvantages of organic PCM Fatty Acids.          35
  • Table 10. Advantages and disadvantages of salt hydrates               36
  • Table 11. Advantages and disadvantages of low melting point metals.      37
  • Table 12. Advantages and disadvantages of eutectics.     37
  • Table 13. Benefits and drawbacks of PCMs in TIMs.           40
  • Table 14. Properties of CNTs and comparable materials. 48
  • Table 15. Typical properties of SWCNT and MWCNT.        51
  • Table 16. Comparison of carbon-based additives in terms of the main parameters influencing their value proposition as a conductive additive.               52
  • Table 17. Thermal conductivity of CNT-based polymer composites.           55
  • Table 18. Comparative properties of BNNTs and CNTs.    56
  • Table 19. Properties of graphene, properties of competing materials, applications thereof.            58
  • Table 20. Properties of nanodiamonds.  62
  • Table 21. Comparison between Natural and Synthetic Graphite. 63
  • Table 22. Classification of natural graphite with its characteristics.             65
  • Table 23. Characteristics of synthetic graphite.    69
  • Table 24. Properties of hexagonal boron nitride (h-BN).  73
  • Table 25. Types of self-healing coatings and materials.     85
  • Table 26. Comparative properties of self-healing materials.           86
  • Table 27. Global revenues for TIMs 2018-2033, by market (millions USD) 107
  • Table 28. Carbodeon Ltd. Oy nanodiamond product list.  124
  • Table 29. Ray-Techniques Ltd. nanodiamonds product list.             170
  • Table 30. Comparison of ND produced by detonation and laser synthesis.              171

 

List of Figures

  • Figure 1. (L-R) Surface of a commercial heatsink surface at progressively higher magnifications, showing tool marks that create a rough surface and a need for a thermal interface material.  15
  • Figure 2. Schematic of thermal interface materials used in a flip chip package.      15
  • Figure 3. Thermal grease.             16
  • Figure 4. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module. 17
  • Figure 5. Application of thermal silicone grease. 25
  • Figure 6. A range of thermal grease products.     25
  • Figure 7. Thermal Pad.   27
  • Figure 8. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module. 27
  • Figure 9. Thermal tapes.               28
  • Figure 10. Thermal adhesive products.   29
  • Figure 11. Phase-change TIM products.  30
  • Figure 12. PCM mode of operation.          31
  • Figure 13. Classification of PCMs.              32
  • Figure 14. Phase-change materials in their original states.              32
  • Figure 15. Thermal energy storage materials.       39
  • Figure 16. Phase Change Material transient behaviour.   40
  • Figure 17. PCM TIMs.     41
  • Figure 18. Phase Change Material - die cut pads ready for assembly.         42
  • Figure 19. Typical IC package construction identifying TIM1 and TIM2       44
  • Figure 20. Liquid metal TIM product.       45
  • Figure 21. Pre-mixed SLH.            46
  • Figure 22. HLM paste and Liquid Metal Before and After Thermal Cycling.               46
  • Figure 23.  SLH with Solid Solder Preform.             47
  • Figure 24. Automated process for SLH with solid solder preforms and liquid metal.             47
  • Figure 25. Schematic diagram of a multi-walled carbon nanotube (MWCNT).        48
  • Figure 26. Schematic of single-walled carbon nanotube. 50
  • Figure 27. Types of single-walled carbon nanotubes.        52
  • Figure 28. Schematic of a vertically aligned carbon nanotube (VACNT) membrane used for water treatment.         54
  • Figure 29. Schematic of Boron Nitride nanotubes (BNNTs). Alternating B and N atoms are shown in blue and red. 55
  • Figure 30. Graphene layer structure schematic.  57
  • Figure 31. Illustrative procedure of the Scotch-tape based micromechanical cleavage of HOPG.    57
  • Figure 32. Graphene and its descendants: top right: graphene; top left: graphite = stacked graphene; bottom right: nanotube=rolled graphene; bottom left: fullerene=wrapped graphene.   59
  • Figure 33. Detonation Nanodiamond.     62
  • Figure 34. DND primary particles and properties.               62
  • Figure 35. Flake graphite.             67
  • Figure 36. Applications of flake graphite.               68
  • Figure 37. Graphite-based TIM products.               71
  • Figure 38. Structure of hexagonal boron nitride. 72
  • Figure 39. Classification of metamaterials based on functionalities.            75
  • Figure 40. Electromagnetic metamaterial.             76
  • Figure 41. Schematic of Electromagnetic Band Gap (EBG) structure.          77
  • Figure 42. Schematic of chiral metamaterials.      78
  • Figure 43. Nonlinear metamaterials- 400-nm thick nonlinear mirror that reflects frequency-doubled output using input light intensity as small as that of a laser pointer. 80
  • Figure 44. Schematic of self-healing polymers. Capsule based (a), vascular (b), and intrinsic (c) schemes for self-healing materials.  Red and blue colours indicate chemical species which react (purple) to heal damage.  81
  • Figure 45. Stages of self-healing mechanism.       82
  • Figure 46. Self-healing mechanism in vascular self-healing systems.          83
  • Figure 47. Comparison of self-healing systems.   84
  • Figure 48. Schematic of TIM operation in electronic devices.        88
  • Figure 49. Schematic of Thermal Management Materials in smartphone. 89
  • Figure 50. Wearable technology inventions.         90
  • Figure 51. Application of thermal interface materials in automobiles.       91
  • Figure 52. EV battery components including TIMs.             93
  • Figure 53. Battery pack with a cell-to-pack design and prismatic cells.       94
  • Figure 54. Cell-to-chassis battery pack.   95
  • Figure 55. TIMS in EV charging station.   96
  • Figure 56. Image of data center layout.   98
  • Figure 57. Application of TIMs in line card.            99
  • Figure 58. ADAS radar unit incorporating TIMs.   102
  • Figure 59. Coolzorb 5G. 104
  • Figure 60. TIMs in Base Band Unit (BBU).               106
  • Figure 61. Global revenues for TIMs 2018-2033, by market.          108
  • Figure 62. Boron Nitride Nanotubes products.    118
  • Figure 63. Transtherm® PCMs.   119
  • Figure 64. Carbice carbon nanotubes.     121
  • Figure 65.  Internal structure of carbon nanotube adhesive sheet.             137
  • Figure 66. Carbon nanotube adhesive sheet.       137
  • Figure 67. HI-FLOW Phase Change Materials.       145
  • Figure 68. Thermoelectric foil, consists of a sequence of semiconductor elements connected with conductive metal. At the top (in red) is the thermal interface. 156
  • Figure 69. Parker Chomerics THERM-A-GAP GEL. 166
  • Figure 70. Metamaterial structure used to control thermal emission.        167
  • Figure 71. Shinko Carbon Nanotube TIM product.              177
  • Figure 72. The Sixth Element graphene products.              182
  • Figure 73. Thermal conductive graphene film.     183
  • Figure 74. VB Series of TIMS from Zeon. 187

 

 

 

 

The Global Market for Thermal Interface Materials 2023-2033
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