Published March 2023 | 170 pages, 19 figures, 17 tables | Download table of contents
The effective transfer/removal of heat from a semiconductor device is crucial to ensure reliable operation and to enhance the lifetime of these components. The development of high-power and high-frequency electronic devices has greatly increased issues with excessive heat accumulation. There is therefore a significant requirement for effective thermal management materials to remove excess heat from electronic devices to ambient environment.
Thermal interface materials (TIMs) offer efficient heat dissipation to maintain proper functions and lifetime for these devices. TIMs are materials that are applied between the interfaces of two components (typically a heat generating device such as microprocessors, photonic integrated circuits, etc. and a heat dissipating device e.g. heat sink) to enhance the thermal coupling between these devices. A range of Carbon-based, metal/solder and filler-based TIMs are available both commercially and in the research and development (R&D) phase.
Report contents include:
- Analysis of recent commercial and R&D developments in thermal interface materials (TIMs).
- Market trends and drivers.
- Market map.
- Analysis of thermal interface materials (TIMs) including:
- Thermal Pads/Insulators.
- Thermally Conductive Adhesives.
- Thermal Compounds or Greases.
- Thermally Conductive Epoxy/Adhesives.
- Phase Change Materials.
- Metal-based TIMs.
- Carbon-based TIMs.
- Market analysis. Markets covered include:
- Consumer electronics.
- Electric Vehicles (EV) batteries.
- Data Center infrastructure.
- ADAS sensors.
- EMI shielding.
- 5G.
- Global market revenues for thermal interface materials (TIMs), historical and forecast to 2033.
- Profiles of 63 producers. Companies profiled include Arieca, Carbice Corporation, CondAlign, Fujipoly, Henkel, Indium Corporation, KULR Technology Group, Inc., Parker-Hannifin Corporation, Samyang Corporation and SHT Smart High-Tech AB.
1 INTRODUCTION 10
- 1.1 What are thermal interface materials (TIMs)? 10
- 1.2 Properties 11
- 1.2.1 Thermal conductivity 12
- 1.3 Comparative properties of TIMs 13
- 1.4 Advantages and disadvantages of TIMs, by type. 14
- 1.5 Prices 16
2 MATERIALS 18
- 2.1 Thermal Pads/Insulators 18
- 2.2 Thermally Conductive Adhesives 19
- 2.3 Thermal Compounds or Greases 21
- 2.4 Thermally Conductive Epoxy/Adhesives 22
- 2.5 Phase Change Materials 24
- 2.5.1 Properties of Phase Change Materials (PCMs) 24
- 2.5.2 Types 25
- 2.5.2.1 Organic/biobased phase change materials 27
- 2.5.2.1.1 Advantages and disadvantages 27
- 2.5.2.1.2 Paraffin wax 28
- 2.5.2.1.3 Non-Paraffins/Bio-based 28
- 2.5.2.2 Inorganic phase change materials 29
- 2.5.2.2.1 Salt hydrates 29
- 2.5.2.2.1.1 Advantages and disadvantages 30
- 2.5.2.2.2 Metal and metal alloy PCMs (High-temperature) 30
- 2.5.2.2.1 Salt hydrates 29
- 2.5.2.3 Eutectic mixtures 31
- 2.5.2.4 Encapsulation of PCMs 31
- 2.5.2.4.1 Macroencapsulation 32
- 2.5.2.4.2 Micro/nanoencapsulation 32
- 2.5.2.5 Nanomaterial phase change materials 32
- 2.5.2.1 Organic/biobased phase change materials 27
- 2.5.3 Thermal energy storage (TES) 33
- 2.5.3.1 Sensible heat storage 33
- 2.5.3.2 Latent heat storage 34
- 2.5.4 Application in TIMs 34
- 2.6 Metal-based TIMs 37
- 2.6.1 Solders and low melting temperature alloy TIMs 37
- 2.6.2 Liquid metals 38
- 2.6.3 Solid liquid hybrid (SLH) metals 40
- 2.7 Carbon-based TIMs 41
- 2.7.1 Multi-walled nanotubes (MWCNT) 42
- 2.7.1.1 Properties 43
- 2.7.1.2 Application as thermal interface materials 43
- 2.7.2 Single-walled carbon nanotubes (SWCNTs) 45
- 2.7.2.1 Properties 45
- 2.7.2.2 Application as thermal interface materials 46
- 2.7.3 Vertically aligned CNTs (VACNTs) 46
- 2.7.3.1 Properties 46
- 2.7.3.2 Application as thermal interface materials 47
- 2.7.4 BN nanotubes (BNNT) and nanosheets (BNNS). 48
- 2.7.4.1 Properties 48
- 2.7.4.2 Application as thermal interface materials 49
- 2.7.5 Graphene 50
- 2.7.5.1 Properties 50
- 2.7.5.2 Application as thermal interface materials 52
- 2.7.6 Nanodiamonds 52
- 2.7.6.1 Properties 52
- 2.7.6.2 Application as thermal interface materials 53
- 2.7.7 Graphite flakes 54
- 2.7.7.1 Properties 55
- 2.7.7.2 Application as thermal interface materials 55
- 2.7.1 Multi-walled nanotubes (MWCNT) 42
3 MARKETS FOR THERMAL INTERFACE MATERIALS (TIMs) 59
- 3.1 Consumer electronics 59
- 3.1.1 Overview 60
- 3.1.2 Applications 61
- 3.2 EV Batteries 64
- 3.2.1 Overview 64
- 3.2.2 Applications 65
- 3.3 Data Centers 69
- 3.3.1 Overview 69
- 3.3.2 Applications 72
- 3.4 ADAS Sensors 75
- 3.4.1 Overview 75
- 3.4.2 Applications 77
- 3.5 EMI shielding 84
- 3.5.1 Overview 84
- 3.5.2 Applications 8
- 3.6 5G 88
- 3.6.1 Overview 88
- 3.6.2 Applications 92
- 3.7 Global revenues for TIMs 2018-2033, by market 93
- 3.8 Future market prospects 96
4 COMPANY PROFILES 97 (63 company profiles)
5 RESEARCH METHODOLOGY 163
6 REFERENCES 164
List of Tables
- Table 1. Thermal Conductivity vs Thermal Resistance. 11
- Table 2. Thermal conductivities (κ) of common metallic, carbon, and ceramic fillers. 12
- Table 3. Thermal conductivity of common types of fillers.. 12
- Table 4. Basic physical properties of commercially available TIMs 12
- Table 5. Commercial TIMs and their properties. 13
- Table 6. Advantages and disadvantages of TIMs, by type. 14
- Table 7. Fabrication methods and thermal performances of advanced thermal interface materials. 22
- Table 8. Properties of PCMs. 24
- Table 9. PCM Types and properties. 26
- Table 10. Advantages and disadvantages of organic PCMs. 27
- Table 11. Advantages and disadvantages of organic PCM Fatty Acids. 29
- Table 12. Advantages and disadvantages of salt hydrates 30
- Table 13. Advantages and disadvantages of low melting point metals. 31
- Table 14. Advantages and disadvantages of eutectics. 31
- Table 15. Summary of thermal conductivities (κ) of carbon-based TIMs. 41
- Table 16. TIMS in EV batteries. 65
- Table 17. Global revenues for TIMs 2018-2033, by market. 94
List of Figures
- Figure 1. Schematic representation of working principle of a TIM. 10
- Figure 2. Thermal Pads die cut to a precise shape, ready for assembly. 18
- Figure 3. Thermally conductive liquid epoxy. 20
- Figure 4. Strip of 3M thermal conductive adhesive transfer tape 8810 kiss cut on a roll. 20
- Figure 5. Thermal resistance of silicone grease with different types of CNTs. 21
- Figure 6. Thermal Grease product. 22
- Figure 7. PCM mode of operation. 25
- Figure 8. Classification of PCMs. 26
- Figure 9. Phase-change materials in their original states. 26
- Figure 10. Thermal energy storage materials. 33
- Figure 11. Phase Change Material transient behaviour. 34
- Figure 12. Phase Change Material - die cut pads ready for assembly. 35
- Figure 13. SEM image of vertically aligned CNT. 46
- Figure 14. Schematic of Thermal Management Materials in smartphone. 61
- Figure 15. Coolzorb 5G. 85
- Figure 16. Schlegel EMI - Shielding Gaskets. 85
- Figure 17. Panasonic G-TIM. 87
- Figure 18. Global revenues for TIMs 2018-2033, by market. 95
- Figure 19. HI-FLOW Phase Change Materials. 133
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